scholarly journals OVERVIEW OF ELECTRONIC TEST EQUIPMENT FOR DEFROSTING AND HEATING OF CRYOPRESERVED BLOOD PRODUCTS

2021 ◽  
pp. 49-55
Author(s):  
A.E. Zhdanov ◽  
L.G. Dorosinskiy ◽  
V.I. Borisov ◽  
K.E. Negodyaev ◽  
L. Evdochim
Keyword(s):  
Test Equipment ◽  
Blood Products

GB Virus C/Hepatitis G Virus Isolates in Japanese Haemophiliacs and their Origins

1998 ◽  
Vol 80 (08) ◽  
pp. 242-245 ◽  
Author(s):  
Yoshihide Fukuda ◽  
Tetsuo Hayakawa ◽  
Junki Takamatsu ◽  
Hidehiko Saito ◽  
Hiroaki Okamoto ◽  
...  
Keyword(s):  
Sequence Similarity ◽  
West African ◽  
Blood Products ◽  
Hepatitis G Virus ◽  
Gb Virus C ◽  
Route Of Transmission ◽  
Polymerase Chain ◽  
Hepatitis G ◽  
Virus C ◽  
Virus Isolates

SummaryJapanese haemophiliacs have been at high risk for infection with parenterally-transmissible viruses through the use of blood products, especially imported ones. Recently, novel transfusion-transmissible virus, GB virus C (GBV-C)/hepatitis G virus (HGV) were isolated. We investigated the origin and route of transmission of GBV-C/HGV isolates in haemophiliacs in Japan. GBV-C/HGV RNA was measured by nested reverse transcription polymerase chain reaction in 91 Japanese haemophiliacs. Phylogenetic analysis and genotypic grouping of GBV-C/HGV isolates in Japanese haemophiliacs were performed based on sequences in the 5’ untranslated region, and the characteristics were compared with those of reported isolates. GBV-C/HGV infection was present in 19 of 91 haemophiliacs (20.9%). Sequence analysis showed that 15 of the 19 isolates (78.9%) showed sequence similarity to a group in which mainly West African isolates have been reported. The other 4 isolates (21.1%) showed sequence similarity to Asian isolates. None of the GBV-C/HGV isolates showed sequences similar to those generally found in isolates from USA and Europe. The majority of GBV-C/HGV isolates found in Japanese haemophiliacs who are considered to have been infected by imported blood products were similar to those detected in West Africa.

All About Test Equipment

2008 ◽  
Vol 42 (5) ◽  
pp. 367-368
Author(s):  
Jonathan Hill
Keyword(s):  
Test Equipment

An Overview of Risk-Based EEE Counterfeit Part Detection Based on SAE AS6171

2018 ◽  
Author(s):  
Michael H. Azarian
Keyword(s):  
Risk Assessment ◽  
Multiple Solutions ◽  
Test Equipment ◽  
Assessment Methodology ◽  
Test Plan ◽  
Specific Test ◽  
Risk Assessment Methodology

Abstract As counterfeiting techniques and processes grow in sophistication, the methods needed to detect these parts must keep pace. This has the unfortunate effect of raising the costs associated with managing this risk. In order to ensure that the resources devoted to counterfeit detection are commensurate with the potential effects and likelihood of counterfeit part usage in a particular application, a risk based methodology has been adopted for testing of electrical, electronic, and electromechanical (EEE) parts by the SAE AS6171 set of standards. This paper provides an overview of the risk assessment methodology employed within AS6171 to determine the testing that should be utilized to manage the risk associated with the use of a part. A scenario is constructed as a case study to illustrate how multiple solutions exist to address the risk for a particular situation, and the choice of any specific test plan can be made on the basis of practical considerations, such as cost, time, or the availability of particular test equipment.

An Alternative to High-Temperature and Acid/Solvent-Based Methods for Removing Integrated Circuits from Ceramic or Other Problem Substrates

2005 ◽  
Author(s):  
Carl M. Nail
Keyword(s):  
High Temperature ◽  
Integrated Circuits ◽  
Success Rate ◽  
Mechanical Damage ◽  
Test Equipment ◽  
High Success Rate ◽  
Automated Test Equipment ◽  
Removal Method ◽  
Automated Test ◽  
Conventional Methods

Abstract Dice must often be removed from their packages and reassembled into more suitable packages for them to be tested in automated test equipment (ATE). Removing bare dice from their substrates using conventional methods poses risks for chemical, thermal, and/or mechanical damage. A new removal method is offered using metallography-based and parallel polishing-based techniques to remove the substrate while exposing the die to minimized risk for damage. This method has been tested and found to have a high success rate once the techniques are learned.

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