scholarly journals Analysis of the influence of dispersion of metamaterials in a cylindrical Luneberg lens with extended focus

2021 ◽  
Vol 23 (4) ◽  
pp. 48-55
Author(s):  
Yuri G. Pasternak ◽  
Evgeny A. Rogozin ◽  
Ruslan E. Rogozin ◽  
Sergei M. Fedorov
Keyword(s):  
Printed Circuit Boards ◽  
Focal Length ◽  
Antenna System ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Directional Characteristics ◽  
Linearly Polarized ◽  
Lens Surface ◽  
Wide Sector ◽  
Luneberg Lens

Cylindrical Lunebeg lenses allow azimuthal scanning in a wide sector of angles. The article discusses a cylindrical Luneberg lens with an out-of-focus parallel printed circuit boards made of thin fiberglass (FR-4) with an etched H-shaped metamaterial structure. The distribution of the electric field in the azimuthal plane is shown when a linearly polarized plane wave is incident on the lens surface parallel to the printed circuit boards. The dependence of the focal length on the frequency is shown. Conclusions are drawn about the effect of dispersion on the focal length. To clarify the value of the focal length, thedirectional characteristics of the antenna system are considered when the focal length is changed. Directional characteristics are investigated when the feed is rotated in the azimuthal plane. The results presented in the article are planned to be used to create broadband Luneberg lenses from metamaterials.

Slit Effect of Common Ground Patterns in Affecting Cross-Talk Noise between Two Parallel Signal Traces on Printed Circuit Boards

2008 ◽  
Vol 128 (11) ◽  
pp. 657-662 ◽  
Author(s):  
Tsuyoshi Maeno ◽  
Yukihiko Sakurai ◽  
Takanori Unou ◽  
Kouji Ichikawa ◽  
Osamu Fujiwara
Keyword(s):  
Cross Talk ◽  
Printed Circuit Boards ◽  
Common Ground ◽  
Circuit Boards ◽  
Printed Circuit

Influence of Component Mounting Density on Oscillating Characteristics of Multilayer Printed Circuit Boards

2018 ◽  
Vol 23 (2) ◽  
pp. 141-148
Author(s):  
S.Sh. Rekhviashvili ◽  
◽  
M.O. Mamchuev ◽  
V.V. Narozhnov ◽  
M.M. Oshkhunov ◽  
...  
Keyword(s):  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Oscillating Characteristics

Noise properties of thin-film Ni-P resistors embedded in printed circuit boards

2013 ◽  
Vol 61 (3) ◽  
pp. 731-735
Author(s):  
A.W. Stadler ◽  
Z. Zawiślak ◽  
W. Stęplewski ◽  
A. Dziedzic
Keyword(s):  
Thin Film ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Noise Component ◽  
Printed Circuit ◽  
Resistance Bridge ◽  
Different Types ◽  
Signal Path ◽  
Resistance Fluctuations ◽  
Made In

Abstract. Noise studies of planar thin-film Ni-P resistors made in/on Printed Circuit Boards, both covered with two different types of cladding or uncladded have been described. The resistors have been made of the resistive-conductive-material (Ohmega-Ply©) of 100 Ώ/sq. Noise of the selected pairs of samples has been measured in the DC resistance bridge with a transformer as the first stage in a signal path. 1/f noise caused by resistance fluctuations has been found to be the main noise component. Parameters describing noise properties of the resistors have been calculated and then compared with the parameters of other previously studied thin- and thick-film resistive materials.

LEACHING OF METALS FROM WASTE PRINTED CIRCUIT BOARDS (WPCBs) USING SULFURIC AND NITRIC ACIDS

2014 ◽  
Vol 13 (10) ◽  
pp. 2601-2607 ◽  
Author(s):  
Jae-chun Lee ◽  
Manoj Kumar ◽  
Min-Seuk Kim ◽  
Jinki Jeong ◽  
Kyoungkeun Yoo
Keyword(s):  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Waste Printed Circuit Boards

Conductive Filament Formation in Printed Circuit Boards – Effects of Reflow Conditions and Flame Retardants

2009 ◽  
Author(s):  
Bhanu Sood ◽  
Michael Pecht
Keyword(s):  
Flame Retardants ◽  
Printed Circuit Boards ◽  
Electrochemical Process ◽  
Lead Free ◽  
Circuit Boards ◽  
Filament Formation ◽  
Conductive Filament ◽  
Printed Circuit ◽  
Free Solder ◽  
Halogen Free

Abstract Failures in printed circuit boards account for a significant percentage of field returns in electronic products and systems. Conductive filament formation is an electrochemical process that requires the transport of a metal through or across a nonmetallic medium under the influence of an applied electric field. With the advent of lead-free initiatives, boards are being exposed to higher temperatures during lead-free solder processing. This can weaken the glass-fiber bonding, thus enhancing conductive filament formation. The effect of the inclusion of halogen-free flame retardants on conductive filament formation in printed circuit boards is also not completely understood. Previous studies, along with analysis and examinations conducted on printed circuit boards with failure sites that were due to conductive filament formation, have shown that the conductive path is typically formed along the delaminated fiber glass and epoxy resin interfaces. This paper is a result of a year-long study on the effects of reflow temperatures, halogen-free flame retardants, glass reinforcement weave style, and conductor spacing on times to failure due to conductive filament formation.

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