scholarly journals PCB Assembly Process Optimization based on Constraint Model

2014 ◽  
Vol 7 (1) ◽  
pp. 105-110
Author(s):  
Xuan Du ◽  
Yi Zhang ◽  
Lili Sun
Keyword(s):  
Process Optimization ◽  
Assembly Process ◽  
Pcb Assembly ◽  
Constraint Model

Material Handling and Assembly Process Optimization using Value Stream Mapping

2017 ◽  
Vol 6 (1) ◽  
pp. 59
Author(s):  
Daniel Derrell Forest ◽  
G.H. Massiha
Keyword(s):  
Process Optimization ◽  
Continuous Improvement ◽  
Lean Manufacturing ◽  
Material Handling ◽  
Design Method ◽  
Added Value ◽  
Value Stream Mapping ◽  
Assembly Process ◽  
Workplace Design ◽  
Value Stream

<span>The purpose of this project is to evaluate and optimize an assembly process for ergonomic and productivity considerations. Companies use lean manufacturing as a method for continuous improvement in order to increase throughput and for to reallocate resources for more important tasks. For this project, value stream mapping (VSM) was used to evaluate, analyze, and improve the ergonomic factors of an assembly process and to increasing throughput. With the use of VSM, researchers are able to see the areas of added value, non-added value, and bottlenecks. This project illustrates the implementation of VSM for the minimization of waste, by using the design method to restructure the process of assembly. The results show drastic improvement in assembly time and ergonomic workplace design, while providing a platform for a continuous improvement system.</span>

Case Study: Radial Cracks in a Rigid-Flex Assembly

2011 ◽  
Vol 2011 (1) ◽  
pp. 000232-000240 ◽  
Author(s):  
Christopher Matsuoka
Keyword(s):  
Visual Inspection ◽  
Development Project ◽  
Implantable Devices ◽  
Assembly Process ◽  
Pcb Assembly ◽  
Root Cause ◽  
Unusual Phenomenon ◽  
Radial Cracks

Crane Aerospace & Electronics in Redmond, WA, develops, qualifies, and manufactures a variety of implantable devices for leading medical companies. An unusual phenomenon was discovered during a routine visual inspection step on a recent development project. On the flexible portion of a rigid-flex PCB assembly, visible radial cracks were found on the annular rings of ENIG-plated thru-holes. The thru-holes remain unpopulated during Crane’s assembly process, and the defect was primarily seen on the top side of the PCB. Additionally, the occurrences of these cracks vary in frequency and severity. This paper describes the testing and analysis Crane performed in order to determine the root cause of this defect.

Printed Circuit Board Assembly Optimization Based on Genetic Algorithm with Model Constraints of Polychromatic Sets

2011 ◽  
Vol 58-60 ◽  
pp. 1938-1943
Author(s):  
Xuan Du ◽  
Zi Fan Fang ◽  
Yi Zhang
Keyword(s):  
Genetic Algorithm ◽  
Optimization Problem ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Simple Modification ◽  
Printed Circuit ◽  
Pcb Assembly ◽  
Fitness Value ◽  
Constraint Model ◽  
Polychromatic Sets Theory

Aimed at the optimization problem of printed circuit board (PCB) assembly workshop (WPCBA) with multiple assembly machines and tasks, combined with polychromatic sets and genetic algorithm (GA), an optimization method is presented to optimize PCB assignment, component allocation and PCB assembly sequence problem simultaneously. On the basis of the polychromatic sets theory, numerical contour matrix is presented to describe the constraint of machine and operation sequence for WPCBA optimization problem and formulate the constraint model. Constraint model guarantees that GA searches optimal result in the effective solution space and simplify the calculation of fitness value. Moreover, if the machine and assembly task are changed, through a simple modification of constraint model, the WPCBA problem would be optimized conveniently. Computational results indicate that the solution efficiency of WPCBA optimization problem can be improved significantly and the dynamical optimization can be implemented.

Seamless transition from simulation to experiment in micro-optics assembly process optimization

2021 ◽  
Author(s):  
Andras Cserteg ◽  
Kornel Jahn ◽  
Abel Mihaly Nagy ◽  
Kazuya Nagashima ◽  
Yozo Ishikawa
Keyword(s):  
Process Optimization ◽  
Assembly Process ◽  
Seamless Transition ◽  
Micro Optics

Optimization of Printed Circuit Board Assignment and Component Allocation in Assembly Line

2010 ◽  
Vol 97-101 ◽  
pp. 2455-2458
Author(s):  
Xuan Du ◽  
Zong Bin Li ◽  
Guo Hui Zhang
Keyword(s):  
Assembly Line ◽  
Printed Circuit Board ◽  
Solution Space ◽  
Circuit Board ◽  
Printed Circuit ◽  
Pcb Assembly ◽  
Fitness Value ◽  
Component Allocation ◽  
Constraint Model ◽  
Polychromatic Sets Theory

The assembly optimization problem of multiple printed circuit board (PCB) tasks is analyzed, and an optimal model is formulated to balance the workload in decoupled PCB assembly line. Combined with polychromatic sets and genetic algorithm (GA), an integrated methodology is developed to solve the PCB assignment and component allocation simultaneously. Based on polychromatic sets theory, a 3D numerical contour matrix is presented to describe the characters of PCB, component and machine and the constraint of machine and process, and a constraint model is formulated. Constraint model guarantees that GA searches in the available solution space and simplify the calculation of fitness value and GA operation. Computational results indicate that the approach presented in this paper is useful and effective.

A Study of Solder Paste Rheology for The Alternative Assembly and Reflow Technology (AART) Process

1998 ◽  
Vol 515 ◽  
Author(s):  
S.T. Murthy ◽  
D. Manessis ◽  
K. Srihari ◽  
G.R. Westby
Keyword(s):  
Yield Stress ◽  
Printed Circuit Board ◽  
Shear Thinning ◽  
Circuit Board ◽  
Print Quality ◽  
Solder Paste ◽  
Assembly Process ◽  
Pcb Assembly ◽  
Plated Through Hole ◽  
Through Hole

ABSTRACTSolder paste performance related properties such as stencil print quality, viscosity, thixotropy, and slump resistance are of great importance in the pre-reflow stages of the electronics assembly process. This paper focuses on the study of the rheological behavior of solder paste and its correlation to process performance during the various steps of the Alternative Assembly and Reflow Technology (AART) process. This technology aims to integrate the Printed Circuit board (PCB) assembly process for both through hole and surface mount components. Four solder pastes were considered in this study and their rheological characteristics were identified through flow and oscillation tests. The oscillation tests provided the linear viscoelastic characteristics of solder paste whereas the flow tests revealed information on the yield stress as well as the degree of shear-thinning and thixotropy of the solder paste. Pastes with high elastic properties and yield stress exhibited good hot slump resistance. Furthermore, extensive shear thinning of the paste facilitated the filling of the Plated-Through-Hole (PTH) sites. Recommendations are provided for tailoring the properties of a solder paste to meet the needs of the AART process.

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