EXPERIMENTAL RESEARCH ON HEAT TRANSFER PERFORMANCE OF DIRECTIOANLLY SOLIDIFIED POROUS COPPER HEAT SINK

Porous copper fabricated by unidirectional solidification of metal-gas eutectic can be used to manufacture a special kind of micro-channel heat sink. A three dimensional model is developed to investigate the heat transfer in porous copper heat sink. However the experimental results of heat transfer performance are far less than the simulation results. That is mainly because some of the pores are nonpenetrative. When the simulation model is modified by taking the penetration ratio into account the experimental results are consistent with the simulation results.

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Heat Transfer Performance of Lotus-Type Porous Copper Micro-Channel Heat Sink

Materials Science Forum ◽

10.4028/www.scientific.net/msf.749.414 ◽

2013 ◽

Vol 749 ◽

pp. 414-420

Author(s):

Hai Feng Chen ◽

Yuan Liu ◽

Liu Tao Chen ◽

Yan Xiang Li

Keyword(s):

Heat Transfer ◽

Heat Transfer Coefficient ◽

Transfer Coefficient ◽

Heat Sink ◽

Heat Transfer Performance ◽

Channel Structure ◽

Working Fluid ◽

Transfer Performance ◽

Micro Channel ◽

Porous Copper

Lotus-type porous structure is a new kind of micro-channel structure and can be used as heat sink for heat elimination of high powered electronic devices. Numerical analysis based on the simple fin model was used to predict the equivalent heat transfer coefficient of lotus-type porous copper micro-channel heat sink. Compared with the water, GaInSn working fluid could further promote the heat transfer performance of the heat sink. According to the theoretical analysis, a heat transfer coefficient as high as 14W/(cm2K) was attainable when the pressure drop was 50 KPa and an appropriate structure parameters: 0.4 mm in pore diameter, 0.4 in porosity and 4mm in height of porous copper were achieved.

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Comparative Study of Heat Transfer Performance of Open and Closed Rectangular Microchannel Heat Sink

Proceeding of Proceedings of the 25th National and 3rd International ISHMT-ASTFE Heat and Mass Transfer Conference (IHMTC-2019) ◽

10.1615/ihmtc-2019.560 ◽

2019 ◽

Author(s):

Anurag Maheswari ◽

Yogesh Kumar Prajapati

Keyword(s):

Heat Transfer ◽

Comparative Study ◽

Heat Sink ◽

Heat Transfer Performance ◽

Microchannel Heat Sink ◽

Transfer Performance ◽

Rectangular Microchannel

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Boiling/Evaporation Heat Transfer Augmentation Using Subchannels-Inserted Metal Porous Media

Volume 2: Heat Transfer Enhancement for Practical Applications; Heat and Mass Transfer in Fire and Combustion; Heat Transfer in Multiphase Systems; Heat and Mass Transfer in Biotechnology ◽

10.1115/ht2013-17220 ◽

2013 ◽

Cited By ~ 2

Author(s):

Kazuhisa Yuki ◽

Masahiro Uemura ◽

Koichi Suzuki ◽

Ken-ichi Sunamoto

Keyword(s):

Heat Transfer ◽

Porous Medium ◽

Heat Sink ◽

Heat Transfer Performance ◽

Electronic Devices ◽

High Heat Flux ◽

Transfer Performance ◽

Power Electronic ◽

Copper Particles ◽

Evaporation Heat

Two-phase flow loop system using a metal porous heat sink is proposed as a cooling system of the future power electronic devices with a heat load exceeding 300W/cm2. In this paper, as the first step, the heat transfer performance of the porous heat sink is evaluated under high heat flux conditions and the applicability and some engineering issues are discussed. The porous medium, which is fabricated by sintering copper particles, has a functional structure with several sub-channels inside it to enhance phase-change as well as discharge of generated vapor outside the porous medium. This porous heat sink is attached onto a heating chip and removes the heat by evaporating cooling liquid passing through the porous medium against the heat flow. Experiments using 30 kW of heating system show that the heat transfer performance of a copper-particles-sintered porous medium with the sub-channels exceeds 800W/cm2 in both high and low subcooling cases and achieves 300W/cm2 at a wall temperature of 150 °C (Tin = 70 °C) and 130 °C (Tin = 70 °C). These results prove that this porous heat sink is applicable enough for cooling 300 W/cm2 class of power electronic devices.

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