Multiple Crack Growth in a Functionally Graded Material under Thermal Shock

2000 ◽  
Vol 2000.13 (0) ◽  
pp. 267-268
Author(s):  
Takao FUJIMOTO ◽  
Naotake NODA
Keyword(s):  
Thermal Shock ◽  
Crack Growth ◽  
Functionally Graded Material ◽  
Functionally Graded ◽  
Multiple Crack ◽  
Graded Material

Thermal Shock Behavior of a Functionally Graded Material Plate with a Crack

2013 ◽  
Vol 275-277 ◽  
pp. 152-155 ◽  
Author(s):  
Yan Yan Zhang ◽  
Li Cheng Guo ◽  
Feng Nan Guo ◽  
Hong Jun Yu ◽  
Kai Huang ◽  
...  
Keyword(s):  
Thermal Shock ◽  
Functionally Graded Material ◽  
Functionally Graded ◽  
Temperature Fields ◽  
Transient Temperature ◽  
The Finite Element Method ◽  
Graded Material ◽  
Thermal Shock Behavior ◽  
Transient Thermal ◽  
Thermal Shock Problem

A thermal shock problem of a functionally graded material plane (FGMP) containing a crack is considered. All the material properties of the FGMP are assumed to be dependent on the coordinates.The transient temperature fields are solved by combining the finite difference method (FDM) and the finite element method (FEM). Then the transient thermal stress intensity factors (TSIFs) are obtained using the interaction energy integral method. The transient characteristics of the TSIFs are investigated.

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