Boiling/Evaporation Heat Transfer Augmentation Using Subchannels-Inserted Metal Porous Media

2013 ◽  
Author(s):  
Kazuhisa Yuki ◽  
Masahiro Uemura ◽  
Koichi Suzuki ◽  
Ken-ichi Sunamoto
Keyword(s):  
Heat Transfer ◽  
Porous Medium ◽  
Heat Sink ◽  
Heat Transfer Performance ◽  
Electronic Devices ◽  
High Heat Flux ◽  
Transfer Performance ◽  
Power Electronic ◽  
Copper Particles ◽  
Evaporation Heat

Two-phase flow loop system using a metal porous heat sink is proposed as a cooling system of the future power electronic devices with a heat load exceeding 300W/cm2. In this paper, as the first step, the heat transfer performance of the porous heat sink is evaluated under high heat flux conditions and the applicability and some engineering issues are discussed. The porous medium, which is fabricated by sintering copper particles, has a functional structure with several sub-channels inside it to enhance phase-change as well as discharge of generated vapor outside the porous medium. This porous heat sink is attached onto a heating chip and removes the heat by evaporating cooling liquid passing through the porous medium against the heat flow. Experiments using 30 kW of heating system show that the heat transfer performance of a copper-particles-sintered porous medium with the sub-channels exceeds 800W/cm2 in both high and low subcooling cases and achieves 300W/cm2 at a wall temperature of 150 °C (Tin = 70 °C) and 130 °C (Tin = 70 °C). These results prove that this porous heat sink is applicable enough for cooling 300 W/cm2 class of power electronic devices.

An Efficient Wavy Microchannel Heat Sink for Electronic Devices

2009 ◽  
Author(s):  
Y. Sui ◽  
C. J. Teo ◽  
P. S. Lee ◽  
Y. T. Chew ◽  
C. Shu
Keyword(s):  
Heat Transfer ◽  
Heat Sink ◽  
Heat Transfer Performance ◽  
Flow Direction ◽  
Electronic Devices ◽  
Metal Substrate ◽  
Chaotic Advection ◽  
Fluid Mixing ◽  
Transfer Performance ◽  
Dean Vortices

In this paper, we have designed a compact and efficient liquid-cooled heat sink for mini-sized electronic devices, particularly for very-large-scale integrated (VLSI) circuits. The heat sink can either be an integral part of the silicon (or metal) substrate, or a separate part attached onto the substrate. The heat sink consists of several wavy microchannels, with hydraulic diameter on the order of 100 μm, microfabricated on a silicon or metal substrate. The fluid flow and heat transfer performance of the heat sink are studied using numerical simulations in the steady laminar flow region and the dynamical system technique using Poincare´ sections is employed to analyze the fluid mixing. It is found that when the liquid coolant flows through the wavy microchannel, Dean vortices can develop. The quantity and location of the Dean vortices may change along the flow direction, which can lead to laminar chaos. The chaotic advection greatly enhances the fluid mixing, and thus the heat transfer performance of the present heat sink is much more superior than previous designs which employed straight microchannels. It is also found that the pressure drop penalty is much smaller that the heat transfer enhancement for the present heat sink. Furthermore, the relative wavy amplitude (wavy amplitude/wavelength) of the channels can be varied along the flow direction for various purposes, without compromising the compactness and efficiency of the heat sink. The relative waviness can be increased along the flow direction, which results in higher heat transfer coefficients and renders the temperature for the devices much more uniform. The relative waviness can also be designed to be higher in regions of high heat flux for hot spot mitigation purposes.

Proposal of a Micro/Mini Cooling Device Using Fins-Installed Porous Media for High Heat Flux Removal Exceeding 1000W/cm2

2009 ◽  
Author(s):  
Kazuhisa Yuki ◽  
Akira Matsui ◽  
Hidetoshi Hashizume ◽  
Koichi Suzuki
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Heat Sink ◽  
Heat Transfer Performance ◽  
High Heat ◽  
Heat Sinks ◽  
High Heat Flux ◽  
Transfer Performance ◽  
Cooling Device ◽  
Fin Thickness

Heat transfer characteristics of micro-sized bronze particle-sintered porous heat sinks and copper minichannel-fins heat sinks are experimentally investigated in order to clarify the feasibility of a newly proposed micro/mini cooling device using fins-installed porous media. Regarding the porous heat sinks, fin effect toward more inside of the porous medium is promoted by sintering the porous heat sink on the heat transfer surface, which results in increasing the heat transfer performance up to 0.8MW/m2K at heat flux of 8.2MW/m2 though there still remains a large pressure loss issue. In addition, the results clarify that the heat exchanging area exists only in the vicinity of the heat transfer surface. As to the minichannel-fins heat sinks, the influence of the channel width and the fin thickness are evaluated in detail. As a result, the minichannel-fins heat sink having the narrower channel width (i.e. scale effect) and lower porosity (i.e. thicker fin thickness with larger heat capacity) achieves higher heat transfer performance up to 0.10MW/m2K at 8.3MW/m2. However, rapid increase of pressure loss, which is occasionally observed in a microchannel due to vapor bubbles choking the narrow channel, still remains as an issue under flow boiling conditions in the minichannel. Finally, heat transfer performance of the fin-installed porous heat sink is numerically predicted by the control volume method. The simulation confirms that the heat transfer coefficient at each wall superheat of 0 and 30 degrees has performance 2.5 times and 2.0 times higher than that of the normal fins, which indicates that this heat sink coupling the micro and mini channels has high potential as efficient cooling method under high heat flux conditions exceeding 10MW/m2.

The Effects of Hybrid Sandblasting Patterns on the Heat Transfer Performance in a Single-Phase Microchannel Heat Sink

2017 ◽  
Author(s):  
Saad K. Oudah ◽  
Ruixian Fang ◽  
Amitav Tikadar ◽  
Karim Egab ◽  
Chen Li ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Heat Sink ◽  
Single Phase ◽  
Heat Transfer Performance ◽  
Bottom Surface ◽  
High Heat Flux ◽  
Microchannel Heat Sink ◽  
Transfer Performance ◽  
Two Phase ◽  
Number Range

An experimental investigation was conducted on a single phase microchannel heat sink, in which the bottom surface of the microchannel was modified with hybrid micro-sandblasting of elliptical patterns (HSEP) and fully sandblasting (FS) to passively enhance the microchannel heat transfer performance. The dimension of the microchannel is measured as 26 mm (L) × 5mm (W) × 0.35 mm (H), which results in a hydraulic diameter of 654 μm. Deionized water was used as the coolant, and the Reynolds number range between 85 to 650 was tested. The experimental results show that fully sandblasting (FS) bottom surface of the microchannel only slightly improved the heat transfer performance. However, the modified surface with HSEP enhanced the heat transfer performance substantially, compared to the benchmark results obtained with the bare surface (BS) microchannel. The pressure drops of the HSEP increased slightly compared to the BS and FS, due to the flow resistance of the microstructures. The proposed surface for enhancement of heat transfer will be useful in many high heat flux engineering applications. In the future, this study will be further extended to two-phase microchannel heat transfer.

scholarly journals A review of passive methods in microchannel heat sink application through advanced geometric structure and nanofluids: Current advancements and challenges

2020 ◽  
Vol 9 (1) ◽  
pp. 1192-1216
Author(s):  
Wan Mohd. Arif Aziz Japar ◽  
Nor Azwadi Che Sidik ◽  
Rahman Saidur ◽  
Yutaka Asako ◽  
Siti Nurul Akmal Yusof
Keyword(s):  
Heat Transfer ◽  
Pressure Drop ◽  
Integrated Circuit ◽  
Heat Sink ◽  
Heat Transfer Performance ◽  
Electronic Devices ◽  
Microchannel Heat Sink ◽  
Transfer Performance ◽  
Heat Transfer Augmentation ◽  
Power Integrated Circuit

AbstractMicrochannel heat sink (MCHS) is an advanced cooling technique to fulfil the cooling demand for electronic devices installed with high-power integrated circuit packages (microchips). Various microchannel designs have been innovated to improve the heat transfer performance in an MCHS. Specifically, the utilisation of nanotechnology in the form of nanofluid in an MCHS attracted the attention of researchers because of considerable enhancement of thermal conductivity in nanofluid even at a low nanoparticle concentration. However, a high-pressure drop was the main limitation as it controls the MCHS performance resulted from heat transfer augmentation. Therefore, this study aimed to critically summarise the challenges and limitations of both single and hybrid passive methods of MCHS. Furthermore, the performance of nanofluid as a coolant in the MCHS as affected by the type and concentration of nanoparticle and the type of base fluid was reviewed systematically. The review indicated that the hybrid MCHS provides a better cooling performance than MCHS with the single passive method as the former results in a higher heat transfer rate with minimal pressure drop penalty. Besides that, further heat transfer performance can be enhanced by dispersing aluminium dioxide (Al2O3) nanoparticles with a concentration of less than 2.0% (v/v) in the water-based coolant.

scholarly journals Enhanced heat transfer characteristics of conjugated air jet impingement on a finned heat sink

2017 ◽  
Vol 21 (1 Part A) ◽  
pp. 279-288 ◽  
Author(s):  
Shuxia Qiu ◽  
Peng Xu ◽  
Liping Geng ◽  
Arun Mujumdar ◽  
Zhouting Jiang ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Enhancement ◽  
Heat Sink ◽  
Heat Transfer Performance ◽  
Cooling System ◽  
Flow Characteristics ◽  
Jet Impingement ◽  
Transfer Performance ◽  
Transfer Enhancement ◽  
Air Jet

Air jet impingement is one of the effective cooling techniques employed in micro-electronic industry. To enhance the heat transfer performance, a cooling system with air jet impingement on a finned heat sink is evaluated via the computational fluid dynamics method. A two-dimensional confined slot air impinging on a finned flat plate is modeled. The numerical model is validated by comparison of the computed Nusselt number distribution on the impingement target with published experimental results. The flow characteristics and heat transfer performance of jet impingement on both of smooth and finned heat sinks are compared. It is observed that jet impingement over finned target plate improves the cooling performance significantly. A dimensionless heat transfer enhancement factor is introduced to quantify the effect of jet flow Reynolds number on the finned surface. The effect of rectangular fin dimensions on impingement heat transfer rate is discussed in order to optimize the cooling system. Also, the computed flow and thermal fields of the air impingement system are examined to explore the physical mechanisms for heat transfer enhancement.

scholarly journals Simulation analysis of heat transfer performance of heat sink with reduced material design

2020 ◽  
Vol 12 (5) ◽  
pp. 168781402092130
Author(s):  
Ya-Chu Chang
Keyword(s):  
Heat Transfer ◽  
Reynolds Number ◽  
Thermal Resistance ◽  
Heat Sink ◽  
Heat Transfer Performance ◽  
Electronic Device ◽  
Local Heating ◽  
Transfer Performance ◽  
Electronic Components ◽  
Thermal Reliability

The field of electronic device applications is becoming more and more extensive. With the development of science and technology and the improvement of the integration of electronic components, local heating is becoming more and more serious. If heat cannot be discharged immediately, it will cause heat to accumulate, causing the temperature of each component to exceed the limit. The reliability of electronic equipment is greatly reduced. Especially in important fields such as military and aerospace, the thermal reliability of electronic components is higher. The research results show that increasing the Reynolds number is helpful to reduce the overall temperature and thermal resistance of the heat sink, but the increase of the Reynolds number and the decrease of the thermal resistance value are gradually flat. The design concept of material reduction has a significant impact on processing and cost. The results of this article show that selecting the appropriate heat sink fins and matching the specific Reynolds number can effectively improve the heat transfer performance of the heat sink.

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