scholarly journals Thermal Assessment of Nano-Particulate Graphene-Water/Ethylene Glycol (WEG 60:40) Nano-Suspension in a Compact Heat Exchanger

Energies ◽  
2019 ◽  
Vol 12 (10) ◽  
pp. 1929 ◽  
Author(s):  
M. Sarafraz ◽  
Mohammad Safaei ◽  
Zhe Tian ◽  
Marjan Goodarzi ◽  
Enio Bandarra Filho ◽  
...  

In the present study, we report the results of the experiments conducted on the convective heat transfer of graphene nano-platelets dispersed in water-ethylene glycol. The graphene nano-suspension was employed as a coolant inside a micro-channel and heat-transfer coefficient (HTC) and pressure drop (PD) values of the system were reported at different operating conditions. The results demonstrated that the use of graphene nano-platelets can potentially augment the thermal conductivity of the working fluid by 32.1% (at wt. % = 0.3 at 60 °C). Likewise, GNP nano-suspension promoted the Brownian motion and thermophoresis effect, such that for the tests conducted within the mass fractions of 0.1%–0.3%, the HTC of the system was improved. However, a trade-off was identified between the PD value and the HTC. By assessing the thermal performance evaluation criteria (TPEC) of the system, it was identified that the thermal performance of the system increased by 21% despite a 12.1% augmentation in the PD value. Furthermore, with an increment in the fluid flow and heat-flux applied to the micro-channel, the HTC was augmented, showing the potential of the nano-suspension to be utilized in high heat-flux thermal applications.

Author(s):  
M. J. Rhodes ◽  
M. R. Taylor ◽  
J. G. Monroe ◽  
S. M. Thompson

The thermal performance of a flat-plate oscillating heat pipe (FP-OHP) - with modified evaporator and condenser was experimentally investigated during high heat flux conditions. The copper FP-OHP (101.6 × 101.6 × 3.18 mm3) possessed two inter-connected layers of 1.02 mm2 square channels with the evaporator and condenser possessing two parallel, 0.25 × 0.51 mm2 square microchannels. The microchannels were integrated to enhance evaporation and condensation heat transfer to improve the FP-OHP’s ability to transport high heat flux. The FP-OHP was oriented vertically and locally heated with a 14.52 cm2 heating block at its base and cooled with a water block that provided either: 20 °C, 40 °C, or 60 °C operating temperatures. A FP-OHP without embedded microchannels was also investigated for baseline performance comparison. Both FP-OHPs were filled with Novec HFE-7200 (3M) working fluid at a filling ratio of approximately 80% by volume. The maximum temperature of each FP-OHP was recorded versus time for various heat inputs for the investigated operating temperatures. The results indicate that the integrated microchannels enhance the FP-OHP’s thermal performance for all operating temperatures. At 20 °C, 40 °C, and 60 °C, the microchannel-embedded evaporator and condenser dissipated 80 W, 65 W, and 55 W more than the baseline control with a minimum thermal resistance of 0.219 °C/W, 0.205 °C/W, and 0.170 °C/W, respectively — corresponding to a percent enhancement on-the-order of 25%. This percent enhancement increased with operating temperature. It has also been shown that Novec HFE-7200 allows the FP-OHP to start at relatively lower heat inputs — as low as 35 W, demonstrating that this working fluid can enhance heat transfer even at lower heat flux applications.


Author(s):  
James D. Heidmann ◽  
David L. Rigby ◽  
Ali A. Ameri

A three-dimensional Navier-Stokes simulation has been performed for a realistic film-cooled turbine vane using the LeRC-HT code. The simulation includes the flow regions inside the coolant plena and film cooling holes in addition to the external flow. The vane is the subject of an upcoming NASA Lewis Research Center experiment and has both circular cross-section and shaped film cooling holes. This complex geometry is modeled using a multi-block grid which accurately discretizes the actual vane geometry including shaped holes. The simulation matches operating conditions for the planned experiment and assumes periodicity in the spanwise direction on the scale of one pitch of the film cooling hole pattern. Two computations were performed for different isothermal wall temperatures, allowing independent determination of heat transfer coefficients and film effectiveness values. The results indicate separate localized regions of high heat flux in the showerhead region due to low film effectiveness and high heat transfer coefficient values, while the shaped holes provide a reduction in heat flux through both parameters. Hole exit data indicate rather simple skewed profiles for the round holes, but complex profiles for the shaped holes with mass fluxes skewed strongly toward their leading edges.


Author(s):  
Olubunmi Popoola ◽  
Ayobami Bamgbade ◽  
Yiding Cao

An effective design option for a cooling system is to use a two-phase pumped cooling loop to simultaneously satisfy the temperature uniformity and high heat flux requirements. A reciprocating-mechanism driven heat loop (RMDHL) is a novel heat transfer device that could attain a high heat transfer rate through a reciprocating flow of the two-phase working fluid inside the heat transfer device. Although the device has been tested and validated experimentally, analytical or numerical study has not been undertaken to understand its working mechanism and provide guidance for the device design. The objective of this paper is to develop a numerical model for the RMDHL to predict its operational performance under different working conditions. The developed numerical model has been successfully validated by the existing experimental data and will provide a powerful tool for the design and performance optimization of future RMDHLs. The study also reveals that the maximum velocity in the flow occurs near the wall rather than at the center of the pipe, as in the case of unidirectional steady flow. This higher velocity near the wall may help to explain the enhanced heat transfer of an RMDHL.


Author(s):  
Hailei Wang ◽  
Richard Peterson

Flow boiling and heat transfer enhancement in four parallel microchannels using a dielectric working fluid, HFE 7000, was investigated. Each channel was 1000 μm wide and 510 μm high. A unique channel surface enhancement technique via diffusion bonding a layer of conductive fine wire mesh onto the heating wall was developed. According to the obtained flow boiling curves for both the bare and mesh channels, the amount of wall superheat was significantly reduced for the mesh channel at all stream-wise locations. This indicated that the nucleate boiling in the mesh channel was enhanced due to the increase of nucleation sites the mesh introduced. Both the nucleate boiling dominated and convective evaporation dominated regimes were identified. In addition, the overall trend for the flow boiling heat transfer coefficient, with respect to vapor quality, was increasing until the vapor quality reached approximately 0.4. The critical heat flux (CHF) for the mesh channel was also significantly higher than that of the bare channel in the low vapor quality region. Due to the fact of how the mesh was incorporated into the channels, no pressure drop penalty was identified for the mesh channels. Potential applications for this kind of mesh channel include high heat-flux electronic cooling systems and various energy conversion systems.


Author(s):  
Nihal E. Joshua ◽  
Denesh K. Ajakumar ◽  
Huseyin Bostanci

This study experimentally investigated the effect of hydrophobic patterned surfaces in nucleate boiling heat transfer. A dielectric liquid, HFE-7100, was used as the working fluid in the saturated boiling tests. Dielectric liquids are known to have highly-wetting characteristics. They tend to fill surface cavities that would normally trap vapor/gas, and serve as active nucleation sites during boiling. With the lack of these vapor filled cavities, boiling of a dielectric liquid leads to high incipience superheats and accompanying temperature overshoots. Heater samples in this study were prepared by applying a thin Teflon (AF400, Dupont) coating on 1-cm2 smooth copper surfaces following common photolithography techniques. Matching size thick film resistors, attached onto the copper samples, generated heat and simulated high heat flux electronic devices. Tests investigated the heater samples featuring circular pattern sizes between 40–100 μm, and corresponding pitch sizes between 80–200 μm. Additionally, a plain, smooth copper surface was tested to obtain reference data. Based on data, hydrophobic patterned surfaces effectively eliminated the temperature overshoot at boiling incipience, and considerably improved nucleate boiling performance in terms of heat transfer coefficient and critical heat flux over the reference surface. Hydrophobic patterned surfaces therefore demonstrated a practical surface modification method for heat transfer enhancement in immersion cooling applications.


2013 ◽  
Vol 589-590 ◽  
pp. 559-564
Author(s):  
Xi Bing Li ◽  
Yun Shi Ma ◽  
Xun Wang ◽  
Ming Li

As a highly efficient heat transfer component, a micro heat pipe (MHP) has been widely applied to the situations with high heat flux concentration. However, a MHPs heat transfer performance is affected by many factors, among which, working fluid inventory has great influence on the security, reliability and frost resistance of its heat transfer performance. In order to determine the appropriate working fluid inventory for grooved MHPs, this paper first analyzed the working principle, major heat transfer limits and heat flux distribution law of grooved MHPs in electronic chips with high heat flux concentration, then established a mathematic model for the working fluid inventory in grooved MHPs. Finally, with distilled water being the working fluid, a series of experimental investigations were conducted at different temperatures to test the heat transfer performances of grooved MHPs, which were perfused with different inventories and with different adiabatic section lengths. The experimental results show that when the value of α is roughly within 0.40±0.05, a grooved MHP can acquire its best heat transfer performance, and the working fluid inventory can be determined by the proposed mathematic model. Therefore this study solves the complicated problem of determining appropriate working fluid inventory for grooved MHPs.


2015 ◽  
Vol 789-790 ◽  
pp. 422-425
Author(s):  
Fun Liang Chang ◽  
Yew Mun Hung

Micro heat pipe is a two-phase heat transfer device offering effective high heat-flux removal in electronics cooling. Essentially, micro heat pipe relies on the phase change processes, namely evaporation and condensation, and the circulation of working fluid to function as heat transfer equipment. The vast applications of micro heat pipe in portable appliances necessitate its functionality under different orientations with respect to gravity. Therefore, its thermal performance is strongly related to its orientation. By incorporating solid wall conduction, together with the continuity, momentum, and energy equations of the working fluid, a mathematical model is developed to investigate the heat and fluid flow characteristics of inclined micro heat pipes. We investigate both the favorable and adverse effects of gravity on the circulation rate which is intimately related to the thermal performance of micro heat pipes. The effects of gravity, through the angle of inclination, on the circulation strength and heat transport capacity are analysed. This study serves as a useful analytical tool in the micro heat pipe design and performance analysis, associated with different inclinations and operating conditions.


2008 ◽  
Vol 130 (7) ◽  
Author(s):  
Yiding Cao ◽  
Mingcong Gao

This paper conducts experimental and analytical studies of a novel heat-transfer device, reciprocating-mechanism driven heat loop (RMDHL) that facilitates two-phase heat transfer while eliminating the so-called cavitation problem commonly encountered by a conventional pump. A RMDHL normally includes a hollow loop having an interior flow passage, an amount of working fluid filled within the loop, and a reciprocating driver. The hollow loop has an evaporator section, a condenser section, and a liquid reservoir. The reciprocating driver is integrated with the liquid reservoir and facilitates a reciprocating flow of the working fluid within the loop, so that liquid is supplied from the condenser section to the evaporator section under a substantially saturated condition and the so-called cavitation problem associated with a conventional pump is avoided. The reciprocating driver could be a solenoid-operated reciprocating driver for electronics cooling applications and a bellows-type reciprocating driver for high-temperature applications. Experimental study has been undertaken for a solenoid-operated heat loop in connection with high heat flux thermal management applications. Experimental results show that the heat loop worked very effectively and a heat flux as high as 300W∕cm2 in the evaporator section could be handled. A working criterion has also been derived, which could provide a guidance for the design of a RMDHL.


2011 ◽  
Vol 133 (5) ◽  
Author(s):  
Liang Gong ◽  
Krishna Kota ◽  
Wenquan Tao ◽  
Yogendra Joshi

Wavy channels were investigated in this paper as a passive scheme to improve the heat transfer performance of laminar fluid flow as applied to microchannel heat sinks. Parametric study of three-dimensional laminar fluid flow and heat transfer characteristics in microsized wavy channels was performed by varying the wavy feature amplitude, wavelength, and aspect ratio for different Reynolds numbers between 50 and 150. Two different types of wavy channels were considered and their thermal performance for a constant heat flux of 47 W/cm2 was compared. Based on the comparison with straight channels, it was found that wavy channels can provide improved overall thermal performance. In addition, it was observed that wavy channels with a configuration in which crests and troughs face each other alternately (serpentine channels) were found to show an edge in thermal performance over the configuration where crests and troughs directly face each other. The best configuration considered in this paper was found to provide an improvement of up to 55% in the overall performance compared to microchannels with straight walls and hence are attractive candidates for cooling of future high heat flux electronics.


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