Quality Improvement in XY Process at ABC Corporation

ABC Corporation is a Taiwanese company that manufactures metal, other related products, and industry in need of thin sheet metal fabrication. The main objective of the study is to improve the M450G1010Z08 that occurred in press brake section, which is the primary problem of the company. The researchers used the Six Sigma Methodology as a technique of reducing quality issues. The research design used in the study is applied research. Based on the result of the study, the researchers found out through stratification process that the main problem was the wrong dimension of M450G1010Z08. In the measure phase, the researchers measured the wrong dimension defects using binomial process capability, which resulted in processing Z value of 1.08, indicating the process is not capable. In the analyze phase, researchers found out that the root cause of the problem is the open size of mould that exceeds 0.20 mm in the front side. In the improve phase, the procedure for modification of mould was done to meet the project target from 14.12% to 4%. After the implementation, the researchers found out that the wrong dimension of M450G1010Z08 was reduced from 14.12% to 2.12%. Also, the process Z increased from 1.08 to 2.03 and investigated that the process performance is capable after the implementation of the improvement. The improvement was done to improve work instruction for modification of the open size of the mould.

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A DMAIC Six Sigma approach to quality improvement in the anodising stage of the amplifier production process

International Journal of Quality & Reliability Management ◽

10.1108/ijqrm-08-2017-0155 ◽

2018 ◽

Vol 35 (9) ◽

pp. 1868-1880 ◽

Cited By ~ 2

Author(s):

Pallavi Sharma ◽

Suresh Chander Malik ◽

Anshu Gupta ◽

P.C. Jha

Keyword(s):

Quality Improvement ◽

Production Process ◽

Six Sigma ◽

Shop Floor ◽

Manufacturing Firm ◽

Content Type ◽

Root Cause ◽

Six Sigma Methodology ◽

Six Sigma Approach ◽

Current Reality

Purpose The purpose of this paper is to study the anodising process of a portable amplifier production process to identify and eliminate the sources of variations, in order to improve the process productivity. Design/methodology/approach The study employs the define-measure-analyse-improve-control (DMAIC) Six Sigma methodology. Within the DMAIC framework various tools of quality management such as SIPOC analysis, cause and effect diagram, current reality tree, etc., are used in different stages. Findings High rejection rate was found to be the main problem leading to lower productivity of the process. Four types of defects were identified as main cause of rejections in the baseline process. Pareto analysis resulted in detection of the top defects, which were then analysed in details to find the root cause of the problem. Further study resulted in finding improvement measures that were discussed with the management before implementation. The process is sampled again to check the improvements, and control measures were established. Practical implications The study provides a framework for implementation of DMAIC Six Sigma methodology for a manufacturing firm. The results presented are based on the data collected from the shop floor. Results and findings of the study were implemented for quality improvement of the process. Originality/value The study is based on an original research conducted with the objective of quality improvement in the anodising process of the production process. Besides presenting an approach to DMAIC Six Sigma methodology, an application of the current reality tree tool for root cause analysis is presented, a tool used limitedly in the Six Sigma studies. The tool finds its uniqueness in its ability to address problems relating multiple factors than isolated factors.

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Contactless Chip Module Defect Reduction

Solid State Phenomena ◽

10.4028/www.scientific.net/ssp.305.59 ◽

2020 ◽

Vol 305 ◽

pp. 59-64

Author(s):

Thunwarat Sawatsuphaphon ◽

Parames Chutima

Keyword(s):

Integrated Circuits ◽

Six Sigma ◽

Defect Reduction ◽

Root Cause ◽

Defect Rate ◽

Manufacturing Company ◽

Six Sigma Methodology

This research was conducted in a manufacturing company that produces integrated circuits for global customers. The purpose of this research was to reduce defect rate from the assembly department that affected to product lots on hold at the test department for the contactless chip module package which had an increasing product lots on hold rate of 9.5% in March 2019 based on the reject criteria V_limiter (REQA). The potential cause of defect came from die crack. In order to reduce defect rate, the 5 steps of DMAIC Six Sigma methodology were applied in this research to identify the root cause of the problem and establish effective actions. After the improvement, the product (lots) on hold criteria V_limiter (REQA) was reduced from 9.5% to 5.82% in July 2019.

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Use of Electronic Modules on Device for Tribological Research in the Field of Plastic Deformation of Slim Metal Sheets

JITA - Journal of Information Technology and Applications (Banja Luka) - APEIRON ◽

10.7251/jit2002081v ◽

2020 ◽

Vol 20 (2) ◽

Author(s):

Tomislav Vujinović ◽

Dragan Mihić ◽

Esad Jakupović

Keyword(s):

Plastic Deformation ◽

Sheet Metal ◽

Thin Sheet ◽

Scientific Paper ◽

Research Process ◽

Metal Fabrication ◽

Research Systems ◽

Metal Sheets ◽

Thin Sheet Metal ◽

Numerical Process

Electronic modules are important components of manufacturing and research equipment in the field of plastic deformation of sheet metal fabrication, as well as in other processes. Depending on the type and complexity of the production or research process, different electronic modules are also used. The indispensable electronic modules in production as well as experimental (research) systems are: encoders, signal processing, A/D and D/A converters, required software of all levels, all the way to large packages for numerical process simulation. This scientific paper presents an original computerized device for testing tribological influences in plastic deformation of slim (thin) sheet metal forming (fabrication), whose control base consists of electronic modules. Some results are also shown as dependencies, obtained by testing on this developed device.

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Reduction of defects in the lapping process of the silicon wafer manufacturing: the Six Sigma application

Engineering Management in Production and Services ◽

10.2478/emj-2019-0013 ◽

2019 ◽

Vol 11 (2) ◽

pp. 87-105

Author(s):

Mithun Sharma ◽

Sanjeev P. Sahni ◽

Shilpi Sharma

Keyword(s):

Silicon Wafer ◽

Six Sigma ◽

Semiconductor Industry ◽

Stability Control ◽

Thickness Variation ◽

Root Cause ◽

Six Sigma Methodology ◽

And Control ◽

Wafer Manufacturing

Abstract Aiming to reduce flatness (Total Thickness Variation, TTV) defects in the lapping process of the silicon wafer manufacturing, it is crucial to understand and eliminate the root cause(s). Financial losses resulting from TTV defects make the lapping process unsustainable. DMAIC (Define, Measure, Analyse, Improve and Control), which is a Six Sigma methodology, was implemented to improve the quality of the silicon wafer manufacturing process. The study design and the choice of procedures were contingent on customer requirements and customised to ensure maximum satisfaction; which is the underlying principle of the rigorous, statistical technique of Six Sigma. Previously unknown causes of high TTV reject rates were identified, and a massive reduction in the TTV reject rate was achieved (from 4.43% to 0.02%). Also, the lapping process capability (Ppk) increased to 3.87 (beyond the required standard of 1.67), suggesting sustainable long-term stability. Control procedures were also effectively implemented using the techniques of poka yoke and control charts. This paper explores the utility of Six Sigma, a quality management technique, to improve the quality of a process used in the semiconductor industry. The application of the Six Sigma methodology in the current project provides an example of the root cause investigation methodology that can be adopted for similar processes or industries. Some of the statistical tools and techniques were used for the first time in this project, thereby providing new analysis and quality improvement platform for the future. The article offers a deeper understanding of the factors that impact on the silicon wafer flatness in the lapping process. It also highlights the benefits of using a structured problem-solving methodology like Six Sigma.

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Application of lean six sigma methodology to improve the weight inconsistency problem of coffee powder packaging

Jurnal Sistem dan Manajemen Industri ◽

10.30656/jsmi.v5i2.3729 ◽

2021 ◽

Vol 5 (2) ◽

pp. 74-86

Author(s):

Nik Alimi Nik Aziz ◽

Rosmaini Ahmad ◽

Shaliza Azreen Mustafa ◽

Tan Chan Sin ◽

Muhammad Shahar Jusoh

Keyword(s):

Six Sigma ◽

Lean Manufacturing ◽

Manufacturing Industry ◽

Evaluation Process ◽

Lean Six Sigma ◽

Improvement Strategy ◽

Packaging Process ◽

Root Cause ◽

Coffee Powder ◽

Six Sigma Methodology

This paper presents a continuous improvement (CI) project based on the application of Lean Six Sigma (LSS) methodology. This project was carried out at coffee manufacturing industry located in northern area of Malaysia. The focus of this presented CI project is to improve the weight inconsistency problem of coffee powder packaging. The presented CI project was mainly guided with Six Sigma methodology of Define, Measure, Analyze, Improve and Control (DMAIC) steps, and related Lean tools applications. The step of Define summaries the overall view of CI project. In the step of Measure, current level of sigma based on defect per million of opportunities (DPMO) calculation was determined. Initially, 6% of rejected products were recorded, which it presents the sigma level at 3.1. In the step of Analyze, a series of team-based activities towards root cause identification was carried out. It included the applications of cause effect (CE) analysis and possible causes prioritization and close observations on packaging process. In the step of Improve, the related Lean tool was proposed to improve the problem under study. In the final step of Control, related supportive actions were suggested to sustain the effectiveness of the proposed solution. There are fourteen possible causes are initially identified in CE analysis and based on team’s evaluation process of possible causes prioritization four causes are collectively to be the most possible of root cause(s). Three close observation sessions were carried out to finalize the most possible root cause of the problem. Result strongly suggested that the high variation of coffee powder’s size and inconsistency is the root cause. An improvement strategy based on Lean Manufacturing approach called ‘poka yoke’ is proposed. The proposed improvement strategy was then validated based on real packaging process scenario. Result shows that the proposed improvement strategy is significantly effective to solve the problem with 0% of reject product was recorded so far, where it is not only produced the product within the acceptable weight of 215 and 208 grams, but also presents the reduction of weight fluctuation that close to ideal weight of 208 grams.

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Shainin Methodology: An Alternative or an Effective Complement to Six Sigma?

Quality Innovation Prosperity ◽

10.12776/qip.v19i2.580 ◽

2015 ◽

Vol 19 (2) ◽

pp. 18 ◽

Cited By ~ 1

Author(s):

Jan Kosina

Keyword(s):

Problem Solving ◽

Six Sigma ◽

Elimination Method ◽

Automotive Supplier ◽

Root Cause ◽

Six Sigma Methodology ◽

Problem Solving Strategy ◽

Solving Strategy ◽

Dominant Root

<div><strong>Purpose:</strong> The purpose of this paper is to provide a brief overview of Six Sigma and Shainin RedX® methodology and to propose the modification of Six Sigma methodology in order to achieve the improved efficiency of DMAIC in the diagnostic journey using some of the approaches of Shainin RedX® methodology.</div><div> </div><div><strong>Methodology/Approach:</strong> The diagnostic journey of Six Sigma has been revised by bringing key elements of Shainin RedX® methodology into DMAIC: task domain character of the method, focus on the dominant root-cause, use of the progressive elimination method and the application of a problem-solving strategy.</div><div> </div><div><strong>Findings:</strong> This paper presents a proposal of DMAIC framework modification using selected tools and procedures of Shainin RedX® methodology in the diagnostic phase.</div><div> </div><div><strong>Research Limitation/implication:</strong> Although the improved methodology is used in the environment of the automotive supplier, in this paper, practical examples are not included in order not to violate the licensing rules applied by Shainin LLC.</div><div> </div><div><strong>Originality/Value of paper:</strong> The contribution of this article is the proposal of modified methodology, which should improve the effectiveness of problem-solving.</div>

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Stainless Steel Welding in Railways

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.794.340 ◽

2013 ◽

Vol 794 ◽

pp. 340-350

Author(s):

R. Ravichandran

Keyword(s):

Stainless Steel ◽

Sheet Metal ◽

Manufacturing Sector ◽

Hsla Steel ◽

Thin Sheet ◽

Advanced Technology ◽

Thick Sheet ◽

Metal Fabrication ◽

Thin Sheet Metal ◽

High Level

Railways form the lifeline of the transport network in our country. Indian Railways command a large market share of the over-land passenger and freight traffic. To sustain this, rail industry is required to technologically and commercially challenge superior highways and advanced technology of road vehicles and also the competitive airlines. Thick and thin sheet metals are widely used in wagon and rail car body fabrication respectively. Rail coach manufacturing sector is in the new challenging phase due to acquirement and adoption of German and Korean technologies and arrival of multinational companies viz M/S Bombardier & M/S Alstom. Thin sheet metal fabrication demands aerodynamic profiles larges size bodies with high level of aesthetic and dent free surface. Thick sheet metal fabrication demands larges size bodies with high level of structural rigidity and dimensional stability .The outer skin of the rail coach body is generally made through thin sheet metal parts and stiffened with moldings, pressings and stamped sections. In the recent past rail car manufactures has been switching over from HSLA steel to stainless steel to acquire the benefit of the later: primarily corrosion resistance Capability and durability and ease of maintenance. The manufacturing practices, challenges addressed during fabrication are brought out.

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