High-precision picosecond laser structuring on LTCC for silicon chip assembly with high electrical contact density

Author(s):  
Nam Gutzeit ◽  
Alexander Schulz ◽  
Tilo Welker ◽  
Christoph Wagner ◽  
Eric Schafer ◽  
...  
2013 ◽  
Author(s):  
Igor Guk ◽  
Galina Shandybina ◽  
Eugeny Yakovlev ◽  
Leonid Golovan

2007 ◽  
Author(s):  
Sergey Vainshtein ◽  
Juha Kostamovaara ◽  
Vladimir Lantratov ◽  
Nikolay Kaluzhniy ◽  
Sergey Mintairov

2010 ◽  
Author(s):  
Gerhard Heise ◽  
Christian Hellwig ◽  
Thomas Kuznicki ◽  
Sebastian Sarrach ◽  
Christian Menhard ◽  
...  

2015 ◽  
Vol 121 (3) ◽  
pp. 1163-1169 ◽  
Author(s):  
Lingfei Ji ◽  
Yan Hu ◽  
Jian Li ◽  
Wenhao Wang ◽  
Yijian Jiang

1969 ◽  
Vol 91 (3) ◽  
pp. 387-389 ◽  
Author(s):  
E. F. Finkin

A new approach to the analysis of problems of surface contact is postulated, which takes into account the discrete nature of the process, but allows the simplicity of continuum methods, where possible; this is termed the discrete-continuum approach. The method is shown by developing the solution of the problem of the nominal interfacial pressure distribution and real area of contact density for rotating nominally flat but rough circular surfaces. The method allows the mathematical statement of the transitions which occur with surface wear, and thereby constitutes a mathematical description of some aspects of run-in. The method and solution to the present problem give insight into the nature of the pattern of contacts, and are therefore expected to find application in surface-contact temperature theory and in electrical-contact resistance theory.


2013 ◽  
Vol 112 (3) ◽  
pp. 695-700 ◽  
Author(s):  
D. Canteli ◽  
I. Torres ◽  
M. Domke ◽  
C. Molpeceres ◽  
J. Cárabe ◽  
...  

2012 ◽  
Vol 112 (1) ◽  
pp. 013110 ◽  
Author(s):  
Gerhard Heise ◽  
Daniel Trappendreher ◽  
Florian Ilchmann ◽  
Robin S. Weiss ◽  
Bernhard Wolf ◽  
...  

1996 ◽  
Author(s):  
Josef F. Bille ◽  
Joerg P. Fischer ◽  
T. Juhasz ◽  
Frieder H. Loesel ◽  
I. Mueller-Vogt ◽  
...  

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