Особенности газофазной эпитаксии GaAs на непланарных подложках

The features of the surface shape of GaAs epitaxial layers grown on grooves several micrometers wide with vertical walls and an aspect ratio close to unity are investigated. The grooves are formed on the surface of a GaAs wafer in a plasma-chemical etching installation and overgrown by organometallic vapor-phase epitaxy under reduced pressure in a reactor.

Connection between Carbon Incorporation and Growth Rate for GaN Epitaxial Layers Prepared by OMVPE

Carbon, a compensator in GaN, is an inherent part of the organometallic vapor phase epitaxy (OMVPE) environment due to the use of organometallic sources. In this study, the impact of growth conditions are explored on the incorporation of carbon in GaN prepared via OMVPE on pseudo-bulk GaN wafers (in several cases, identical growths were performed on GaN-on-Al2O3 templates for comparison purposes). Growth conditions with different growth efficiencies but identical ammonia molar flows, when normalized for growth rate, resulted in identical carbon incorporation. It is concluded that only trimethylgallium which contributes to growth of the GaN layer contributes to carbon incorporation. Carbon incorporation was found to decrease proportionally with increasing ammonia molar flow, when normalized for growth rate. Ammonia molar flow divided by growth rate is proposed as a reactor independent predictor of carbon incorporation as opposed to the often-reported input V/III ratio. A low carbon concentration of 7.3 × 1014 atoms/cm3 (prepared at a growth rate of 0.57 µm/h) was obtained by optimizing growth conditions for GaN grown on pseudo-bulk GaN substrates.

High-Power Eu-Doped GaN Red LED Based on a Multilayer Structure Grown at Lower Temperatures by Organometallic Vapor Phase Epitaxy

ABSTRACTA modification of the growth structure of Eu-doped GaN (GaN:Eu) from a monolayer to a multilayer structure (MLS) consisting of alternating GaN and GaN:Eu, was shown to enhance the emission properties. Similarly, lowering the growth temperature of the GaN:Eu to 960°C nearly doubled the photoluminescence emission intensity, and also enhanced device performance. Hence, to design a higher power GaN:Eu red LED, a multilayer structure consisting of 40 pairs of alternating GaN and GaN:Eu was grown at 960°C. This combination resulted in the fabrication of an LED with a maximum output power of 110 μW, which is 5.8 times more output power per GaN:Eu layer thickness as compared to the best previously reported device. Moreover, it was found that the MLS sample grown at 960°C maintained a high crystal quality with low surface roughness, which enabled an increase in the number of pairs from 40 pairs to 100 pairs. An MLS-LED consisting of 100 pairs of alternating GaN/GaN:Eu layers was successfully fabricated, and had a maximum output power of 375 μW with an external quantum efficiency of 4.6%. These are the highest values reported for this system.