scholarly journals Large-Scale Integrated Circuit Design Based on a Nb Nine-Layer Structure for Reconfigurable Data-Path Processors

2014 ◽  
Vol E97.C (3) ◽  
pp. 157-165 ◽  
Author(s):  
Akira FUJIMAKI ◽  
Masamitsu TANAKA ◽  
Ryo KASAGI ◽  
Katsumi TAKAGI ◽  
Masakazu OKADA ◽  
...  
Keyword(s):  
Circuit Design ◽  
Integrated Circuit ◽  
Large Scale ◽  
Layer Structure ◽  
Data Path ◽  
Integrated Circuit Design

The state of large-scale integrated circuit design automation

Cybernetics ◽  
1977 ◽  
Vol 12 (6) ◽  
pp. 857-861
Author(s):  
V. M. Glushkov ◽  
V. P. Derkach ◽  
G. F. Kiyashko
Keyword(s):  
Circuit Design ◽  
Integrated Circuit ◽  
Design Automation ◽  
Large Scale ◽  
The State ◽  
Integrated Circuit Design

A Case Study of Defects Due to Process-Design Interaction in Nano Scale Technology

2007 ◽  
Author(s):  
Hung-Sung Lin ◽  
Ying-Chin Hou ◽  
Juimei Fu ◽  
Mong-Sheng Wu ◽  
Vincent Huang ◽  
...  
Keyword(s):  
Liquid Crystal ◽  
Circuit Design ◽  
Process Design ◽  
Integrated Circuit ◽  
Photon Emission ◽  
Integrated Circuit Design ◽  
Nano Scale ◽  
Leakage Path ◽  
Related Defect

Abstract The difficulties in identifying the precise defect location and real leakage path is increasing as the integrated circuit design and process have become more and more complicated in nano scale technology node. Most of the defects causing chip leakage are detectable with only one of the FA (Failure Analysis) tools such as LCD (Liquid Crystal Detection) or PEM (Photon Emission Microscope). However, due to marginality of process-design interaction some defects are often not detectable with only one FA tool [1][2]. This paper present an example of an abnormal power consumption process-design interaction related defect which could only be detected with more advanced FA tools.

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