scholarly journals Analysis of Fracture Toughness Mode–I of Tapered Double Cantilever Beam

Author(s):  
N. Tamil Selvam et al., N. Tamil Selvam et al., ◽  
2000 ◽  
Vol 123 (2) ◽  
pp. 191-197 ◽  
Author(s):  
Y. Shindo ◽  
K. Horiguchi ◽  
R. Wang ◽  
H. Kudo

An experimental and analytical investigation in cryogenic Mode I interlaminar fracture behavior and toughness of SL-E woven glass-epoxy laminates was conducted. Double cantilever beam (DCB) tests were performed at room temperature (R.T.), liquid nitrogen temperature (77 K), and liquid helium temperature (4 K) to evaluate the effect of temperature and geometrical variations on the interlaminar fracture toughness. The fracture surfaces were examined by scanning electron microscopy to verify the fracture mechanisms. A finite element model was used to perform the delamination crack analysis. Critical load levels and the geometric and material properties of the test specimens were input data for the analysis which evaluated the Mode I energy release rate at the onset of delamination crack propagation. The results of the finite element analysis are utilized to supplement the experimental data.


2021 ◽  
pp. 1-9
Author(s):  
Wu Xu ◽  
J.C Ding ◽  
Jingran Ge ◽  
Qi Zhang

Abstract Due to the low in-plane strength of C/SiC ceramic matrix composite (CMC), arm failure may occur in the classical double cantilever beam (DCB) test for determination of the mode I interlaminar fracture toughness. A taped DCB (TDCB) is proposed to avoid this undesired failure mode. Exact and explicit J integral for the TDCB is derived and applied to measure the interlaminar fracture toughness of CMC. The present TDCB and J integral are demonstrated to be simple and reliable for determining the interlaminar fracture toughness, without visual measurement of the delamination length and complex data reduction.


2019 ◽  
Vol 22 (1) ◽  
pp. 59-74
Author(s):  
Ivan Hlača ◽  
Marin Grbac ◽  
Leo Škec

Double cantilever beam (DCB) test is the most commonly used test for determining the fracture resistance of structural adhesive joints in mode-I debonding. Test specimens are composed of two equal plates that are glued together, and then exposed to the opening load causing crack propagation along the bonded surface. During the experiment, loadline displacement, applied force and crack length are measured continuously. Using these data, the fracture toughness of the adhesive can be computed by the procedure given in the relevant ISO standard (BS ISO 25217:2009). The calculations are based on simple beam theory and linear elastic fracture mechanics (LEFM) equations. In this paper, we will present the standard method for performing a DCB test and the method for data processing required to obtain the adhesive fracture toughness, i.e. the critical energy release rate. Experiments are performed for SikaPower® 4720 adhesive, applied with controlled thickness between the aluminium plates (adherends). After the curing period recommended by the adhesive manufacturer, DCB specimens with piano hinges are loaded by a tensile-testing machine. Loading is applied in the displacement-control mode because when the crack starts to propagate, the applied load drops. Using the optical measurement system GOM Aramis, complete displacement field is recorded during the experiment. Displacement field is then used to obtain the actual load-line displacement of the adherends (different than the one recorded on the tensile-testing machine grips) and the position of the crack tip. After syncing the measurements from different devices, fracture toughness for the adhesive is determined and a statistical analysis performed.


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