scholarly journals The Impact of Environmental Policy Stringency on Industrial Productivity Growth: A Semi-Parametric Study of OECD Countries

2019 ◽  
Author(s):  
Guohua Feng ◽  
Keith McLaren ◽  
Ou Yang ◽  
Xiaohui Zhang ◽  
Xueyan Zhao

2021 ◽  
pp. 105320
Author(s):  
Guohua Feng ◽  
Keith R. McLaren ◽  
Ou Yang ◽  
Xiaohui Zhang ◽  
Xueyan Zhao






2015 ◽  
Vol 6 (2) ◽  
pp. 41-51
Author(s):  
Joe Teng ◽  
Dazhong Wu ◽  
Fran Smith

AbstractBackground:This study investigates the determinants of industrial productivity growth from a network perspective.Objectives:The research focuses on the influence on a focal industry’s productivity growth by its partner industries’ productivity growth, and the impact of the focal industry’s position in the supply chain network.Method/Approach:The paper models the economy as a customer-supplier industry network and empirically investigates how a focal industry’s multifactor productivity is influenced by the productivities of industries that are connected to it, and how this influence is moderated by its position in the network.Results:Based on a balanced panel dataset of 55 industries from the United States Bureau of Economic Analysis (BEA) input-output accounts, the results indicate that a focal industry’s productivity growth is positively associated with its partner industries’ productivity growth, and that industries with higher centrality in the network tend to have higher productivity growth.Conclusions:The study concludes with a discussion on the implications of the findings and the contribution to the productivity literature. Several directions for further research were identified.



Author(s):  
Balázs Égert ◽  
Peter Gal

This chapter describes and discusses a new supply-side framework that quantifies the impact of structural reforms on per capita income in OECD countries. It presents the overall macroeconomic impacts of reforms by aggregating over the effects on physical capital, employment, and productivity through a production function. On the basis of reforms defined as observed changes in policies, the chapter finds that product market regulation has the largest overall single policy impact five years after the reforms. But the combined impact of all labour market policies is considerably larger than that of product market regulation. The paper also shows that policy impacts can differ at different horizons. The overall long-term effects on GDP per capita of policies transiting through capital deepening can be considerably larger than the five- to ten-year impacts. By contrast, the long-term impact of policies coming only via the employment rate channel materializes at a shorter horizon.



Author(s):  
Ah-Young Park ◽  
Satish Chaparala ◽  
Seungbae Park

Through-silicon via (TSV) technology is expected to overcome the limitations of I/O density and helps in enhancing system performance of conventional flip chip packages. One of the challenges for producing reliable TSV packages is the stacking and joining of thin wafers or dies. In the case of the conventional solder interconnections, many reliability issues arise at the interface between solder and copper bump. As an alternative solution, Cu-Cu direct thermo-compression bonding (CuDB) is a possible option to enable three-dimension (3D) package integration. CuDB has several advantages over the solder based micro bump joining, such as reduction in soldering process steps, enabling higher interconnect density, enhanced thermal conductivity and decreased concerns about intermetallic compounds (IMC) formation. Critical issue of CuDB is bonding interface condition. After the bonding process, Cu-Cu direct bonding interface is obtained. However, several researchers have reported small voids at the bonded interface. These defects can act as an initial crack which may lead to eventual fracture of the interface. The fracture could happen due to the thermal expansion coefficient (CTE) mismatch between the substrate and the chip during the postbonding process, board level reflow or thermal cycling with large temperature changes. In this study, a quantitative assessment of the energy release rate has been made at the CuDB interface during temperature change finite element method (FEM). A parametric study is conducted to analyze the impact of the initial crack location and the material properties of surrounding materials. Finally, design recommendations are provided to minimize the probability of interfacial delamination in CuDB.



2021 ◽  
Vol 200 ◽  
pp. 109762
Author(s):  
Gilbert Cette ◽  
Aurélien Devillard ◽  
Vincenzo Spiezia


2010 ◽  
Vol 42 (18) ◽  
pp. 2317-2326 ◽  
Author(s):  
Ashfaqul Babool ◽  
Michael Reed


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