Electromigration Characterization for Multilevel Metallizations using Textured AlCu
Keyword(s):
AbstractElectromigration lifetime dependence on crystallographic texture for AlCu interconnects is determined. It is found that enhancement of AlCu texture at <111> orientation improves EM endurance. But this beneficial effect is limited after a certain level of texture enhancement is reached. The effect of lifetime improvement is proved to result from a decrease in atomic diffusivity. Saturation of the lifetime improvement effect for highly textured AlCu indicates a change in the main diffusion mechanism for electromigration, possibly from the regular grain boundary diffusion to diffusion through edge dislocations.
2004 ◽
Vol 19
(12)
◽
pp. 3512-3520
◽
2005 ◽
Vol 237-240
◽
pp. 266-270
◽
1982 ◽
Vol 45
(5)
◽
pp. 823-833
◽
2006 ◽
Vol 258-260
◽
pp. 497-508
◽
1999 ◽
Vol 63
(5)
◽
pp. 589-592