Measurement of full-field strain incell phone dropping test by high-speed 3D digital image correlation method

2018 ◽  
Vol 26 (9) ◽  
pp. 2174-2180
Author(s):  
王立忠 WANG Li-zhong ◽  
汪 耀 WANG Yao ◽  
梁 晋 LIANG Jin ◽  
戴晨光 DAI Chen-guang
Keyword(s):  
Digital Image Correlation ◽  
Digital Image ◽  
High Speed ◽  
Correlation Method ◽  
Image Correlation ◽  
Field Strain ◽  
Digital Image Correlation Method ◽  
Full Field ◽  
3D Digital Image Correlation

High-speed digital-image correlation method

2009 ◽  
Vol 34 (13) ◽  
pp. 1955 ◽  
Author(s):  
Min Wang ◽  
Hao Wang ◽  
Yuwan Cen
Keyword(s):  
Digital Image Correlation ◽  
Digital Image ◽  
High Speed ◽  
Correlation Method ◽  
Image Correlation ◽  
Digital Image Correlation Method

Measurement of Transient Dynamic Response of Circuit Boards of a Handheld Device During Drop Using 3D Digital Image Correlation

2008 ◽  
Vol 130 (4) ◽  
Author(s):  
S. B. Park ◽  
Chirag Shah ◽  
Jae B. Kwak ◽  
Changsoo Jang ◽  
Soonwan Chung ◽  
...  
Keyword(s):  
Digital Image Correlation ◽  
Digital Image ◽  
High Speed ◽  
Image Correlation ◽  
Impact Response ◽  
Experimental Methodology ◽  
Full Field ◽  
Handheld Device ◽  
3D Digital Image Correlation ◽  
The Impact

In this work, a new experimental methodology for analyzing the drop impact response is assessed using a pair of high-speed digital cameras and 3D digital image correlation software. Two different test boards are subjected to Joint Electron Device Engineering Council (JEDEC) standard free-fall impact conditions of half-sine pulse of 1500 G in magnitude and 0.5 ms in duration. The drop is monitored using a pair of synchronized high-speed cameras at a rate of up to 15,000 frames per second. The acquired images are subsequently analyzed to give full-field dynamic deformation, shape, and strain over the entire board during and after impact. To validate this new methodology for analyzing the impact response, the in-plane strain as well as the out-of-plane acceleration at selected locations were measured simultaneously during the drop using strain gauge and accelerometers and were compared with those obtained using high-speed cameras and 3D digital image correlation presented in this paper. Comparison reveals excellent correlation of the transient behavior of the board during impact and confirms the feasibility of using the full-field measurement technique used in this study.

Digital Speckle Projection for Vibration Measurement by Applying Digital Image Correlation Method

2006 ◽  
Vol 326-328 ◽  
pp. 99-102 ◽  
Author(s):  
Fu Jun Yang ◽  
Xiao Yuan He
Keyword(s):  
Digital Image Correlation ◽  
Digital Image ◽  
High Speed ◽  
Speckle Pattern ◽  
Plane Deformation ◽  
Correlation Method ◽  
Image Correlation ◽  
Vibration Measurement ◽  
Digital Image Correlation Method ◽  
Digital Speckle

Digital image correlation method (DICM) is described as a robust in-plane deformation measuring method due to its simple optical setup and the insensitivity against ambient noise. Based on DICM, digital speckle projection has been developed for shape measurement. This paper explores the possibilities for vibration analysis using digital speckle projection together with DICM. A digital speckle pattern, generated by computer, is projected on an object surface using an LCD projector. Then the dynamic deformation modulated speckle images are captured by a high-speed CCD camera and saved in the computer. By using the self-developed temporal sequence digital images correlation algorithm, the deformation and vibration mode can be analyzed quantitatively. The proposed method avoids using stroboscopic or laser illumination and simplifies the experimental setup for vibration measurement, while it is time-consuming thanks to calculating a large amount of correlation coefficients. The experimental performance on a harmonic-vibrating cantilever beam well demonstrates the validity of the new method.

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