2009 59th Electronic Components and Technology Conference
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344
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9781424444755
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

A new COF bonding technique using Sn bumps and a non-conductive adhesive (NCA) for image sensor packaging

2009 ◽  
Author(s):  
Kyoung-Moo Harr ◽  
Young-Min Kim ◽  
Dae Hwan Lim ◽  
Young-Ho Kim ◽  
Jin-Gu Kim ◽  
...  
Keyword(s):  
Image Sensor ◽  
Conductive Adhesive ◽  
Bonding Technique

Capacitors on organic modules: a new THB failure mode and method of detection

2009 ◽  
Author(s):  
Wolfgang Sauter ◽  
Jennifer Muncy ◽  
Joseph Ross ◽  
Jeffrey Coffin ◽  
Charles Arvin ◽  
...  
Keyword(s):  
Failure Mode

Intermetallic reaction between electroplated indium and silver layers

2009 ◽  
Author(s):  
Pin J. Wang ◽  
Jong S. Kim ◽  
Chin C. Lee

Manufacturing and stacking of ultra-thin film packages

2009 ◽  
Author(s):  
Ying-Ching Shih ◽  
Tzu-Ying Kuo ◽  
Yin-Po Hung ◽  
Jing-Yao Chang ◽  
Chih-Yuan Cheng ◽  
...  
Keyword(s):  
Thin Film ◽  
Ultra Thin Film

Low-frequency test method for integrated RF substrates

2009 ◽  
Author(s):  
Abhilash Goyal ◽  
Madhavan Swaminathan ◽  
Abhijit Chatterjee
Keyword(s):  
Low Frequency ◽  
Test Method ◽  
Frequency Test
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