Thermal Shock Behavior of a Functionally Graded Material Plate with a Crack
2013 ◽
Vol 275-277
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pp. 152-155
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Keyword(s):
A thermal shock problem of a functionally graded material plane (FGMP) containing a crack is considered. All the material properties of the FGMP are assumed to be dependent on the coordinates.The transient temperature fields are solved by combining the finite difference method (FDM) and the finite element method (FEM). Then the transient thermal stress intensity factors (TSIFs) are obtained using the interaction energy integral method. The transient characteristics of the TSIFs are investigated.
2001 ◽
Vol 67
(653)
◽
pp. 142-149
2000 ◽
Vol 2000.13
(0)
◽
pp. 267-268
Keyword(s):
2002 ◽
Vol 2002
(0)
◽
pp. 257-258
Keyword(s):
2001 ◽
Vol 67
(655)
◽
pp. 503-510
Keyword(s):
2001 ◽
Vol 44
(1)
◽
pp. 31-36
◽
2007 ◽
Vol 27
(2-3)
◽
pp. 1365-1371
◽
1996 ◽
Vol 19
(4)
◽
pp. 317-339
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Keyword(s):
2018 ◽
Vol 41
(5)
◽
pp. 543-567
◽
2017 ◽
Vol 20
(K2)
◽
pp. 141-147