Effect of Cutting Edge Truncation on Ground Surface Morphology of Hard and Brittle Materials for Optical Devices

2005 ◽  
pp. 139-144
Author(s):  
X. Kang ◽  
Junichi Tamaki ◽  
Akihiko Kubo ◽  
Ji Wang Yan ◽  
Toshirou Iyama
Keyword(s):  
Surface Morphology ◽  
Brittle Materials ◽  
Ground Surface ◽  
Optical Devices ◽  
Cutting Edge ◽  
Hard And Brittle Materials

Effect of Cutting Edge Truncation on Ground Surface Morphology of Hard and Brittle Materials for Optical Devices

2005 ◽  
Vol 291-292 ◽  
pp. 139-144 ◽  
Author(s):  
X. Kang ◽  
Junichi Tamaki ◽  
Akihiko Kubo ◽  
Ji Wang Yan ◽  
Toshirou Iyama
Keyword(s):  
Surface Morphology ◽  
Brittle Materials ◽  
Ground Surface ◽  
Optical Devices ◽  
Cutting Edge ◽  
Grinding Wheel ◽  
Ductile Mode ◽  
Hard And Brittle Materials ◽  
Crystal Quartz ◽  
Materials Used

For the purpose of investigating the effect of cutting edge truncation on ground surface morphology, several kinds of hard and brittle materials used for optical devices, borosilicate glass, glass quartz, crystal quartz and sapphire, are plunge ground with a SD600 metal-bonded grinding wheel, the cutting edges of which are truncated so as to be aligned with the height level of the grinding wheel working surface, after electrocontact discharge truing and dressing. It is found that an improvement of roughness can be obtained for every material investigated, although the degree of roughness improvement depends on the kind of material. Ductile-mode grinding is most likely to be realized in the case of crystal quartz.

Study on Fixed Abrasive Lapping Hard and Brittle Materials with Brazed Micro Powder Diamond Disk

2013 ◽  
Vol 589-590 ◽  
pp. 451-456 ◽  
Author(s):  
Quan Cheng Li ◽  
Jian Yun Shen ◽  
Cong Fu Fang ◽  
Xi Peng Xu
Keyword(s):  
Surface Morphology ◽  
Silicon Wafer ◽  
Removal Rate ◽  
Brittle Materials ◽  
Alumina Ceramic ◽  
Diamond Disk ◽  
Hard And Brittle Materials ◽  
Fixed Abrasive

In this study, two different arrangement lapping disks fixed with brazed diamond pellets were used to lap silicon wafer and alumina ceramic. The effects of the surface morphology, roughness, and removal rate of workpiece caused by lapping pressure, lapping time, workpiece velocity, and disc arrangement were operated with serials experiments. The results of the researches provided guidance for fixed abrasive lapping of hard and brittle materials with the brazed micro powder diamond disk.

Werkzeuge der ultraschallunterstützten Bearbeitung*/Modelling of an Actorsystem - Development of a tool for ultrasonic assisted machining with an axial-tangential vibration vector

2018 ◽  
Vol 108 (01-02) ◽  
pp. 53-57
Author(s):  
K. Drewle ◽  
T. Stehle ◽  
H: Möhring
Keyword(s):  
Contact Zone ◽  
Brittle Materials ◽  
Wird Eine ◽  
Alternative Method ◽  
Ultrasonic Assisted ◽  
Ultrasonic Assisted Machining ◽  
Hard And Brittle Materials ◽  
Feed Axis

Die schwingungsunterstützte Bearbeitung hat sich bereits bei der Zerspanung von hartspröden Werkstoffen mit einer einachsigen Schwingung in der Kontaktzone bewährt. Untersuchungen zu schwingungsunterstützten Bohrprozessen beschränken sich bisher auf eine Schwingungserzeugung, die entlang der Vorschubachse ausgerichtet ist. Für alternative Schwingungsrichtungen fehlt in erster Linie die geeignete Aktorik. In diesem Beitrag wird eine alternative Methode zur Erzeugung einer axial-tangentialen Schwingung in der Kontaktzone untersucht.   Ultrasonic assisted machining with uniaxial vibration is a well-proven process for machining hard and brittle materials. Existing investigations of vibration assisted drilling and boring processes so far are limited to an oscillation along the feed axis, which primarily due to nonexistent actuators. This contribution will present investigations into an alternative method for creating axial-tangential vibrations in the tool contact zone.

COMPARISON OF EXPERIMENTALLY MEASURED AND SIMULATED WORKPIECE AND GRINDING WHEEL TOPOGRAPHY USING A NEW DRESSING MODEL

2016 ◽  
Vol 40 (1) ◽  
pp. 1-17 ◽  
Author(s):  
Abdalslam Darafon ◽  
Andrew Warkentin ◽  
Robert Bauer
Keyword(s):  
Surface Finish ◽  
Metal Removal ◽  
Ground Surface ◽  
Cutting Edge ◽  
Edge Density ◽  
Grinding Wheel ◽  
Workpiece Surface ◽  
Wheel Topography ◽  
Grinding Wheel Topography ◽  
Grinding Conditions

This paper presents a new empirical model of the dressing process in grinding which is then incorporated into a 3D metal removal computer simulator to numerically predict the ground surface of a workpiece as well as the dressed surface of the grinding wheel. The proposed model superimposes a ductile cutting dressing model with a grain fracture model to numerically generate the resulting grinding wheel topography and workpiece surface. Grinding experiments were carried out using “fine”, “medium” and “coarse” dressing conditions to validate both the predicted wheel topography as well as the workpiece surface finish. For the grinding conditions used in this research, it was observed that the proposed dressing model is able to accurately predict the resulting workpiece surface finish for all dressing conditions tested. Furthermore, similar trends were observed between the predicted and experimentally-measured grinding wheel topographies when plotting the cutting edge density, average cutting edge width and average cutting edge spacing as a function of depth for all dressing conditions tested.

scholarly journals Extremely Thin Metal Foil Blades as Cutting Tools for Hard and Brittle Materials

2018 ◽  
Vol 221 ◽  
pp. 04006
Author(s):  
Satoshi Sakamoto ◽  
Sanshiro Akaoka ◽  
Masaya Gemma ◽  
Yasuo Kondo ◽  
Kenji Yamaguchi ◽  
...  
Keyword(s):  
Particle Size ◽  
Abrasive Particle ◽  
Brittle Materials ◽  
Groove Depth ◽  
Thin Metal ◽  
Metal Foil ◽  
Machining Time ◽  
Blade Thickness ◽  
Hard And Brittle Materials ◽  
Thin Metal Foil

The manufacturing costs of semiconductor products such as silicon wafers can be reduced by decreasing the kerf loss. In addition, a decrease in the kerf loss leads to an effective utilization of rare materials, which is environmentally beneficial from the viewpoint of saving resources. This study aims to reduce the kerf loss during slicing hard and brittle materials. Therefore, the possibility of using an extremely thin metal foil blade instead of a wire tool in slicing was examined. Initially, grooving characteristics using a metal foil blade (thickness: 50 μm or less) was investigated. The main conclusions are that grooving with a metal foil blade is possible and kerf loss can be reduced. The groove depth tends to increase as the machining time and particle size of abrasives increase. The groove width is smaller when a thin metal foil blade is used and vice versa. However, if the abrasive particle size is too large, grooving becomes impossible. Since the wear of metal foil blade increases with an increase in the particle size of the abrasive, it is necessary to use an abrasive with a particle size that is suitable for the thickness of the metal foil blade.

Optimization of Cutting Edge Truncation Depth for Ultrasonically Assisted Grinding to Finish Mirror Surface

2009 ◽  
Vol 76-78 ◽  
pp. 88-93 ◽  
Author(s):  
Keisuke Hara ◽  
Hiromi Isobe ◽  
Akira Kyusojin
Keyword(s):  
Ground Surface ◽  
Optimization Techniques ◽  
Cutting Edge ◽  
Mirror Surface ◽  
Skilled Workers ◽  
Ultrasonic Oscillation ◽  
Oscillation Effect ◽  
Grinding Conditions ◽  
Grinding Technique ◽  
Face Grinding

High precision mold grinding technique to obtain mirror surface is required which realizes minimization or omission of final polishing by skilled workers. In the previous reports, ultrasonic diamond grinding experiments were carried out to confirm ultrasonic oscillation effect for die steel face grinding. Smooth and glossy surfaces were obtained successfully and little abrasive worn out was found. In the above techniques require cutting edge truncation because the cutting edge shape of a tool affects the ground surface resulting from transcription of cutting edge. This paper describes optimization techniques for the cutting edge truncation of diamond electroplated tools which are used in ultrasonically assisted grinding. Experiments were carried out to confirm truncation effects on the ground surface and grinding force. It was confirmed that roughness was proportional to inverse of thrust force. Minimum roughness in grinding conditions were estimated from the proportional diagrams. The minimum roughness shows limit of roughness on an each grinding condition.

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