Wide Range and Accurate Measurement of Wafer Thickness Gauge Using Optical Spectral Analyzer
2016 ◽
Vol 1136
◽
pp. 581-585
Keyword(s):
Applicability of a generic optical spectrum analyzer that is familiar with laser experiments is investigated for on-site wafer thickness measurements in the thinning process, to resolve the issues regarding mismatch in the thickness range of previous thickness measurement system. The optimizations in terms of the spectral range, the spectral resolution and the dynamic range are successfully conducted by use of the optical spectrum analyzer. Owing to both high spectral resolution and wide dynamic range in near infrared spectral measurements, full range thickness measurements for the initial thickness 775μm and the terminal thickness 1μm and nanometer order accuracy are implemented.
1978 ◽
Vol 14
(6)
◽
pp. 437-443
◽
Keyword(s):
2021 ◽
2011 ◽
2013 ◽
Vol 24
(5)
◽
pp. 057002
◽
Keyword(s):
Keyword(s):