2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition
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105
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Published By IEEE

9780956808646
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

High-precision picosecond laser structuring on LTCC for silicon chip assembly with high electrical contact density

2017 ◽  
Author(s):  
Nam Gutzeit ◽  
Alexander Schulz ◽  
Tilo Welker ◽  
Christoph Wagner ◽  
Eric Schafer ◽  
...  
Keyword(s):  
High Precision ◽  
Electrical Contact ◽  
Picosecond Laser ◽  
Contact Density ◽  
Laser Structuring

LTCC-based micro plasma source for the selective treatment of cell cultures

2017 ◽  
Author(s):  
M. Fischer ◽  
M. Stubenrauch ◽  
A. Naber ◽  
N. Gutzeit ◽  
M. Klett ◽  
...  
Keyword(s):  
Cell Cultures ◽  
Plasma Source ◽  
Selective Treatment

Advances in X-ray for semicon applications

2017 ◽  
Author(s):  
Keith Bryant ◽  
Ragnar Vaga
Keyword(s):  
X Ray

Polyimide foil flip-chip direct bonding

2017 ◽  
Author(s):  
Martin Deckert ◽  
Michael T. Lippert ◽  
Jakub Krzeminski ◽  
Kentaroh Takagaki ◽  
Frank W. Ohl ◽  
...  
Keyword(s):  
Flip Chip ◽  
Polyimide Foil

Hot bar joining method for medical applications

2017 ◽  
Author(s):  
David Wagner ◽  
Kai Pitschmann ◽  
Freidank Sebastian ◽  
Bertram Schmidt ◽  
Markus Detert ◽  
...  
Keyword(s):  
Medical Applications

Distribution of relaxation times as a method of separation and identification of complex processes measured by impedance spectroscopy

2017 ◽  
Author(s):  
Justyna Bartoszek ◽  
Yi-Xin Liu ◽  
Jakub Karczewski ◽  
Sea-Fue Wang ◽  
Aleksander Mrozinski ◽  
...  
Keyword(s):  
Impedance Spectroscopy ◽  
Relaxation Times ◽  
Complex Processes
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