2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition
Latest Publications

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105

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3

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Published By IEEE

9780956808646

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Distribution of relaxation times as a method of separation and identification of complex processes measured by impedance spectroscopy

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition ◽

10.23919/empc.2017.8346901 ◽

2017 ◽

Author(s):

Justyna Bartoszek ◽

Yi-Xin Liu ◽

Jakub Karczewski ◽

Sea-Fue Wang ◽

Aleksander Mrozinski ◽

...

Keyword(s):

Impedance Spectroscopy ◽

Relaxation Times ◽

Complex Processes

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Sintered Ag joints on copper lead frame TO220 by pressure sintering process with improved reliability and bonding strength

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition ◽

10.23919/empc.2017.8346904 ◽

2017 ◽

Author(s):

Ly May Chew ◽

Wolfgang Schmitt ◽

Jens Nachreiner ◽

Daniel Schnee

Keyword(s):

Bonding Strength ◽

Sintering Process ◽

Sintered Ag ◽

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Development of low-temperature sintering nano-silver die attach materials for bare Cu application

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition ◽

10.23919/empc.2017.8346875 ◽

2017 ◽

Author(s):

Koji Sasaki ◽

Noritsuka Mizumura ◽

Akira Tsuno ◽

Sedat Yagci ◽

Gerhard Kopp

Keyword(s):

Low Temperature ◽

Low Temperature Sintering ◽

Nano Silver ◽

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Small form-factor, liquid-cooled SiPM module for PET/MRI applications

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition ◽

10.23919/empc.2017.8346828 ◽

2017 ◽

Author(s):

Rainer Dohle ◽

Thomas Rittweg ◽

Ilaria Sacco

Keyword(s):

Form Factor ◽

Small Form Factor

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Preform-based diffusion soldering for use under conventional soldering process parameters

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition ◽

10.23919/empc.2017.8346889 ◽

2017 ◽

Author(s):

H. M. Daoud ◽

S. Reichelt ◽

A. Loidolt

Keyword(s):

Process Parameters ◽

Soldering Process ◽

Diffusion Soldering

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Residual free solder process for fluxless solder pastes

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition ◽

10.23919/empc.2017.8346856 ◽

2017 ◽

Author(s):

Alexander Hanss ◽

Gordon Elger

Keyword(s):

Solder Pastes ◽

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Advances in X-ray for semicon applications

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition ◽

10.23919/empc.2017.8346903 ◽

2017 ◽

Author(s):

Keith Bryant ◽

Ragnar Vaga

Keyword(s):

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Polyimide foil flip-chip direct bonding

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition ◽

10.23919/empc.2017.8346897 ◽

2017 ◽

Author(s):

Martin Deckert ◽

Michael T. Lippert ◽

Jakub Krzeminski ◽

Kentaroh Takagaki ◽

Frank W. Ohl ◽

...

Keyword(s):

Flip Chip ◽

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Parameters estimation of SPICE models for silicon carbide devices

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition ◽

10.23919/empc.2017.8346918 ◽

2017 ◽

Author(s):

Damian Bisewski

Keyword(s):

Silicon Carbide ◽

Parameters Estimation

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Mathematical model of the process of creating film resistors with a Ni-P resistive layer

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition ◽

10.23919/empc.2017.8346911 ◽

2017 ◽

Author(s):

Piotr Kowalik ◽

Zbigniew Pruszowski

Keyword(s):

Mathematical Model ◽

Resistive Layer

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