Adhesion Reliability of Cu-Cr Alloy Films to Polyimide

MRS Proceedings ◽

10.1557/proc-428-67 ◽

1996 ◽

Vol 428 ◽

Author(s):

E. C. Ahn ◽

Jin Yu ◽

T. C. Oh ◽

I. S. Park

Keyword(s):

Peel Strength ◽

Alloy Layer ◽

Oxide Formation ◽

Polyimide Films ◽

Alloy Films ◽

Cr Content ◽

Sputter Deposited

AbstractCuCr alloys with varying Cr content were sputter deposited on polyimide films, and the metal/polyimide films were maintained under 350°C/N2 environment up to 10 hours for reliability measurements. Before exposure to 350°C, the peel strength increased proportionally with the Cr content in the alloy layer up to 17% and saturated. After exposure to 350°C, the peel strength dropped for all the specimens due to the formation of Cr2O3 at the metal/polyimide interface, and the effect was most drastic for the specimen with the lowest Cr content, which failed along the Cr-oxide/polyimide interface. Depletion of carbidic bonds at the metal/polyimide interface accompanied the oxide formation, and the result was quite devastating for the specimens with low Cr content in the alloy layer.

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Adhesion Strength of CuCr Alloy Films to Polyimide

MRS Proceedings ◽

10.1557/proc-390-55 ◽

1995 ◽

Vol 390 ◽

Cited By ~ 3

Author(s):

E. C. Ahn ◽

Jin Yu ◽

I. S. Park

Keyword(s):

Thin Films ◽

Adhesion Strength ◽

Hold Time ◽

Peel Strength ◽

Alloy Layer ◽

Polyimide Films ◽

Alloy Films ◽

Cr Content ◽

Sputter Deposited

ABSTRACTIn the present work, CuCr alloys with varying Cr content were sputter deposited on polyimide films, and the metal/polyimide thin films were maintained under 85° C/85%R.H. (T/H) conditions for the reliability measurements. Results showed that the peel strength without T/H treatments increased proportionally with the Cr content in the CuCr alloy layer(x) up to 17 at. %, and then saturated. Among the samples studied, the peel strength decreased with hold time under T/H conditions for all the cases, but most drastically for the sample with x=8.5. The very poor peel strength of that sample (x=8.5) was attributed to the occurrence of interfacial failures which were thought to take place along Cr-oxide/polyimide interfaces.

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An Assessment of Surface Treatments for Adhesion of Polyimide Thin Films

Polymers ◽

10.3390/polym13121955 ◽

2021 ◽

Vol 13 (12) ◽

pp. 1955

Author(s):

Marco Cen-Puc ◽

Andreas Schander ◽

Minerva G. Vargas Gleason ◽

Walter Lang

Keyword(s):

Flexible Electronics ◽

Oxygen Plasma ◽

Reactive Ion Etching ◽

Peel Test ◽

Scratch Test ◽

Peel Strength ◽

Surface Treatments ◽

Oxygen Plasma Treatment ◽

Polyimide Films ◽

Ion Etching

Polyimide films are currently of great interest for the development of flexible electronics and sensors. In order to ensure a proper integration with other materials and PI itself, some sort of surface modification is required. In this work, microwave oxygen plasma, reactive ion etching oxygen plasma, combination of KOH and HCl solutions, and polyethylenimine solution were used as surface treatments of PI films. Treatments were compared to find the best method to promote the adhesion between two polyimide films. The first selection of the treatment conditions for each method was based on changes in the contact angle with deionized water. Afterward, further qualitative (scratch test) and a quantitative adhesion assessment (peel test) were performed. Both scratch test and peel strength indicated that oxygen plasma treatment using reactive ion etching equipment is the most promising approach for promoting the adhesion between polyimide films.

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