scholarly journals Microlens array production in a microtechnological dry etch and reflow process for display applications

Author(s):  
T. Knieling ◽  
M. Shafi ◽  
W. Lang ◽  
W. Benecke
2012 ◽  
Vol 179 ◽  
pp. 242-250 ◽  
Author(s):  
Hao Zhang ◽  
Lei Li ◽  
David L. McCray ◽  
Donggang Yao ◽  
Allen Y. Yi

2004 ◽  
Vol 14 (8) ◽  
pp. 1197-1204 ◽  
Author(s):  
Hsiharng Yang ◽  
Ching-Kong Chao ◽  
Mau-Kuo Wei ◽  
Che-Ping Lin

2014 ◽  
Vol 38 (1) ◽  
pp. 85-92 ◽  
Author(s):  
Tsung-Hung Lin ◽  
Shih-Yu Hung ◽  
Chien-Hsin Hung ◽  
Ming-Ho Shen ◽  
Ching-Kong Chao ◽  
...  

2003 ◽  
Vol 13 (5) ◽  
pp. 775-781 ◽  
Author(s):  
Che-Ping Lin ◽  
Hsiharng Yang ◽  
Ching-Kong Chao

Author(s):  
Hao Zhang ◽  
Lei Li ◽  
David L. McCray ◽  
Donggang Yao ◽  
Allen Y. Yi

Microlens arrays are becoming increasingly important because of their widespread applications in optical, electronic, and energy fields. Currently, microlens array fabrication processes are mainly developed on planar substrates. For nonplanar substrates, existing fabrication methods suffer from various disadvantages. This is largely due to the inherent technical complexity of 3D microstructure fabrication processes. In this work, an innovative 3D fabrication method for microlens arrays on curved surfaces is introduced. To fabricate the microlens array, a PMMA microlens array on a curved surface was used as the projection microlens array. A thick layer of positive tone photoresist SPR 220 was spin coated on a curved, titanium-coated aluminum substrate. A pre-designed pattern was projected onto the photoresist by using a home built exposure system. The development process resulted in micro cylinders on the curved substrate. A thermal reflow process was then performed on the cylinder array, forming a microlens array. Experiments were conducted to evaluate the factors that affect the shapes of the microlenses. These factors include film thickness variation, exposure and development variation, slope of the substrate, height to width ratio and heating time in thermal reflow process. Finally microlenses were tested by using a Twyman-Green interferometer.


2008 ◽  
Vol 18 (5) ◽  
pp. 055022 ◽  
Author(s):  
Yang Chen ◽  
Allen Y Yi ◽  
Donggang Yao ◽  
Fritz Klocke ◽  
Guido Pongs

2009 ◽  
Vol 86 (11) ◽  
pp. 2255-2261 ◽  
Author(s):  
E. Roy ◽  
B. Voisin ◽  
J.-F. Gravel ◽  
R. Peytavi ◽  
D. Boudreau ◽  
...  

Author(s):  
K.A. Mohammad ◽  
L.J. Liu ◽  
S.F. Liew ◽  
S.F. Chong ◽  
D.G. Lee ◽  
...  

Abstract The paper focuses on the pad contamination defect removal technique. The defect is detected at the outgoing inspection step. The failure analysis results showed that the defect is Fluorine type contamination. The failure analysis indicated many source contributors mainly from Fluorine based processes. The focus is in the present work is in the rework method for the removal of this defect. The combination of wet and dry etch processing in the rework routine is utilized for the removal of the defect and preventive action plans for in-line were introduced and implemented to avoid this event in the future. The reliability of the wafer is verified using various tests including full map electrical, electrical sort, gate oxide breakdown (GOI) and wafer reliability level, passivation quick kill to ensure the integrity of the wafer after undergoing the rework routine. The wafer is monitored closely over a period of time to ensure it has no mushroom defect.


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