Thermal Shock Behavior of a Functionally Graded Material Plate with a Crack

2013 ◽  
Vol 275-277 ◽  
pp. 152-155 ◽  
Author(s):  
Yan Yan Zhang ◽  
Li Cheng Guo ◽  
Feng Nan Guo ◽  
Hong Jun Yu ◽  
Kai Huang ◽  
...  

A thermal shock problem of a functionally graded material plane (FGMP) containing a crack is considered. All the material properties of the FGMP are assumed to be dependent on the coordinates.The transient temperature fields are solved by combining the finite difference method (FDM) and the finite element method (FEM). Then the transient thermal stress intensity factors (TSIFs) are obtained using the interaction energy integral method. The transient characteristics of the TSIFs are investigated.

2017 ◽  
Vol 20 (K2) ◽  
pp. 141-147
Author(s):  
Bang Kim Tran ◽  
Huy The Tran ◽  
Tinh Quoc Bui ◽  
Thien Tich Truong

Analysis of mechanical behavior of a structure containing defects such as holes and inclusions is essential in many engineering applications. In many structures, the discontinuities may have a significant influence on the reduction of the structural stiffness. In this work, we consider the effect of multiple random holes and inclusions in functionally graded material (FGM) plate and apply the extended finite element method with enrichment functions to simulate the mechanical behavior of those discontinuous interfaces. The inclusions also have FGM properties. Numerical examples are considered and their obtained results are compared with the COMSOL, the finite element method software.


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