THE RESEARCH OF POSSIBILITY OF GALVANIC CORROSION IN BRAZED CONNECTIONS USED IN AVIATION ENGINE CONSTRUCTION

Author(s):  
E.N. Kablov ◽  
◽  
A.E. Kutyrev ◽  
A.I. Vdovin ◽  
I.A. Kozlov ◽  
...  

The article presents the results of researche of galvanic corrosion possibility of brazed connections of steels 13Сr11Ni2W2MoV and 12Cr18Ni10Тi with use of the solders VPr4 and VPr50, which are used in design of aviation engineering engines. The research was carried out by electrochemical methods. Corrosion currents’ density and contact pairs’ potentials in chloride solutions have been determined. It is determined that 13Сr11Ni2W2MoV steel can be exposed to galvanic corrosion in a place of brazed connection. Thus the greatest danger to it is represented by VPr4 solder. The mechanism of corrosion of 13Сr11Ni2W2MoV steel in neutral environments has been examined and recommendations about its protection against galvanic corrosion are made.

CORROSION ◽  
2003 ◽  
Vol 59 (2) ◽  
pp. 121-129 ◽  
Author(s):  
J.-G. Kim ◽  
Y.-S. Choi ◽  
H.-D. Lee ◽  
W.-S. Chung

CORROSION ◽  
1982 ◽  
Vol 38 (5) ◽  
pp. 265-273 ◽  
Author(s):  
Donald R. Knittel ◽  
Michael A. Maguire ◽  
Arturo Bronson ◽  
Jong-Sheng Chen

Author(s):  
N.J. Tao ◽  
J.A. DeRose ◽  
P.I. Oden ◽  
S.M. Lindsay

Clemmer and Beebe have pointed out that surface structures on graphite substrates can be misinterpreted as biopolymer images in STM experiments. We have been using electrochemical methods to react DNA fragments onto gold electrodes for STM and AFM imaging. The adsorbates produced in this way are only homogeneous in special circumstances. Searching an inhomogeneous substrate for ‘desired’ images limits the value of the data. Here, we report on a reversible method for imaging adsorbates. The molecules can be lifted onto and off the substrate during imaging. This leaves no doubt about the validity or statistical significance of the images. Furthermore, environmental effects (such as changes in electrolyte or surface charge) can be investigated easily.


1996 ◽  
Vol 451 ◽  
Author(s):  
Gerald S. Frankel

ABSTRACTCorrosion of thin film structures commonly used in electronic and magnetic devices is discussed. Typical failure modes are presented, and galvanic corrosion is discussed in some detail since it is one common problem with such devices. A graphical explanation for the determination of the ohmic potential drop during galvanic corrosion is presented. The corrosion problem of thin film disks is shown to have changed during the past ten years owing to changes in disk structure. The corrosion susceptibility of two antiferromagnetic alloys used for exchange coupling to soft magnetic layers is discussed.


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