Impact Tensile Properties of Sn-3.0Ag-0.5Cu Lead-free Solder

2002 ◽  
Vol 2002 (0) ◽  
pp. 229-230
Author(s):  
Ken KAMINISI ◽  
Takesi MARUICHI ◽  
Tsutomu SEKINE
Keyword(s):  
Tensile Properties ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

Microstructure and tensile properties of Sn–9Zn–xAg lead-free solder alloys

2003 ◽  
Vol 48 (8) ◽  
pp. 1047-1051 ◽  
Author(s):  
J.M. Song ◽  
G.F. Lan ◽  
T.S. Lui ◽  
L.H. Chen
Keyword(s):  
Tensile Properties ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Free Solder

scholarly journals Impact Tensile Properties of Sn-3.5Ag-0.7Cu Lead-free Solder

2002 ◽  
Vol 2002.55 (0) ◽  
pp. 31-32
Author(s):  
Ken KAMINISI ◽  
Shigeyuki HARUYAMA ◽  
Hirohide KAIDA ◽  
Fumitoshi OGAWA ◽  
Kousuke UEMORI
Keyword(s):  
Tensile Properties ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

INDALLOY 227

Alloy Digest ◽  
1998 ◽  
Vol 47 (1) ◽  
Keyword(s):  
Shear Strength ◽  
Physical Properties ◽  
Tensile Properties ◽  
Data Sheet ◽  
Lead Free ◽  
Lead Free Solder ◽  
Eutectic Solder ◽  
Free Solder

Abstract Indalloy 227 is a lead-free solder developed to replace common tin-lead eutectic solder used in electronics soldering applications. Comparisons are given in this data sheet between Indalloy 227 and 63Sn37Pb, the composition of the alloy that Indalloy 227 was designed to replace. This datasheet provides information on composition, physical properties, elasticity, tensile properties, and shear strength as well as creep and fatigue. It also includes information on joining. Filing Code: SN-13. Producer or source: Indium Corporation of America.

Impact Tensile Properties of Lead-free Solder

2002 ◽  
Vol 2002 (0) ◽  
pp. 7-8
Author(s):  
Ken KAMINISI ◽  
Takesi MARUICHI ◽  
Tsutomu SEKINE ◽  
Shigeyuki HARUYAMA ◽  
Toshifumi OGAWA
Keyword(s):  
Tensile Properties ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

Tensile properties and wettability of SAC0307 and SAC105 low Ag lead-free solder alloys

2011 ◽  
Vol 46 (10) ◽  
pp. 3424-3429 ◽  
Author(s):  
Fangjie Cheng ◽  
Feng Gao ◽  
Jianyou Zhang ◽  
Wenshan Jin ◽  
Xin Xiao
Keyword(s):  
Tensile Properties ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Free Solder

The bulk alloy microstructure and tensile properties of Sn‐1Ag‐0.5Cu‐xAl lead‐free solder alloys (x=0, 1, 1.5 and 2 wt.%)

2012 ◽  
Vol 29 (2) ◽  
pp. 108-116 ◽  
Author(s):  
Dhafer Abdul‐Ameer Shnawah ◽  
Mohd Faizul Mohd Sabri ◽  
Irfan Anjum Badruddin ◽  
Fa Xing Che
Keyword(s):  
Tensile Properties ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Bulk Alloy ◽  
Alloy Microstructure ◽  
Free Solder
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