INDALLOY 227

Alloy Digest ◽  
1998 ◽  
Vol 47 (1) ◽  
Keyword(s):  
Shear Strength ◽  
Physical Properties ◽  
Tensile Properties ◽  
Data Sheet ◽  
Lead Free ◽  
Lead Free Solder ◽  
Eutectic Solder ◽  
Free Solder

Abstract Indalloy 227 is a lead-free solder developed to replace common tin-lead eutectic solder used in electronics soldering applications. Comparisons are given in this data sheet between Indalloy 227 and 63Sn37Pb, the composition of the alloy that Indalloy 227 was designed to replace. This datasheet provides information on composition, physical properties, elasticity, tensile properties, and shear strength as well as creep and fatigue. It also includes information on joining. Filing Code: SN-13. Producer or source: Indium Corporation of America.

ALCOA 6061

Alloy Digest ◽  
2006 ◽  
Vol 55 (1) ◽  
Keyword(s):  
Corrosion Resistance ◽  
Shear Strength ◽  
Physical Properties ◽  
Surface Treatment ◽  
Tensile Properties ◽  
Data Sheet ◽  
Alloy 6061

Abstract Alloy 6061 is one of the most widely used alloys in the 6000 Series. This data sheet revision adds standard tempers and many of the Alcoa special tempers, as well as properties for extrusions and shapes. This datasheet provides information on composition, physical properties, hardness, elasticity, tensile properties, and shear strength. It also includes information on corrosion resistance as well as forming, machining, joining, and surface treatment. Filing Code: AL-281. Producer or source: Alcoa Engineered Products. Originally published May 1987, revised January 2006.

scholarly journals Physical properties of Sn-3.0Ag-0.5Cu lead-free solder with the additional of SiC particles

2019 ◽  
Vol 701 ◽  
pp. 012030
Author(s):  
Zawawi Mahim ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Norainiza Saud ◽  
Nurul Razliana Abdul Razak ◽  
Khor Chu Yee ◽  
...  
Keyword(s):  
Physical Properties ◽  
Lead Free ◽  
Lead Free Solder ◽  
Sic Particles ◽  
Free Solder

Microstructure and tensile properties of Sn–9Zn–xAg lead-free solder alloys

2003 ◽  
Vol 48 (8) ◽  
pp. 1047-1051 ◽  
Author(s):  
J.M. Song ◽  
G.F. Lan ◽  
T.S. Lui ◽  
L.H. Chen
Keyword(s):  
Tensile Properties ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Free Solder

Impact Tensile Properties of Sn-3.0Ag-0.5Cu Lead-free Solder

2002 ◽  
Vol 2002 (0) ◽  
pp. 229-230
Author(s):  
Ken KAMINISI ◽  
Takesi MARUICHI ◽  
Tsutomu SEKINE
Keyword(s):  
Tensile Properties ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

The impact of thermal cycling regime on the shear strength of lead‐free solder joints

2005 ◽  
Vol 17 (2) ◽  
pp. 22-31 ◽  
Author(s):  
Milos Dusek ◽  
Martin Wickham ◽  
Christopher Hunt
Keyword(s):  
Shear Strength ◽  
Thermal Cycling ◽  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder ◽  
The Impact
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