scholarly journals Study on the Abrasive Retention Capacity on the Surface of Electroplated Diamond Wire Saw

2021 ◽  
Author(s):  
Jintao Zheng ◽  
Qian Xie ◽  
Peiqi Ge ◽  
Jianfeng Meng ◽  
Wenbo Bi
Keyword(s):  
Finite Element ◽  
Compressive Stress ◽  
Research Work ◽  
Residual Compressive Stress ◽  
Crystal Silicon ◽  
Retention Capacity ◽  
Diamond Wire ◽  
Wire Saw ◽  
Diamond Wire Saw ◽  
Diamond Abrasive

Abstract The quality and efficiency of slicing will be reduced if the abrasives on the surface of diamond wire saw shed in sawing. Generally, the diamond abrasives are held on the surface of electroplated diamond wire saw by a nickel-plated layer, and the abrasive retention state, reflecting abrasive shedding, can be characterized by the plastic deformation of the plating layer at the interface between the nickel-plated layer and the abrasive. To gain an in-depth understanding of the abrasive shedding mechanism, a finite element model of the double-cone diamond abrasive embedded in a nickel-plated layer was established in this paper to research the effects of the residual compressive stress and hardness of the nickel-plated layer as well as the protrusion height of the diamond abrasive on the abrasive retention capacity. The results show that the presence of the residual compressive stress in the nickel-plated layer resulted in the decrease of the abrasive retention capacity. And the higher hardness of the nickel-plated layer could enhance its abrasive retention capacity. Furthermore, the depth of the diamond abrasive inside the nickel-plated layer was decreased with the increase of its protrusion height, which would reduce the abrasive retention capacity. Based on the results of the finite element analysis, a calculation procedure of abrasive shedding rate was presented. Subsequently, the slicing experiment of a single crystal silicon rod was carried out by the Meyer Burger RTD6800 multi-wire sawing machine and the electroplated diamond wire saw with a core wire diameter of 65μm. The abrasive shedding rate of the diamond wire saw caused by sawing was analyzed theoretically and experimentally. The research work is of great significance to improve the quality detection and evaluation of electroplated diamond wire saw.

Experimental Investigation on Brittle-Ductile Transition in Electroplated Diamond Wire Saw Machining Single Crystal Silicon

2010 ◽  
Vol 431-432 ◽  
pp. 265-268 ◽  
Author(s):  
Yu Fei Gao ◽  
Pei Qi Ge
Keyword(s):  
Single Crystal ◽  
Material Removal ◽  
Single Crystal Silicon ◽  
Crystal Silicon ◽  
Diamond Wire ◽  
Brittle Ductile Transition ◽  
Wire Saw ◽  
Diamond Wire Saw ◽  
R Value ◽  
Material Removal Mode

Based on reciprocating electroplated diamond wire saw (REDWS) slicing experiments, a study on REDWS machining brittle-ductile transition of single crystal silicon was introduced. The machined surfaces and chips were observed by using Scanning Electron Microscope (SEM), and some experimental evidences of the change of material removal mode had been obtained. The experimental results indicate there is a close relationship between material removal mode and the ratio r value of ingot feed speed and wire speed, through controlling and adjusting the r value, the material removal mode can be complete brittle, partial ductile and near-ductile removal.

Finite Element Analysis of Diamond Wire Saw Slicing SiCp-Al Composites

2013 ◽  
Vol 423-426 ◽  
pp. 16-19
Author(s):  
Chun Yan Zhang ◽  
Yuan Sun ◽  
Li Gang Zhao
Keyword(s):  
Finite Element ◽  
Internal Stress ◽  
Surface Topography ◽  
Basic Rule ◽  
Actual Process ◽  
Diamond Wire ◽  
Finite Element Software ◽  
Sic Particles ◽  
Wire Saw ◽  
Diamond Wire Saw

In order to study the physical nature and basic rule of diamond wire saw slicing SiCp-Al composites, the slicing mechanism was studied in theory first. There are different ways of slicing Al and SiC particles respectively: Al is sliced in plastic way and SiC particles are sliced in brittle ways such as being cut off or pulled out or pressed into matrix or burst. Then based on the finite element software Abaqus, the process of diamond wire saw slicing SiCp-Al composites was simulated. The distribution of internal stress and surface topography was discussed: The internal stress in SiC particles is far high than that in Al. The surface topography of sliced SiCp-Al composites is determined by SiC particles states mainly. The research results provide reference and guidance to the optimization of actual process of diamond wire saw slicing SiCp-Al composites.

scholarly journals Recycling of the Diamond-wire Saw Powder by Ni-catalyzed Nitridation to Prepare Si3N4

2021 ◽  
Author(s):  
Hongli Xu ◽  
Xing Jin ◽  
Xuetong Zhou ◽  
Xinghong Du ◽  
Pengfei Xing ◽  
...  
Keyword(s):  
Single Crystal Silicon ◽  
Silica Film ◽  
Crystal Silicon ◽  
Diamond Wire ◽  
Wire Saw ◽  
Diamond Wire Saw ◽  
Different Temperatures ◽  
Direct Nitridation ◽  
Lower Temperature ◽  
Nitridation Temperature

Abstract In this paper, the acceleration of nickel (Ni) in the direct nitridation process of the diamond-wire saw powder (DWSP) was investigated. The DWSP doped with Ni additives were nitrided at different temperatures. To study the mechanism of accelerated nitridation, the thermodynamics of Si-O-N-Ni was analyzed by FactSage 7.2 and single-crystal silicon blocks were also nitrided instead of the DWSP. The results revealed that Ni decreased the nitridation temperature at which the DWSP began to gain significant weight and exhibited an excellent accelerating effect on the nitridation of the DWSP. At 1300℃, the DWSP containing 2.0 wt.% Ni additives had been completely nitrided within 2 h, whereas the DWSP without Ni additives had not been nitrided yet. Based on the equivalent substitution experiment, it could be conducted that the presence of Ni additives accelerated the nitridation and promoted the formation of the α-Si3N4 nanorods through facilitating the generation of the SiO(g) and destructing the silica film on the surface of silicon at lower temperature. Meanwhile, Ni additives also played an important part in the growth of α-Si3N4 nanorods by forming liquid Ni-Si alloy in the product.

Optimization of Slicing Parameters of Single Crystal Silicon Sliced by Diamond Wire Saw

2012 ◽  
Vol 500 ◽  
pp. 89-93 ◽  
Author(s):  
J.F. Meng ◽  
Y.P. Han
Keyword(s):  
Single Crystal ◽  
Random Vibration ◽  
Single Crystal Silicon ◽  
Machine Precision ◽  
Crystal Silicon ◽  
Diamond Wire ◽  
Feed Force ◽  
Wire Saw ◽  
Diamond Wire Saw ◽  
Moving Speed

The slicing technology of hard-brittle materials by endless diamond wire saw has the advantages of higher moving speed of wire saw, better slicing quality, and thin kerf. According to the strength of wire saw, the cutting force and the random vibration of wire saw, the slicing parameters are optimized. As single crystal silicon is sliced, the constant feed force is less than 10N, the maximum pretension is 30N, and the highest moving speed of wire saw is 24m/s. But because the restrict of machine precision, the highest slicing speed is 16m/s.

The Diamond Wire Saw Test Bench Design and Loading Analysis

2013 ◽  
Vol 572 ◽  
pp. 181-184 ◽  
Author(s):  
Yong Rui Zhang ◽  
Li Quan Wang ◽  
Li Bin Guo ◽  
Ding Yuan Liu
Keyword(s):  
Test Bench ◽  
Structure Design ◽  
Test Bed ◽  
Cutting Mechanism ◽  
Diamond Wire ◽  
Wire Saw ◽  
Diamond Wire Saw ◽  
Lever Mechanism ◽  
Abrasive Cutting ◽  
Diamond Abrasive

The structure design of the underwater diamond wire saw test bench system was conducted for the research of the diamond wire saw cutting mechanism. Through the kinematic analysis of the test-bed parallel lever mechanism, parallel loading mechanism equation was derived, which provided a basis for the cutting force distribution of the loading bow.Software ANSYS was used for the modal analysis of the test bench mechanism. As the theoretical analysis and calculation result showed, the test bench design in this paper realizedthe validation of the diamond abrasive cutting principle, which can serve as guidance for theprocessing and manufacturing of the test bench.

Sign in / Sign up

Export Citation Format

Share Document