Adhesion Strength of CuCr Alloy Films to Polyimide

1995 ◽  
Vol 390 ◽  
Author(s):  
E. C. Ahn ◽  
Jin Yu ◽  
I. S. Park
Keyword(s):  
Thin Films ◽  
Adhesion Strength ◽  
Hold Time ◽  
Peel Strength ◽  
Alloy Layer ◽  
Polyimide Films ◽  
Alloy Films ◽  
Cr Content ◽  
Sputter Deposited

ABSTRACTIn the present work, CuCr alloys with varying Cr content were sputter deposited on polyimide films, and the metal/polyimide thin films were maintained under 85° C/85%R.H. (T/H) conditions for the reliability measurements. Results showed that the peel strength without T/H treatments increased proportionally with the Cr content in the CuCr alloy layer(x) up to 17 at. %, and then saturated. Among the samples studied, the peel strength decreased with hold time under T/H conditions for all the cases, but most drastically for the sample with x=8.5. The very poor peel strength of that sample (x=8.5) was attributed to the occurrence of interfacial failures which were thought to take place along Cr-oxide/polyimide interfaces.

Adhesion Reliability of Cu-Cr Alloy Films to Polyimide

1996 ◽  
Vol 427 ◽  
Author(s):  
E. C. Ahn ◽  
Jin Yu ◽  
T. C. Oh ◽  
I. S. Park
Keyword(s):  
Peel Strength ◽  
Alloy Layer ◽  
Oxide Formation ◽  
Polyimide Films ◽  
Alloy Films ◽  
Cr Content ◽  
Sputter Deposited

AbstractCuCr alloys with varying Cr content were sputter deposited on polyimide films, and the metal/polyimide films were maintained under 350°C/N2 environment up to 10 hours for reliability measurements. Before exposure to 350°C, the peel strength increased proportionally with the Cr content in the alloy layer up to 17% and saturated. After exposure to 350°C, the peel strength dropped for all the specimens due to the formation of Cr2O3 at the metal/polyimide interface, and the effect was most drastic for the specimen with the lowest Cr content, which failed along the Cr-oxide/polyimide interface. Depletion of carbidic bonds at the metal/polyimide interface accompanied the oxide formation, and the result was quite devastating for the specimens with low Cr content in the alloy layer.

Adhesion Reliability of Cu-Cr Alloy Films to Polyimide

1996 ◽  
Vol 428 ◽  
Author(s):  
E. C. Ahn ◽  
Jin Yu ◽  
T. C. Oh ◽  
I. S. Park
Keyword(s):  
Peel Strength ◽  
Alloy Layer ◽  
Oxide Formation ◽  
Polyimide Films ◽  
Alloy Films ◽  
Cr Content ◽  
Sputter Deposited

AbstractCuCr alloys with varying Cr content were sputter deposited on polyimide films, and the metal/polyimide films were maintained under 350°C/N2 environment up to 10 hours for reliability measurements. Before exposure to 350°C, the peel strength increased proportionally with the Cr content in the alloy layer up to 17% and saturated. After exposure to 350°C, the peel strength dropped for all the specimens due to the formation of Cr2O3 at the metal/polyimide interface, and the effect was most drastic for the specimen with the lowest Cr content, which failed along the Cr-oxide/polyimide interface. Depletion of carbidic bonds at the metal/polyimide interface accompanied the oxide formation, and the result was quite devastating for the specimens with low Cr content in the alloy layer.

The Correlation of Adhesion Strength with Barrier Structure in Cu Metallization

2003 ◽  
Vol 766 ◽  
Author(s):  
A. Sekiguchi ◽  
J. Koike ◽  
K. Ueoka ◽  
J. Ye ◽  
H. Okamura ◽  
...  
Keyword(s):  
Thin Films ◽  
Adhesion Strength ◽  
Nitrogen Concentration ◽  
Scratch Test ◽  
Barrier Structure ◽  
Barrier Layers ◽  
Cu Metallization ◽  
Microstructure Observation ◽  
Sputter Deposited ◽  
Sulfur Containing

AbstractAdhesion strength in sputter-deposited Cu thin films on various types of barrier layers was investigated by scratch test. The barrier layers were Ta1-xNx with varied nitrogen concentration of 0, 0.2, 0.3, and 0.5. Microstructure observation by TEM indicated that each layer consists of mixed phases of β;-Ta, bcc-TaN0.1, hexagonal-TaN, and fcc-TaN, depending on the nitrogen concentration. A sulfur- containing amorphous phase was also present discontinuously at the Cu/barrier interfaces in all samples. Scratch test showed that delamination occurred at the Cu/barrier interface and that the overall adhesion strength increased with increasing the nitrogen concentration. A good correlation was found between the measured adhesion strength and the composing phases in the barrier layer.

Effects of Mechanical Properties of Metal Films on The Adhesion Strength of Cr/Polyimide Interfaces

1996 ◽  
Vol 436 ◽  
Author(s):  
Jin Won Choi ◽  
Tae Sung Oh
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Yield Strength ◽  
Peel Strength ◽  
Metal Films ◽  
Rf Plasma ◽  
Lower Yield ◽  
Lower Yield Strength ◽  
Sputter Deposited

AbstractEffects of mechanical properties of Cu/Cr metal films on the peel strength of Cr/PI interfaces have been studied. Cr and Cu thin films were successively sputter-deposited on in-situ RF plasma-treated polyimides, and 20 μm-thick Cu was electroplated. With increasing the yield strength of Cu/Cr films from 156 MPa to 325 MPa, peel strength of Cr/PMDA-ODA and Cr/BPDA-PDA were lowered from 75 g/mam to 57 g/mm and from 69 g/mm to 20 g/mm, respectively. With identical Cu/Cr metal films, lower peel strength was obtained on Cr/BPDA-PDA interfaces, compared to the values of Cr/PMDA-ODA. Peel strength was also decreased more pronouncedly on Cr/BPDA-PDA with increasing the yield strength of Cu/Cr metal films. With T/H (80°C/94% R.H.) exposure, however, peel strength was lowered much more pronouncedly on Cr/PMDA-ODA than on Cr/BPDA-PDA, especially for specimens with Cu/Cr metal films of lower yield strength.

Characterization of reactive phase formation in sputter-deposited Ni/Al multilayer thin films using TEM

1996 ◽  
Vol 54 ◽  
pp. 1000-1001
Author(s):  
G. Lucadamo ◽  
K. Barmak ◽  
C. Michaelsen
Keyword(s):  
Thin Films ◽  
Phase Formation ◽  
Dark Field ◽  
Nickel Layer ◽  
Multilayer Thin Films ◽  
Cross Sectional ◽  
Dark Field Imaging ◽  
Transmission Electron ◽  
Sputter Deposited ◽  
Constant Heating

The subject of reactive phase formation in multilayer thin films of varying periodicity has stimulated much research over the past few years. Recent studies have sought to understand the reactions that occur during the annealing of Ni/Al multilayers. Dark field imaging from transmission electron microscopy (TEM) studies in conjunction with in situ x-ray diffraction measurements, and calorimetry experiments (isothermal and constant heating rate), have yielded new insights into the sequence of phases that occur during annealing and the evolution of their microstructure.In this paper we report on reactive phase formation in sputter-deposited lNi:3Al multilayer thin films with a periodicity A (the combined thickness of an aluminum and nickel layer) from 2.5 to 320 nm. A cross-sectional TEM micrograph of an as-deposited film with a periodicity of 10 nm is shown in figure 1. This image shows diffraction contrast from the Ni grains and occasionally from the Al grains in their respective layers.

TEM studies of solid-state reactions in sputter-deposited Nb/Al multilayer thin films

1996 ◽  
Vol 54 ◽  
pp. 1020-1021
Author(s):  
F. Ma ◽  
S. Vivekanand ◽  
K. Barmak ◽  
C. Michaelsen
Keyword(s):  
Thin Films ◽  
Solid State ◽  
Stoichiometric Composition ◽  
Analytical Electron Microscopy ◽  
Grain Structure ◽  
Solid State Reactions ◽  
Multilayer Thin Films ◽  
X Ray Diffraction ◽  
X Ray ◽  
Sputter Deposited

Solid state reactions in sputter-deposited Nb/Al multilayer thin films have been studied by transmission and analytical electron microscopy (TEM/AEM), differential scanning calorimetry (DSC) and X-ray diffraction (XRD). The Nb/Al multilayer thin films for TEM studies were sputter-deposited on (1102)sapphire substrates. The periodicity of the films is in the range 10-500 nm. The overall composition of the films are 1/3, 2/1, and 3/1 Nb/Al, corresponding to the stoichiometric composition of the three intermetallic phases in this system.Figure 1 is a TEM micrograph of an as-deposited film with periodicity A = dA1 + dNb = 72 nm, where d's are layer thicknesses. The polycrystalline nature of the Al and Nb layers with their columnar grain structure is evident in the figure. Both Nb and Al layers exhibit crystallographic texture, with the electron diffraction pattern for this film showing stronger diffraction spots in the direction normal to the multilayer. The X-ray diffraction patterns of all films are dominated by the Al(l 11) and Nb(l 10) peaks and show a merging of these two peaks with decreasing periodicity.

Transformation and Deformation Behavior in Sputter-Deposited Ti-Ni-Cu Thin Films

1995 ◽  
Vol 05 (C8) ◽  
pp. C8-689-C8-694 ◽  
Author(s):  
T. Hashinaga ◽  
S. Miyazaki ◽  
T. Ueki ◽  
H. Horikawa
Keyword(s):  
Thin Films ◽  
Deformation Behavior ◽  
Sputter Deposited

Improvement of Adhesion Strength of Fluoropolymer Thin Films by Vapor Deposition Polymerization

2013 ◽  
Vol E96.C (3) ◽  
pp. 374-377 ◽  
Author(s):  
Kazuo SENDA ◽  
Tsuyoshi MATSUDA ◽  
Kuniaki TANAKA ◽  
Hiroaki USUI
Keyword(s):  
Thin Films ◽  
Adhesion Strength ◽  
Vapor Deposition

scholarly journals An Assessment of Surface Treatments for Adhesion of Polyimide Thin Films

Polymers ◽  
2021 ◽  
Vol 13 (12) ◽  
pp. 1955
Author(s):  
Marco Cen-Puc ◽  
Andreas Schander ◽  
Minerva G. Vargas Gleason ◽  
Walter Lang
Keyword(s):  
Flexible Electronics ◽  
Oxygen Plasma ◽  
Reactive Ion Etching ◽  
Peel Test ◽  
Scratch Test ◽  
Peel Strength ◽  
Surface Treatments ◽  
Oxygen Plasma Treatment ◽  
Polyimide Films ◽  
Ion Etching

Polyimide films are currently of great interest for the development of flexible electronics and sensors. In order to ensure a proper integration with other materials and PI itself, some sort of surface modification is required. In this work, microwave oxygen plasma, reactive ion etching oxygen plasma, combination of KOH and HCl solutions, and polyethylenimine solution were used as surface treatments of PI films. Treatments were compared to find the best method to promote the adhesion between two polyimide films. The first selection of the treatment conditions for each method was based on changes in the contact angle with deionized water. Afterward, further qualitative (scratch test) and a quantitative adhesion assessment (peel test) were performed. Both scratch test and peel strength indicated that oxygen plasma treatment using reactive ion etching equipment is the most promising approach for promoting the adhesion between polyimide films.

Sign in / Sign up

Export Citation Format

Share Document