High current of GaInNAs solar cell integrating distributed Bragg reflectors grown by metalorganic vapor phase epitaxy

Author(s):  
Xiaobin Zhang ◽  
Wenyi Yang ◽  
Liming Liu ◽  
Jianqing Liu ◽  
Kaiwen Lin ◽  
...  
2020 ◽  
Vol 13 (12) ◽  
pp. 125504
Author(s):  
Takanobu Akagi ◽  
Yugo Kozuka ◽  
Kazuki Ikeyama ◽  
Sho Iwayama ◽  
Masaru Kuramoto ◽  
...  

2002 ◽  
Vol 80 (2) ◽  
pp. 174-176 ◽  
Author(s):  
H. P. D. Schenk ◽  
P. de Mierry ◽  
P. Vennéguès ◽  
O. Tottereau ◽  
M. Laügt ◽  
...  

2008 ◽  
Vol 1108 ◽  
Author(s):  
L E Rodak ◽  
D Korakakis

AbstractNitride based Distributed Bragg Reflectors (DBRs) have several important applications in current nitride based optoelectronic devices. DBRs can be implemented in resonant cavity light emitting diodes (RCLEDs) to improve light extraction and obtain a more directional emission and in vertical cavity surface emitting lasers (VCSELs) to achieve a lower threshold current. Due the large contrast in refractive index, AlN/GaN DRBs are practical for obtaining high reflectivity and wide bandwidth using relatively few periods. Cracking of the samples is typical for AlN/GaN DRBs due to the tensile strain which results from the 2.4% lattice mismatch and to the difference in thermal expansion coefficients. In addition to cracks, v-shaped defects may also arise in the surface due to surface undulation from stored elastic misfit strain or from threading dislocations that result in scattering and diffraction. Several techniques to reduce the number of cracks and defects have been investigated to obtain smooth surface morphology and high reflectivity, e.g. superlattices to reduce the strain or the growth of AlInGaN/GaN DBRs that offer less lattice mismatch but also lower refractive index contrast. In this work, results of the use of Indium (In) as a surfactant in Metal Organic Vapor Phase Epitaxy (MOVPE) will be discussed. This study addresses AlN/GaN DBR structures designed for peak reflectivity around 465 nm. During the AlN layers’ growth, trimethylindium was introduced to the system and resulted in a reduction of surface cracks. Results of growths at In flow rates are reported and discussed.


2009 ◽  
Vol 1195 ◽  
Author(s):  
L E Rodak ◽  
Christopher M Miller ◽  
D Korakakis

AbstractDistributed Bragg Reflectors (DBRs) remain critical to the fabrication of various nitride based optoelectronic devices. In particular, DBRs are often employed for cavity formation in Resonant Cavity Light Emitting Diodes (RCLEDs) to enhance and obtain a more directional emission and also in Vertical Cavity Surface Emitting Lasers (VCSELs). As a result, epitaxially grown reflectors are attractive for direct integration in the device, reduced processing requirements, and the formation of narrow cavities. In the III-Nitride material system, Aluminum Nitride (AlN) and Gallium Nitride (GaN) offer a large contrast in refractive index and are therefore well suited for fabricating DBRs with high reflectivity and wide bandwidths using relatively few periods. However, material cracking arising from to the 2.4% lattice mismatch and difference in thermal expansion coefficient decreases reflectivity and is detrimental to the efficiency of subsequent device fabrication. Several techniques, such as superlattice insertion layers or the growth of AlxIn1-xN layers, have been employed to reduce strain and cracking in such structures. In this work, results of the use of indium as a surfactant in the Metal Organic Vapor Phase Epitaxy (MOVPE) of AlN/GaN DBRs will be discussed. Specifically, this study targets AlN/GaN DBRs with peak reflectivity at ranging from 465 nm to 540 nm. Indium has been used as a surfactant during growth by introducing trimethylindium into the system. It has been shown that crack formation is dependent on the flow of the indium precursor despite minimal indium incorporation into the lattice. Image processing techniques were used to quantify the crack length per square millimeter and it was observed that indium has a significant effect on the crack formation and can be used to reduce the total crack length in these structures by a factor of two.


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