Influence of heat treatment on the maximum differential magnetic permeability of steel

2015 ◽  
Vol 45 (8) ◽  
pp. 617-621 ◽  
Author(s):  
S. G. Sandomirskii
Keyword(s):  
Heat Treatment ◽  
Magnetic Permeability ◽  
Differential Magnetic Permeability

UNILOY 888

Alloy Digest ◽  
1974 ◽  
Vol 23 (7) ◽  
Keyword(s):  
Mechanical Properties ◽  
Heat Treatment ◽  
Fracture Toughness ◽  
Corrosion Resistance ◽  
Physical Properties ◽  
Magnetic Permeability ◽  
Cold Working ◽  
High Strength ◽  
Heat Treating ◽  
Magnetic Characteristics

Abstract UNILOY 888 is an iron-base, age-hardenable alloy designed primarily for applications requiring low magnetic permeability and high strength. It is austenitic at all times and its essentially non-magnetic characteristics are not impaired by various combinations of heat treatment and cold working used to produce desired mechanical properties. It is used primarily between 70 and 700 F. This datasheet provides information on composition, physical properties, hardness, elasticity, and tensile properties as well as fracture toughness. It also includes information on corrosion resistance as well as forming, heat treating, and machining. Filing Code: Fe-51. Producer or source: Cyclops Corporation.

Various Coiled Magnetoimpedance Based on Differential Magnetic Permeability Variation

2013 ◽  
Vol 11 (1) ◽  
pp. 40-43
Author(s):  
J. Moutoussamy ◽  
C. Coillot ◽  
G. Chanteur ◽  
F. Alvès
Keyword(s):  
Magnetic Permeability ◽  
Differential Magnetic Permeability ◽  
Permeability Variation

The Precipitation of Si in AlCuSi Thin Films

1973 ◽  
Vol 31 ◽  
pp. 34-35 ◽  
Author(s):  
R. M. Anderson
Keyword(s):  
Electron Microscopy ◽  
Thin Films ◽  
Heat Treatment ◽  
Solid Solution ◽  
Integrated Circuit ◽  
Copper Film ◽  
Solution Concentration ◽  
X Ray ◽  
Silicon Thin Films ◽  
Before And After

Aluminum-copper-silicon thin films have been considered as an interconnection metallurgy for integrated circuit applications. Various schemes have been proposed to incorporate small percent-ages of silicon into films that typically contain two to five percent copper. We undertook a study of the total effect of silicon on the aluminum copper film as revealed by transmission electron microscopy, scanning electron microscopy, x-ray diffraction and ion microprobe techniques as a function of the various deposition methods.X-ray investigations noted a change in solid solution concentration as a function of Si content before and after heat-treatment. The amount of solid solution in the Al increased with heat-treatment for films with ≥2% silicon and decreased for films <2% silicon.

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