A Signature Analysis Method for IC Failure Analysis
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Abstract A new method of signature analysis is presented and explained. This method of signature analysis can be based on either experiential knowledge of failure analysis, observed data, or a combination of both. The method can also be used on low numbers of failures or even single failures. It uses the Dempster-Shafer theory to calculate failure mechanism confidence. The model is developed in the paper and an example is given for its use.
2015 ◽
Vol 26
(10)
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pp. 105402
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2014 ◽
Vol 1030-1032
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pp. 1764-1768
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2019 ◽
Vol 15
(1)
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pp. 155014771882399
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