scholarly journals Design considerations for a steady state fusion reactor's thermal energy dump (TED) with emphasis on SAFFIRE

1980 ◽  
Author(s):  
K.A. Werley
2003 ◽  
Vol 44 (2) ◽  
pp. 564-566 ◽  
Author(s):  
R. P. Ashley ◽  
G. L. Kulcinski ◽  
J. F. Santarius ◽  
S. Krupakar Murali ◽  
G. R. Piefer ◽  
...  

2015 ◽  
Vol 55 (12) ◽  
pp. 123020 ◽  
Author(s):  
A. Simonin ◽  
Jocelyn Achard ◽  
K. Achkasov ◽  
S. Bechu ◽  
C. Baudouin ◽  
...  

2010 ◽  
Vol 1267 ◽  
Author(s):  
Knud Zabrocki ◽  
Wolfgang Seifert ◽  
Eckhard Mueller

AbstractThermoelectric (TE) effects as a coupling between heat and charge transfer can be described on a classical level in the framework of the Onsager theory. Under isotropic and steady state conditions the conservation equations can be combined to obtain a thermal energy balance containing the temperature distribution as target function. Besides the temperature the balance equation contains material properties represented by the Seebeck coefficient S, the electrical and thermal conductivities σ and κ, respectively. For the sake of simplicity, a 1D scheme has been chosen for the analytical and numerical treatment. Performance investigations are often done within the framework of the Constant Properties Model (CPM) or based on temperature dependent material properties. In the 1D steady state, there is an alternative approach available based on spatial material profiles. Following the approach by Müller and co-workers, the temperature profile T(x) is calculated numerically within a model-free setup directly from the 1D thermal energy balance, e.g., based on continuous monotonous gradient functions for all material profiles, and independent and free variability of the material parameters S(x), σ(x), and κ(x) is assumed initially. Doing so, the optimum electrical current density can be determined from the maximum of the global performance parameter (power output P or efficiency η). We present analytical results for the performance optimization calculating P and η with linear material profiles for S(x), a constant electrical and thermal conductivity, fixed TE element length L and fixed boundary temperatures.


2019 ◽  
Vol 122 (25) ◽  
Author(s):  
G. S. Xu ◽  
Q. Q. Yang ◽  
N. Yan ◽  
Y. F. Wang ◽  
X. Q. Xu ◽  
...  
Keyword(s):  

2020 ◽  
Vol 60 (3) ◽  
pp. 036005 ◽  
Author(s):  
P.A. Bagryansky ◽  
Z. Chen ◽  
I.A. Kotelnikov ◽  
D.V. Yakovlev ◽  
V.V. Prikhodko ◽  
...  

Author(s):  
Karthik S. Remella ◽  
Frank M. Gerner ◽  
Ahmed Shuja

Loop Heat Pipes (LHPs) are used in many thermal management applications, especially for micro-electronics cooling, because of their ability to passively transport thermal energy from a source to a sink. This paper describes the development of a parametric model for a non-conventional LHP operating in steady state, employed to cool Light Emitting Diodes (LEDs). This device is comprised of a flat evaporator, and a finned circular loop wherein condensation and sub-cooling of the working fluid takes place. Unlike a conventional LHP, this device has no compensation chamber. In the mesh screen of the evaporator, the vapor flow entrains liquid and hence the quality of the two-phase mixture leaving the evaporator (xevap) is less than unity (unlike in a conventional LHP where saturated vapor leaves the evaporator). Since this lower quality (approximately 0.2) results in a smaller ratio of latent energy to sensible energy being removed by the condenser and sub-cooler respectively; the ratio of the length of the sub-cooler to condenser length is significantly larger. This results in more stable and controlled operation of the device. Mathematical models of the evaporator, the condenser and the sub-cooler sections are developed, and two closure conditions are employed in this model. For consistency and accuracy, some parameters in the model, such as the natural convection heat transfer coefficient (h o) and a few thermal resistances in the evaporator, are estimated empirically from test data on the device. The empirically obtained value of the heat transfer coefficient is in very good agreement with correlations from the literature. The parametric model accurately predicts the LED board temperature and other temperatures for a specific amount of thermal energy dissipated by the LEDs.


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