scholarly journals Effect of Ag Addition on Formation of Intermetallic Compound Al3Ti by Combustion Synthesis

2003 ◽  
Vol 67 (6) ◽  
pp. 302-307
Author(s):  
Yoji Miyazaki ◽  
Keisuke Uenishi ◽  
Kojiro F. Kobayashi
1998 ◽  
Vol 95 (2) ◽  
pp. 175-181 ◽  
Author(s):  
Tomohiro Akiyama ◽  
Hiromichi Isogai ◽  
Jun-ichiro Yagi

2015 ◽  
Vol 815 ◽  
pp. 129-134 ◽  
Author(s):  
Xiao Chen Xie ◽  
Xiu Chen Zhao ◽  
Ying Liu ◽  
Jing Wei Cheng ◽  
Bing Zheng ◽  
...  

The effect of Ag content on the morphology of the intermetallic compound (IMC) layer at the interface between Sn-xAg-0.7Cu (x=0.0 wt.%, 0.3 wt.%, 0.8 wt.%, 3.0 wt.%) and Cu substrate has been investigated. After reflow, the slight addition of Ag element can suppress the growth of IMC. However, as the Ag content increases, the thickness of IMC is enhanced. After aging at 150°C, the IMC growth rate constant decreases with the addition of Ag. The IMC growth rate constant of Sn-3.0Ag-0.7Cu is 0.94864×10-5μm2/s, which is the lowest among these solders. As the Ag addition is 0.8wt% and 3.0wt%, the Cu3Sn growth rate constant is 0.16641×10-5μm2/s and 0.18496×10-5μm2/s, compared to the Sn-0.7Cu solder decreased 54% and 49%, respectively. As a result, the addition of Ag element improves the anti-aging properties and suppresses the growth of Cu3Sn layer, which leads to the improvement of solder joint reliability.


1994 ◽  
Vol 44 (3) ◽  
pp. 152-157 ◽  
Author(s):  
Shigeoki SAJI ◽  
Keiichi HIRAO ◽  
Toshimi YAMANE ◽  
Masashi MEHATA ◽  
Takamasa YOKOTE

2011 ◽  
Vol 19 (4) ◽  
pp. 415-422 ◽  
Author(s):  
Hongzhi Cui ◽  
Lili Cao ◽  
Yunbo Chen ◽  
Jie Wu

1997 ◽  
Vol 223 (1-2) ◽  
pp. 21-28 ◽  
Author(s):  
Hideo Nakae ◽  
Hidetoshi Fujii ◽  
Katsuya Nakajima ◽  
Akiko Goto

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