Adhesion and Progressive Debonding of Polymer/Metal Interfaces: Effects of Temperature and Environment

1999 ◽  
Vol 563 ◽  
Author(s):  
Seung-Yeop Kook ◽  
Amol Kirtikar ◽  
Reinhold H. Dauskardt
Keyword(s):  
Fracture Energy ◽  
Interfacial Fracture ◽  
Fatigue Loading ◽  
Cyclic Fatigue ◽  
Rate Theory ◽  
Metal Interface ◽  
Polymer Metal ◽  
Interfacial Fracture Energy ◽  
Effects Of Temperature ◽  
Novolac Epoxy

AbstractThe interfacial fracture properties of a representative polymer/metal interface commonly found in microelectronic applications are examined. The double cantilever beam (DCB) configuration was used to investigate the effects of environmental variables on interfacial adhesion and progressive delamination under monotonic and cyclic fatigue loading conditions. The steady-state interfacial fracture energy, Gss, taken from the plateau of the R-curve, of a representative silica-filled Phenol-Novolac epoxy on a Nielectroplated Cu substrate showed little sensitivity to the presence of moisture. On the other hand, both the initiation interfacial fracture energy, Gi, and the entire progressive debond curve under fatigue loading were remarkably sensitive to moisture and temperature, respectively. Debonding is modeled in terms of interface structure, chemistry using chemical reaction rate theory, and relaxation process at the debond tip. The activation energy for stage I debond growth is found to be 140 kJ/mol and 63 kJ/mol for stage II for the current polymer/metal interface.

Adhesion and Reliability of Polymer/Inorganic Interfaces

1998 ◽  
Vol 120 (4) ◽  
pp. 328-335 ◽  
Author(s):  
S.-Y. Kook ◽  
J. M. Snodgrass ◽  
A. Kirtikar ◽  
R. H. Dauskardt
Keyword(s):  
Fracture Resistance ◽  
Strain Energy Release ◽  
Interfacial Fracture ◽  
Fatigue Loading ◽  
Cyclic Fatigue ◽  
Interface Fracture ◽  
Fracture Toughness Test ◽  
Adhesion Promoter ◽  
Polymer Metal ◽  
Microelectronic Components

The reliability of microelectronic components is profoundly influenced by the interfacial fracture resistance (adhesion) and associated progressive debonding behavior. In this study we examine the interfacial fracture properties of representative polymer interfaces commonly found in microelectronic applications. Specifically, interface fracture mechanics techniques are described to characterize adhesion and progressive bebonding behavior of a polymer/metal interface under monotonic and cyclic fatigue loading conditions. Cyclic fatigue debond-growth rates were measured from ~10−11 to 10−6 m/cycle and found to display a power–law dependence on the applied strain energy release rate range, ΔG. Fracture toughness test results show that the interfaces typically exhibit resistance-curve behavior, with a plateau interface fracture resistance, Gss, strongly dependent on the interface morphology and the thickness of the polymer layer. The effect of a chemical adhesion promoter on the fracture energy of a polymer/silicon interface was also characterized. Micromechanisms controlling interfacial adhesion and progressive debonding are discussed in terms of the prevailing deformation mechanisms and related to interface structure and morphology.

Estimation of the Interfacial Fracture Energy of Metal/Polymer System in Microelectronic Packaging

2001 ◽  
Vol 682 ◽  
Author(s):  
J.Y. Song ◽  
Jin Yu
Keyword(s):  
Fracture Energy ◽  
Power Density ◽  
Polymer System ◽  
Peel Test ◽  
Interfacial Fracture ◽  
Peel Strength ◽  
Rf Plasma ◽  
Plasma Power ◽  
Interfacial Fracture Energy ◽  
Elastoplastic Beam

ABSTRACTThe interfacial fracture energies of flexible Cu/Cr/Polyimide system were deduced from the T peel test. The T peel strength and peel angle were strongly affected by the metal thickness and the biased rf plasma power density of the polyimide pretreatment. The plastic bending works of metal and polyimide dissipated during peel test were estimated from the direct measurement of maximum root curvatures using the elastoplastic beam analysis. The interfacial fracture energy between Cr and polyimide increased with the rf plasma power density and saturated, but was pretty much independent of the metal film thickness and the peel angle.

An Engineering Model for Moisture Degradation of Polymer/Metal Interfacial Fracture Toughness

2005 ◽  
Author(s):  
Timothy P. Ferguson ◽  
Jianmin Qu
Keyword(s):  
Fracture Toughness ◽  
Fracture Mechanics ◽  
Interfacial Fracture ◽  
Interfacial Fracture Toughness ◽  
Engineering Model ◽  
Metal Interface ◽  
Moisture Concentration ◽  
Interfacial Fracture Mechanics ◽  
Polymer Metal

Based on interfacial fracture mechanics and the hydrophobicity of the interface, en engineering model was developed in this paper. Using this model, one can predicted the degradation of interfacial fracture toughness of a polymer/metal interface once the moisture concentration near the interface is known.

Analytical Studies on Mixed-Mode Debonding along the FRP–Concrete Interface in the Peeling Test

2011 ◽  
Vol 268-270 ◽  
pp. 247-251 ◽  
Author(s):  
Hong Chang Qu ◽  
Sheng Li Zhang ◽  
Ling Ling Chen
Keyword(s):  
Fracture Energy ◽  
Interfacial Fracture ◽  
Opening Displacement ◽  
Flexural Strengthening ◽  
Linear Elastic ◽  
Peeling Test ◽  
Interfacial Fracture Energy ◽  
Set Up ◽  
Concrete Interface ◽  
Frp Sheet

The bonding of fiber reinforced polymer (FRP) strips and plates to the concrete structures has been found to be an effective technique for flexural strengthening. The FRP is then under both pulling and peeling forces, resulting in a combination of shear sliding and opening displacement along the FRP/concrete interface. A novel experimental set-up is studied that a peeling load is applied on the FRP sheet by a circular rod placed into the central notch of the beam. Based on the linear-elastic fracture mechanics approach, a theoretical analysis is conducted on specimens representing the peeling behavior. From the numerical analysis, the load–displacement curves, load–stiffness of FRP sheet curves, and load–fracture energy curves affected by different variables are discussed. The peel load is related to the FRP sheet stiffness and to the interfacial fracture energy. Therefore, only two material parameters, the interfacial fracture energy of FRP–concrete interface and stiffness of FRP sheets, are necessary to represent the interfacial fracture behavior. The theoretical load–deflection curves of specimens agree well with the corresponding experimental results in the literatures.

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