scholarly journals Nonequilibrium Interface Kinetics During Rapid Solidification

1986 ◽  
Vol 74 ◽  
Author(s):  
Michael J. Aziz

AbstractThe deviations from local equilibrium at a rapidly moving solid-liquid interface are well documented. The fraction of solute atoms in the liquid at the interface that joins the crystal during rapid solidification approaches unity and the interface temperature drops. Experimental and theoretical work on impurity incorporation and interfacial undercooling is reviewed. Past and future experiments to test the theories are discussed.

1986 ◽  
Vol 80 ◽  
Author(s):  
Michael J. Aziz

AbstratThe deviations from local equilibrium at a rapidly moving solid-liquid interface are well documented. The fraction of solute atoms in the liquid at the interface that joins the crystal during rapid solidification approaches unity and the interface temperature drops. Experimental and theoretical work on impurity incorporation and interfacial undercooling is reviewed. Past and future experiments to test the theories are discussed.


2021 ◽  
Vol 11 (8) ◽  
pp. 3379
Author(s):  
Hyung Ju Lee ◽  
Chan Ho Jeong ◽  
Dae Yun Kim ◽  
Chang Kyoung Choi ◽  
Seong Hyuk Lee

The present study aims to measure the solid–liquid interface temperature of an evaporating droplet on a heated surface using a thermoresponsive polymer. Poly(N-isopropylacrylamide) (pNIPAM) was used owing to its sensitive optical and mechanical properties to the temperature. We also measured the refractive index variation of the pNIPAM solution by using the surface plasmon resonance imaging (SPRi). In particular, the present study proposed a new method to measure the solid–liquid interface temperature using the correlation among reflectance, refractive index, and temperature. It was found that the reflectance of a pNIPAM solution decreased after the droplet deposition. The solid–liquid interface temperature, estimated from the reflectance, showed a lower value at the center of the droplet, and it gradually increased along the radial direction. The lowest temperature at the contact line region is present because of the maximum evaporative cooling. Moreover, the solid–liquid interface temperature deviation increased with the surface temperature, which means solid–liquid interface temperature should be considered at high temperature to predict the evaporation flux of the droplet accurately.


2007 ◽  
Vol 26-28 ◽  
pp. 957-962 ◽  
Author(s):  
Bo Wei Shan ◽  
Xin Lin ◽  
Lei Wei ◽  
Wei Dong Huang

A modified cellular automaton model was proposed to simulate the dendrite growth of alloy. Different from previous models, this model used neither an analytical equation(such as KGT model) nor an interface solute gradient equation to solve the velocity of solid-liquid interface, but used the interface solute and energy conservation and thermodynamic equilibrium condition to describe the solid/liquid interface growth kinetics process. In present model, once the temperature field and solute field were solved by finite different method in the entire domain, the material thermodynamic properties can be substituted into four algebraic equations to easily determine the variation of solid fraction, interface temperature and solute concentration, instead of calculating interface moving velocity. As a result, the complexity of the calculation can be largely reduced. The simulated dendrite growth was in a good agreement with the Lipton–Glicksman–Kurz (LGK) model for free dendritic growth in undercooled melts.


1982 ◽  
Vol 13 ◽  
Author(s):  
R. J. Schaefer ◽  
R. Mehrabian

ABSTRACTThe development of predictive models for rapid surface melting and resolidification requires coupling of realistic heat flow models to emerging theories of rapid solidification processing. Attainment of unique microstructures and phases,for example through plane-front solidification and solute trapping, can be correlated to solid/liquid interface velocity,temperature and temperature gradients, and to theories of morphological stability. However, there are important limitations on achievable solid/liquid interface velocity depending upon the heating mode and heat flux distribution,melt thickness and location of the interface within the molten zone.An overview is given of the emerging guidelines for prediction and control of rapid solidification conditions and microstructures. Homogenization of the liquid by convection and diffusion is also discussed. Electron beam surface melting of alloy substrates is used as an example of these processes.


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