Study on the Influence of Temperature and Stress Field to PCB’s Modal

2012 ◽  
Vol 271-272 ◽  
pp. 1441-1445
Author(s):  
Qin Luo ◽  
Su Juan Zhang ◽  
Xiao Zhang
Keyword(s):  
Temperature Field ◽  
Stress Field ◽  
Modal Analysis ◽  
Heat Flux Density ◽  
Heat Dissipation ◽  
Transient Temperature ◽  
Electronic Products ◽  
Transient Stress ◽  
Transient Temperature Field ◽  
Pcb Design

With the increasing integration of electronic products, the heat flux density is increasing. Research on the heat dissipation of the PCB attracts more attention. Temperature field of the electronic products always changes a lot, usually leading to a transient stress field in the PCB. Due to the transient temperature field and transient stress field, the PCB’s modal changed. In this paper, the temperature field and the stress field are obtained to explain the reason of the change. The influence on PCB’s modal caused by the temperature field and the stress field are analyzed, on the basis of PCB’s thermal modal analysis, which provide a reference for the PCB design and modal analysis in the future.

Cooling Effects of H-Beam after Rolling on Thermal Stress

2014 ◽  
Vol 898 ◽  
pp. 233-236
Author(s):  
Jin Hong Ma ◽  
Xiao Han Yao ◽  
Bin Tao ◽  
Shuo Li
Keyword(s):  
Temperature Field ◽  
Thermal Stress ◽  
Stress Field ◽  
Three Dimensional ◽  
Transient Temperature ◽  
Controlled Cooling ◽  
Fem Model ◽  
Transient Temperature Field ◽  
Cooling Effects ◽  
H Beam

Controlled cooling of H-beam after rolling, can change the microstructure consituent,improve the strength and improve the general mechanical property and service performance. According to actual product, the rational thermal boundary condition adopted, three dimensional FEM model is established. Spray cooling is used. Transient temperature field and stress field is simulated by the FEM software ANSYS/Multiphysics when H-beam is cooled. The four kinds of cooling scheme are designed. Through analysis of the relation of temperature field with stress field, the main reason of producing residual thermal stress is the section temperature difference in the cooling process of H-beam after rolling.

Simulation of Temperature Field and Thermal Stress Field during Laser Drilling

2012 ◽  
Vol 217-219 ◽  
pp. 2226-2229
Author(s):  
Xue Jun Chen ◽  
Qi Liu
Keyword(s):  
Temperature Field ◽  
Thermal Stress ◽  
Stress Field ◽  
Laser Drilling ◽  
Transient Temperature ◽  
Drilling Process ◽  
Transient Temperature Field ◽  
Element Simulation ◽  
Thermal Stress Field ◽  
Dimensional Parameters

In this paper, the finite element simulation of laser drilling process has been carried out for the nickel alloy DD6. Both the transient temperature field and thermal stress field were computed via the commercial software package ANSYS. Based on the method of dimensional analysis, the dependence of various non-dimensional parameters on both fields was specified and demonstrated in graphical forms.

scholarly journals Simulating Convective-Radiative Heat Sinks Effect by means of FEA-based Gaussian Heat Sources and Its Approximate Analytical Solutions for Semi-Infinite Body

2021 ◽  
Author(s):  
Ninh The Nguyen ◽  
John H Chujutalli
Keyword(s):  
Temperature Field ◽  
Heat Source ◽  
Analytical Solutions ◽  
Radiative Heat ◽  
Source Model ◽  
Heat Sinks ◽  
Transient Temperature ◽  
Measured Temperature ◽  
Heat Source Model ◽  
Transient Temperature Field

Abstract FEA-based Gaussian density heat source models were developed to study the effect of convective and radiative heat sinks on the transient temperature field predicted by the available approximate analytical solution of the purely conduction-based Goldak’s heat source. A new complex 3D Gaussian heat source model, incorporating all three modes of heat transfer, i.e., conduction, convection and radiation, has been developed as an extension of the Goldak heat source. Its approximate transient analytical solutions for this 3-D moving heat source were derived and numerically benchmarked with the available measured temperature & weld pool geometry data by Matlab programming with ~5 to 6 times faster than FEA-based simulation. The new complex 3D Gaussian heat source model and its approximate solution could significantly reduce the computing time in generating the transient temperature field and become an efficient alternative to extensive FEA-based simulations of heating sequences, where virtual optimisation of a melting heat source (i.e. used in welding, heating, cutting or other advanced manufacturing processes) is desirable for characterisation of material behaviour in microstructure evolution, melted pool, microhardness, residual stress and distortions.

Numerical Simulation of Three-Dimensional Molten Pool Temperature Field and Flow Field for Laser Melt Injection Based on Fluent

2012 ◽  
Vol 538-541 ◽  
pp. 1837-1842 ◽  
Author(s):  
Long Zhi Zhao ◽  
Zi Wang ◽  
Xin Yan Jiang ◽  
Jian Zhang ◽  
Ming Juan Zhao
Keyword(s):  
Temperature Field ◽  
Liquid Metal ◽  
Molten Pool ◽  
Metal Flow ◽  
Three Dimensional ◽  
Transient Temperature ◽  
Transient Temperature Field ◽  
Liquid Metal Flow ◽  
Fluent Software ◽  
Thermo Physical Properties

According to the characteristics of laser melt injection, a numerical model for a simplified 3D transient temperature field in molten pool was established using FLUENT software in this paper. In the model, many factors were considered such as liquid metal turbulence, latent heat of phase transformation and material thermo physical properties depending on temperature. The results show that the model can be developed well by FLUENT software. And the results also show that the driving force of the liquid metal flow mechanism.

Sign in / Sign up

Export Citation Format

Share Document