Board-Level Reliability of Pb-Free Surface Mounted Assemblies during Thermal Shock Testing

2006 ◽  
pp. 633-638
Author(s):  
Jong Woong Kim ◽  
Hyun Suk Chun ◽  
Sang Su Ha ◽  
Jong Hyuck Chae ◽  
Jin Ho Joo ◽  
...  
Keyword(s):  
Free Surface ◽  
Thermal Shock ◽  
Shock Testing ◽  
Board Level ◽  
Board Level Reliability

Board-Level Reliability of Pb-Free Surface Mounted Assemblies during Thermal Shock Testing

2006 ◽  
Vol 15-17 ◽  
pp. 633-638 ◽  
Author(s):  
Jong Woong Kim ◽  
Hyun Suk Chun ◽  
Sang Su Ha ◽  
Jong Hyuck Chae ◽  
Jin Ho Joo ◽  
...  
Keyword(s):  
Thermal Shock ◽  
Solder Joints ◽  
Lead Frame ◽  
Shear Forces ◽  
Microstructural Investigation ◽  
Shock Testing ◽  
Ceramic Capacitor ◽  
Board Level ◽  
Board Level Reliability ◽  
Thermal Shocks

Board-level reliability of conventional Sn-37Pb and Pb-free Sn-3.0Ag-0.5Cu solder joints was evaluated using thermal shock testing. In the microstructural investigation of the solder joints, the formation of Cu6Sn5 intermetallic compound (IMC) layer was observed between both solders and Cu lead frame, but any crack or newly introduced defect cannot be found even after 2000 cycles of thermal shocks. Shear test of the multi layer ceramic capacitor (MLCC) joints were also conducted to investigate the effect of microstructural variations on the bonding strength of the solder joints. Shear forces of the both solder joints decreased with increasing thermal shock cycles. The reason to the decrease in shear force was discussed with fracture surfaces of the shear tested solder joints.

Structure Evolution of 7YSZ Thermal Barrier Coating During Thermal Shock Testing

2015 ◽  
Vol 30 (12) ◽  
pp. 1261
Author(s):  
ZHANG Xiao-Feng ◽  
ZHOU Ke-Song ◽  
ZHANG Ji-Fu ◽  
ZHANG Yong ◽  
LIU Min ◽  
...  
Keyword(s):  
Thermal Shock ◽  
Thermal Barrier Coating ◽  
Structure Evolution ◽  
Thermal Barrier ◽  
Shock Testing ◽  
Barrier Coating

Board Level Reliability of Automotive Grade WLCSP for Radar Applications

2020 ◽  
Author(s):  
Nishant Lakhera ◽  
Burt Carpenter ◽  
Trung Duong ◽  
Mollie Benson ◽  
Andrew J Mawer
Keyword(s):  
Radar Applications ◽  
Board Level ◽  
Board Level Reliability

281. An evaluation of the critical pv-values of carbons for a mechanical seal by thermal shock testing

Carbon ◽  
1982 ◽  
Vol 20 (2) ◽  
pp. 156
Author(s):  
S. Sato ◽  
K. Kawamata ◽  
J. Aizawa ◽  
M. Ishii
Keyword(s):  
Thermal Shock ◽  
Mechanical Seal ◽  
Shock Testing

A Dynamic Bending Method for PoP Package Board Level Reliability Validation

2018 ◽  
Author(s):  
Jeffrey Lee ◽  
Cheng-Chih Chen ◽  
Lane Brown ◽  
Esme Mehretu ◽  
Thomas Obrien ◽  
...  
Keyword(s):  
Dynamic Bending ◽  
Board Level ◽  
Board Level Reliability

Board Level Reliability of Solder Joint with a Low CTE PCB

2019 ◽  
Vol 44 (1) ◽  
pp. 975-983 ◽  
Author(s):  
Kyoungmoo Harr ◽  
Chang-Bae Lee ◽  
Yoon-Su Kim ◽  
Seungwook Park ◽  
Jin-Gu Kim ◽  
...  
Keyword(s):  
Solder Joint ◽  
Board Level ◽  
Board Level Reliability
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