scholarly journals A Spatial-Frequency Domain Associated Image-Optimization Method for Illumination-Robust Image Matching

Sensors ◽  
2020 ◽  
Vol 20 (22) ◽  
pp. 6489
Author(s):  
Chun Liu ◽  
Shoujun Jia ◽  
Hangbin Wu ◽  
Doudou Zeng ◽  
Fanjin Cheng ◽  
...  

Image matching forms an essential means of data association for computer vision, photogrammetry and remote sensing. The quality of image matching is heavily dependent on image details and naturalness. However, complex illuminations, denoting extreme and changing illuminations, are inevitable in real scenarios, and seriously deteriorate image matching performance due to their significant influence on the image naturalness and details. In this paper, a spatial-frequency domain associated image-optimization method, comprising two main models, is specially designed for improving image matching with complex illuminations. First, an adaptive luminance equalization is implemented in the spatial domain to reduce radiometric variations, instead of removing all illumination components. Second, a frequency domain analysis-based feature-enhancement model is proposed to enhance image features while preserving image naturalness and restraining over-enhancement. The proposed method associates the advantages of the spatial and frequency domain analyses to complete illumination equalization, feature enhancement and naturalness preservation, and thus acquiring the optimized images that are robust to the complex illuminations. More importantly, our method is generic and can be embedded in most image-matching schemes to improve image matching. The proposed method was evaluated on two different datasets and compared with four other state-of-the-art methods. The experimental results indicate that the proposed method outperforms other methods under complex illuminations, in both matching performances and practical applications such as structure from motion and multi-view stereo.

Author(s):  
Keivan Etessam-Yazdani ◽  
Hendrik F. Hamann ◽  
Mehdi Asheghi

In this paper we present a novel analytical approach for obtaining the thermal transfer function of multi-layer chips in the spatial frequency domain. The behavior of the transfer function is used to address a number of key issues such as 1) the appropriate power granularity required for microarchitecture thermal-power analysis, and 2) the impact of packaging and cooling solutions on heat removal from chip hotspots. The merit of the presented method is in 1) simplicity, such that even for rather complicated multi-layer structures the analysis takes only a fraction of a second, and 2) accuracy, because the approach is based on the exact solution of three-dimensional heat diffusion equations.


Measurement ◽  
2020 ◽  
Vol 151 ◽  
pp. 107171
Author(s):  
A. Anastasiou ◽  
F. Papastamati ◽  
A. Bakas ◽  
C. Michail ◽  
V. Koukou ◽  
...  

2017 ◽  
Vol 22 (7) ◽  
pp. 076007 ◽  
Author(s):  
Mira Sibai ◽  
Carl Fisher ◽  
Israel Veilleux ◽  
Jonathan T. Elliott ◽  
Frederic Leblond ◽  
...  

2021 ◽  
Author(s):  
Armin J. M. Lenz ◽  
Pere Clemente ◽  
Vicent Climent ◽  
Jesús Lancis ◽  
Enrique Tajahuerce

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