Determination of the Curing Techniques of Octaepoxysilsesquioxane with a Diamine

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.549.157 ◽

2012 ◽

Vol 549 ◽

pp. 157-160

Author(s):

Zeng Ping Zhang ◽

Jian Zhong Pei ◽

Chang Qing Fang ◽

Shuan Fa Chen

Keyword(s):

Differential Scanning Calorimetry ◽

Polyhedral Oligomeric Silsesquioxane ◽

Resin System ◽

Scanning Calorimetry ◽

Curing Agents ◽

Oligomeric Silsesquioxane ◽

Epoxy Groups

Octaepoxysilsesquioxane (POSS-Ep), a kind of functional polyhedral oligomeric silsesquioxane (POSS) was cured with 4,4'-diaminodiphenylsulfone diamine (DDS) in this study. Possessing epoxy groups, it can be cured thermally with certain curing agents including amines. Differential scanning calorimetry (DSC) was used to determine the curing techniques of the POSS-Ep/DDS resin system in this study. The appropriate curing technique for this resin is set as: 130°C/2h+ 160°C/2h+200°C/2h.

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Curing Kinetics of Octaepoxysilsesquioxane/DDS System

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.233-235.1834 ◽

2011 ◽

Vol 233-235 ◽

pp. 1834-1837

Author(s):

Zeng Ping Zhang ◽

Jian Zhong Pei ◽

Shuan Fa Chen ◽

Hong Zhao Du ◽

Yong Wen

Keyword(s):

Activation Energy ◽

Differential Scanning Calorimetry ◽

Curing Kinetics ◽

Scanning Calorimetry ◽

Exponential Factor ◽

Inorganic Hybrid ◽

Oligomeric Silsesquioxane ◽

Kinetics Of ◽

Epoxy Groups ◽

Important Kind

Polyhedral oligomeric silsesquioxane (POSS) can be incorporated into polymers to obtain organic/inorganic hybrid materials. Octaepoxysilsesquioxane (E-POSS) with eight reactive epoxy groups per molecule is an important kind of POSS. E-POSS was cured with 4,4'-diaminodiphenylsulfone diamine (DDS) in this study. The curing kinetics of the E-POSS/DDS system was studied by using differential scanning calorimetry (DSC). Kinssinger and Flynn-Wall-Ozawa methods were used to obtain the activation energy and pre-exponential factor of the curing reaction.

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Curing Kinetics of Octaepoxysilsesquioxane/MNA System

Applied Mechanics and Materials ◽

10.4028/www.scientific.net/amm.84-85.42 ◽

2011 ◽

Vol 84-85 ◽

pp. 42-46

Author(s):

Zeng Ping Zhang ◽

Guo Zheng Liang ◽

Shuan Fa Chen

Keyword(s):

Activation Energy ◽

Differential Scanning Calorimetry ◽

Hybrid Materials ◽

Curing Kinetics ◽

Scanning Calorimetry ◽

Exponential Factor ◽

Inorganic Hybrid ◽

Oligomeric Silsesquioxane ◽

Kinetics Of ◽

Epoxy Groups

Polyhedral oligomeric silsesquioxane (POSS) can be added to polymers to prepare the organic/inorganic hybrid materials. Octaepoxysilsesquioxane (E-POSS) containing eight reactive epoxy groups in a molecule is one of the important POSSs. E-POSS was cured with methylnadic anhydride (MNA) in this study. The curing kinetics of the E-POSS/MNA system was studied by using differential scanning calorimetry (DSC). Two different kinds of methods, Kinssinger and Flynn-Wall-Ozawa, were used to calculate the activation energy and pre-exponential factor of the curing reaction.

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