Molecular Dynamics Simulation of Exit Fracture in the Case of Nanometric Cutting Process

Author(s):  
Xue Song Han
2013 ◽  
Vol 690-693 ◽  
pp. 2559-2562
Author(s):  
Ying Zhu ◽  
Shun He Qi ◽  
Zhi Xiang ◽  
Ling Ling Xie

Molecular dynamics model of the polysilicon material under the micro/nanoscale is established by using molecular dynamics method, make variety of the typical defects distribute to the polysilicon model reasonable and relax the simulation model, obtain the system potential energy curves in the relaxation process and the atomic location figure after the relaxation. Conduct molecular dynamics simulation of nanometric cutting process relying on the development of simulation program, get instant atom position image and draw the cutting force curve. Discusses the typical defects impact on the polycrystalline silicon nanometric cutting process, those mainly include cutting force changes in the cutting process, potential energy changes and processed surface quality etc.


2010 ◽  
Vol 14 (4) ◽  
pp. 423-439 ◽  
Author(s):  
Rapeepan Promyoo ◽  
Hazim El-Mounayri ◽  
Xiaoping Yang

2012 ◽  
Vol 9 (9) ◽  
pp. 1303-1308 ◽  
Author(s):  
Jiaxuan Chen ◽  
Yingchun Liang ◽  
Mingjun Chen ◽  
Liquan Wang

2004 ◽  
Vol 471-472 ◽  
pp. 144-148 ◽  
Author(s):  
Hui Wu ◽  
Bin Lin ◽  
S.Y. Yu ◽  
Hong Tao Zhu

Molecular dynamics (MD) simulation can play a significant role in addressing a number of machining problems at the atomic scale. This simulation, unlike other simulation techniques, can provide new data and insights on nanometric machining; which cannot be obtained readily in any other theory or experiment. In this paper, some fundamental problems of mechanism are investigated in the nanometric cutting with the aid of molecular dynamics simulation, and the single-crystal silicon is chosen as the material. The study showed that the purely elastic deformation took place in a very narrow range in the initial stage of process of nanometric cutting. Shortly after that, dislocation appeared. And then, amorphous silicon came into being under high hydrostatic pressure. Significant change of volume of silicon specimen is observed, and it is considered that the change occur attribute to phase transition from a diamond silicon to a body-centered tetragonal silicon. The study also indicated that the temperature distributing of silicon in nanometric machining exhibited similarity to conventional machining.


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