scholarly journals A simulation analysis of train rescheduling strategies on Chinese passenger dedicated lines

2010 ◽  
Author(s):  
Z. He ◽  
L. Meng ◽  
H. Li ◽  
L. Nie
Keyword(s):  
Simulation Analysis ◽  
Train Rescheduling

Optimizing Overall equipment effectiveness through simulation analysis

2012 ◽  
Author(s):  
Anand S. Relkar ◽  
K. N. Nandurkar
Keyword(s):  
Simulation Analysis

Computer simulation study about the dependence of amorphous silicon photonic waveguides efficiency on the material quality

2020 ◽  
Vol 90 (3) ◽  
pp. 30502
Author(s):  
Alessandro Fantoni ◽  
João Costa ◽  
Paulo Lourenço ◽  
Manuela Vieira
Keyword(s):  
Amorphous Silicon ◽  
High Throughput Screening ◽  
Simulation Analysis ◽  
Low Cost ◽  
Deposition Process ◽  
Large Area ◽  
Sidewall Roughness ◽  
Sensing Applications ◽  
Fabrication Defects ◽  
The Impact

Amorphous silicon PECVD photonic integrated devices are promising candidates for low cost sensing applications. This manuscript reports a simulation analysis about the impact on the overall efficiency caused by the lithography imperfections in the deposition process. The tolerance to the fabrication defects of a photonic sensor based on surface plasmonic resonance is analysed. The simulations are performed with FDTD and BPM algorithms. The device is a plasmonic interferometer composed by an a-Si:H waveguide covered by a thin gold layer. The sensing analysis is performed by equally splitting the input light into two arms, allowing the sensor to be calibrated by its reference arm. Two different 1 × 2 power splitter configurations are presented: a directional coupler and a multimode interference splitter. The waveguide sidewall roughness is considered as the major negative effect caused by deposition imperfections. The simulation results show that plasmonic effects can be excited in the interferometric waveguide structure, allowing a sensing device with enough sensitivity to support the functioning of a bio sensor for high throughput screening. In addition, the good tolerance to the waveguide wall roughness, points out the PECVD deposition technique as reliable method for the overall sensor system to be produced in a low-cost system. The large area deposition of photonics structures, allowed by the PECVD method, can be explored to design a multiplexed system for analysis of multiple biomarkers to further increase the tolerance to fabrication defects.

Digital Simulation Analysis of PA10

ICTE 2013 ◽  
2013 ◽  
Author(s):  
Zhongnan He ◽  
Wenbiao Wu
Keyword(s):  
Simulation Analysis ◽  
Digital Simulation

Application of Coupled Structural Acoustic Analysis and Sensitivity Calculations to a Tire Noise Problem

2012 ◽  
Vol 40 (1) ◽  
pp. 25-41 ◽  
Author(s):  
H. M. R. Aboutorabi ◽  
L. Kung
Keyword(s):  
Performance Improvement ◽  
Acoustic Analysis ◽  
Simulation Analysis ◽  
Analysis Method ◽  
Vehicle Manufacturer ◽  
Element Analysis ◽  
Equipment Manufacturer ◽  
Tire Noise ◽  
Fea Modeling ◽  
Testing Instruments

Abstract REFERENCE: H. M. R. Aboutorabi and L. Kung, “Application of Coupled Structural Acoustic Analysis and Sensitivity Calculations to a Tire Noise Problem,” Tire Science and Technology, TSTCA, Vol. 40, No. 1, January – March 2012, pp. 25–41. ABSTRACT: Tire qualification for an original equipment (OE) program consists of several rounds of submissions by the tire manufacturer for evaluation by the vehicle manufacturer. Tires are evaluated both subjectively, where the tire performance is rated by an expert driver, and objectively, where sensors and testing instruments are used to measure the tire performance. At the end of each round of testing the evaluation results are shared and requirements for performance improvement for the next round are communicated with the tire manufacturer. As building and testing is both expensive and time consuming predictive modeling and simulation analysis that can be applied to the performance of the tire is of great interest and value. This paper presents an application of finite element analysis (FEA) modeling along with experimental verification to solve tire noise objections at certain frequencies raised by an original equipment manufacturer (OEM) account. Coupled structural-acoustic analysis method was used to find modal characteristics of the tire at the objectionable frequencies. Sensitivity calculations were then carried out to evaluate the strength of contribution from each tire component to the identified modes. Based on these findings changes to the construction were proposed and implemented that addressed the noise issue.

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