Experimental Study on Green Cutting with Water Vapor as Coolant and Lubricant

2006 ◽  
pp. 45-50 ◽  
Author(s):  
R.D. Han ◽  
J.Y. Liu ◽  
Y. Zhang ◽  
L. Zhang
Keyword(s):  
Experimental Study ◽  
Water Vapor

An experimental study of membranes for capturing water vapor from flue gas

2018 ◽  
Vol 91 (3) ◽  
pp. 339-348 ◽  
Author(s):  
Haiping Chen ◽  
Yanan Zhou ◽  
Jianyu Sun ◽  
Yanda Liu ◽  
Yajuan Zhong ◽  
...  
Keyword(s):  
Experimental Study ◽  
Water Vapor ◽  
Flue Gas

Experimental study of sticking probabilities for condensation of nitric acid — water vapor mixtures

2001 ◽  
Vol 32 (7) ◽  
pp. 913-932 ◽  
Author(s):  
R Rudolf ◽  
A Vrtala ◽  
M Kulmala ◽  
T Vesala ◽  
Y Viisanen ◽  
...  
Keyword(s):  
Experimental Study ◽  
Water Vapor ◽  
Nitric Acid ◽  
Acid Water ◽  
Sticking Probabilities ◽  
Vapor Mixtures

An experimental study on the solubility of copper bichloride in water vapor

2006 ◽  
Vol 70 (18) ◽  
pp. A575
Author(s):  
L.B. Shang ◽  
R.Z. Hu ◽  
W.L. Fan
Keyword(s):  
Experimental Study ◽  
Water Vapor

Evolution of Surface Morphology During Cu(TMVS)(hfac) Sourced Copper CVD

2000 ◽  
Vol 612 ◽  
Author(s):  
Daewon Yang ◽  
Jongwon Hong ◽  
Timothy S. Cale
Keyword(s):  
Experimental Study ◽  
Water Vapor ◽  
Surface Morphology ◽  
Short Range ◽  
Nucleation And Growth ◽  
Growth Stages ◽  
Grain Sizes ◽  
Initial Stage ◽  
Afm Analysis ◽  
Evolving Surface

AbstractIn this paper, we describe an experimental study of the nucleation and growth stages during Cu(TMVS)(hfac) sourced Cu CVD on TaN substrates. In particular, we have investigated the effects of water vapor as a co-reactant on evolving surface morphology. The results of short (less than 10 s) depositions without/with water vapor indicate that water vapor helps to reduce the incubation time and to enhance the nuclei formation, uniformity, and adhesion (based on AFM analysis). Introducing water vapor during only the initial stage of deposition results in lower roughnesses, larger grain sizes, and lower short-range roughnesses as compared to the films deposited without water vapor. From this study, we conclude that water vapor enhances Cu nucleation and that a relatively small amount of water vapor before or during the initial stage of deposition improves surface morphology in terms of roughness and grain size.

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