2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition
Latest Publications

TOTAL DOCUMENTS

105

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

9780956808646

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

High-precision picosecond laser structuring on LTCC for silicon chip assembly with high electrical contact density

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition ◽

10.23919/empc.2017.8346866 ◽

2017 ◽

Cited By ~ 1

Author(s):

Nam Gutzeit ◽

Alexander Schulz ◽

Tilo Welker ◽

Christoph Wagner ◽

Eric Schafer ◽

...

Keyword(s):

High Precision ◽

Electrical Contact ◽

Picosecond Laser ◽

Contact Density ◽

Laser Structuring

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Image approximation using B-spline surfaces

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition ◽

10.23919/empc.2017.8346882 ◽

2017 ◽

Author(s):

Zbigniew Suszynski ◽

Robert Swita

Keyword(s):

B Spline ◽

Image Approximation ◽

Spline Surfaces

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LTCC-based micro plasma source for the selective treatment of cell cultures

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition ◽

10.23919/empc.2017.8346855 ◽

2017 ◽

Cited By ~ 1

Author(s):

M. Fischer ◽

M. Stubenrauch ◽

A. Naber ◽

N. Gutzeit ◽

M. Klett ◽

...

Keyword(s):

Cell Cultures ◽

Plasma Source ◽

Selective Treatment

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Advances in X-ray for semicon applications

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition ◽

10.23919/empc.2017.8346903 ◽

2017 ◽

Author(s):

Keith Bryant ◽

Ragnar Vaga

Keyword(s):

X Ray

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Polyimide foil flip-chip direct bonding

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition ◽

10.23919/empc.2017.8346897 ◽

2017 ◽

Cited By ~ 1

Author(s):

Martin Deckert ◽

Michael T. Lippert ◽

Jakub Krzeminski ◽

Kentaroh Takagaki ◽

Frank W. Ohl ◽

...

Keyword(s):

Flip Chip ◽

Polyimide Foil

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Parameters estimation of SPICE models for silicon carbide devices

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition ◽

10.23919/empc.2017.8346918 ◽

2017 ◽

Cited By ~ 2

Author(s):

Damian Bisewski

Keyword(s):

Silicon Carbide ◽

Parameters Estimation

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Mathematical model of the process of creating film resistors with a Ni-P resistive layer

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition ◽

10.23919/empc.2017.8346911 ◽

2017 ◽

Author(s):

Piotr Kowalik ◽

Zbigniew Pruszowski

Keyword(s):

Mathematical Model ◽

Resistive Layer

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Influence of operation temperature instability on gas sensor performance

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition ◽

10.23919/empc.2017.8346896 ◽

2017 ◽

Cited By ~ 1

Author(s):

Grzegorz Jasinski

Keyword(s):

Gas Sensor ◽

Temperature Instability ◽

Sensor Performance ◽

Operation Temperature

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Hot bar joining method for medical applications

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition ◽

10.23919/empc.2017.8346844 ◽

2017 ◽

Cited By ~ 1

Author(s):

David Wagner ◽

Kai Pitschmann ◽

Freidank Sebastian ◽

Bertram Schmidt ◽

Markus Detert ◽

...

Keyword(s):

Medical Applications

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Distribution of relaxation times as a method of separation and identification of complex processes measured by impedance spectroscopy

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition ◽

10.23919/empc.2017.8346901 ◽

2017 ◽

Cited By ~ 1

Author(s):

Justyna Bartoszek ◽

Yi-Xin Liu ◽

Jakub Karczewski ◽

Sea-Fue Wang ◽

Aleksander Mrozinski ◽

...

Keyword(s):

Impedance Spectroscopy ◽

Relaxation Times ◽

Complex Processes

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2017 21st European Microelectronics and Packaging Conference (EMPC) & ExhibitionLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

High-precision picosecond laser structuring on LTCC for silicon chip assembly with high electrical contact density

Image approximation using B-spline surfaces

LTCC-based micro plasma source for the selective treatment of cell cultures

Advances in X-ray for semicon applications

Polyimide foil flip-chip direct bonding

Parameters estimation of SPICE models for silicon carbide devices

Mathematical model of the process of creating film resistors with a Ni-P resistive layer

Influence of operation temperature instability on gas sensor performance

Hot bar joining method for medical applications

Distribution of relaxation times as a method of separation and identification of complex processes measured by impedance spectroscopy

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition
Latest Publications