Study on low-cycle fatigue testing and therrmal fatigue life prediction of electroplated copper thin film for through hole via
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2018 ◽
Vol 82
◽
pp. 20-27
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2018 ◽
Vol 53
(4)
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pp. 197-209
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2014 ◽
Vol 23
(9)
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pp. 3100-3107
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1992 ◽
pp. 695-720
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1998 ◽
pp. 703-708
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2011 ◽
Vol 35
(7)
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pp. 753-758
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