scholarly journals On the Electrochemical Migration Mechanism of Gold in Electronics—Less Reliable Than Expected?

Materials ◽  
2021 ◽  
Vol 14 (18) ◽  
pp. 5237
Author(s):  
Bálint Medgyes ◽  
Ali Gharaibeh ◽  
Dániel Rigler ◽  
Gábor Harsányi
Keyword(s):  
Anodic Dissolution ◽  
High Reliability ◽  
Influencing Factor ◽  
Theoretical Background ◽  
Surface Finishing ◽  
Limiting Factor ◽  
Electrochemical Migration ◽  
Short Circuits ◽  
Anodic Dissolution Of Gold ◽  
Complex Ion

Electrochemical migration (ECM) forming dendritic short circuits is a major reliability limiting factor in microcircuits. Gold, which is a noble metal, has been regarded as a metallization that can withstand corrosion and also ECM, therefore its application in high-reliability metallization and surface finishing systems became widespread although it has a relatively high and fluctuating price. Gold electrochemical short circuits have been found only in the case of halogen (e.g., chloride containing) contaminants that can initiate the anodic dissolution of gold via complex ion formation. The experimental results of the study demonstrate that gold can form dendritic shorts even without the presence of halogen contaminants, therefore the direct anodic dissolution of gold must also be supposed. This could also be a serious reliability influencing factor even when applying gold metallization systems and must be taken into consideration. The theoretical background of the classical (contaminant-free) model of gold is also discussed in the paper.

A Study of Anodic Dissolution of Gold in Aqueous Alkaline Cyanide

1978 ◽  
Vol 125 (9) ◽  
pp. 1436-1443 ◽  
Author(s):  
D. W. Kirk ◽  
F. R. Foulkes ◽  
W. F. Graydon
Keyword(s):  
Anodic Dissolution ◽  
Anodic Dissolution Of Gold

Kinetics and mechanism of anodic dissolution of gold in aqueous solution of 1,4-diaminobutane

2019 ◽  
Vol 68 (11) ◽  
pp. 1997-2001 ◽  
Author(s):  
M. D. Vedenyapina ◽  
V. V. Kuznetzov ◽  
N. N. Makhova ◽  
D. I. Rodikova
Keyword(s):  
Aqueous Solution ◽  
Anodic Dissolution ◽  
Kinetics And Mechanism ◽  
Anodic Dissolution Of Gold

scholarly journals Electrochemical Migration on Lead-Free Soldering of PCBs

2011 ◽  
Vol 6 (2) ◽  
pp. 127-130 ◽  
Author(s):  
Luiz Tadeu Freire Mendes ◽  
Valtemar Fernandes Cardoso ◽  
Ana Neilde Rodrigues Da Silva
Keyword(s):  
Electronic Devices ◽  
Electrochemical Process ◽  
Lead Free ◽  
Surface Finishing ◽  
Ionic Form ◽  
Electrochemical Migration ◽  
Solder Paste ◽  
Main Metal ◽  
Printed Circuits ◽  
Initial Location

It is well known that in printed circuits boards assembled by SMT technology may occur Electrochemical Migration (ECM). This phenomenon appears mainly because the new packaging has the terminals very close. Also the Electrochemical Migration may become a potential reliability problem in electronic soldering when lead free technology is used in soldering electronic devices. Electrochemical Migration is an electrochemical process where metal on an insulating material, in a humid environment and under an applied electric field, leaves its initial location in ionic form and redeposit. In a PCB two adjacent terminals may behave as electrodes so the dendrites grow from cathode to anode. It can show different morphologies with the different migration elements involved depending on the solder paste composition or PCB surface finishing. A structure with a comb shape printed on FR4 substrate was used in the experiments. The distance between the fingers in the structure was 102 or 254 micron, in order to simulate a real distance between dispositive terminals. The factors considered during the experiments were surface finishing (ENIG or HASL), solder paste composition, distance between terminals (102 or 254 micron) and applied voltage (2 or 3 V). All the experiments were done two times. It was observed that the solder paste and the surface finishing don’t influences the ECM process. Tin was the main metal that migrates. All the results obtained in these study agrees with the literature.

scholarly journals A workflow for sizing oligomeric biomolecules based on cryo single molecule localization microscopy

2020 ◽  
Author(s):  
Magdalena C. Schneider ◽  
Roger Telschow ◽  
Gwenael Mercier ◽  
Montserrat López-Martinez ◽  
Otmar Scherzer ◽  
...  
Keyword(s):  
Single Molecule ◽  
High Reliability ◽  
Limiting Factor ◽  
Dye Molecules ◽  
New Approach ◽  
Localization Microscopy ◽  
Additional Information ◽  
Localization Precision ◽  
Microscopy Data ◽  
Single Molecule Localization Microscopy

ABSTRACTSingle molecule localization microscopy (SMLM) has enormous potential for resolving subcellular structures below the diffraction limit of light microscopy: Localization precision in the low digit nanometer regime has been shown to be achievable. In order to record localization microscopy data, however, sample fixation is inevitable to prevent molecular motion during the rather long recording times of minutes up to hours. Eventually, it turns out that preservation of the sample’s ultrastructure during fixation becomes the limiting factor. We propose here a workflow for data analysis, which is based on SMLM performed at cryogenic temperatures. Since molecular dipoles of the fluorophores are fixed at low temperatures, such an approach offers the possibility to use the orientation of the dipole as an additional information for image analysis. In particular, assignment of localizations to individual dye molecules becomes possible with high reliability. We quantitatively characterized the new approach based on the analysis of simulated oligomeric structures. Side lengths can be determined with a relative error of less than 1% for tetramers with a nominal side length of 5 nm, even if the assumed localization precision for single molecules is more than 2 nm.

Kinetics and Mechanism of the Anodic Dissolution of Gold in a Solution of 1,2-Diaminoethane

2019 ◽  
Vol 93 (3) ◽  
pp. 466-469 ◽  
Author(s):  
M. D. Vedenyapina ◽  
V. V. Kuznetsov ◽  
N. N. Makhova ◽  
D. I. Rodikova
Keyword(s):  
Anodic Dissolution ◽  
Kinetics And Mechanism ◽  
Anodic Dissolution Of Gold

scholarly journals A workflow for sizing oligomeric biomolecules based on cryo single molecule localization microscopy

PLoS ONE ◽  
2021 ◽  
Vol 16 (1) ◽  
pp. e0245693
Author(s):  
Magdalena C. Schneider ◽  
Roger Telschow ◽  
Gwenael Mercier ◽  
Montserrat López-Martinez ◽  
Otmar Scherzer ◽  
...  
Keyword(s):  
Single Molecule ◽  
High Reliability ◽  
Limiting Factor ◽  
Dye Molecules ◽  
New Approach ◽  
Localization Microscopy ◽  
Additional Information ◽  
Localization Precision ◽  
Microscopy Data ◽  
Single Molecule Localization Microscopy

Single molecule localization microscopy (SMLM) has enormous potential for resolving subcellular structures below the diffraction limit of light microscopy: Localization precision in the low digit nanometer regime has been shown to be achievable. In order to record localization microscopy data, however, sample fixation is inevitable to prevent molecular motion during the rather long recording times of minutes up to hours. Eventually, it turns out that preservation of the sample’s ultrastructure during fixation becomes the limiting factor. We propose here a workflow for data analysis, which is based on SMLM performed at cryogenic temperatures. Since molecular dipoles of the fluorophores are fixed at low temperatures, such an approach offers the possibility to use the orientation of the dipole as an additional information for image analysis. In particular, assignment of localizations to individual dye molecules becomes possible with high reliability. We quantitatively characterized the new approach based on the analysis of simulated oligomeric structures. Side lengths can be determined with a relative error of less than 1% for tetramers with a nominal side length of 5 nm, even if the assumed localization precision for single molecules is more than 2 nm.

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