Effects of P Addition on the Oxidation and Corrosion Behavior of Sn-9Zn-1Bi Solder Alloy

2013 ◽  
Vol 785-786 ◽  
pp. 63-66
Author(s):  
Hui Zhen Huang ◽  
Xiu Qin Wei ◽  
Lang Zhou
Keyword(s):  
Corrosion Resistance ◽  
Oxidation Resistance ◽  
Solder Alloy ◽  
Corrosion Behavior ◽  
Lead Free ◽  
Lead Free Solder ◽  
P Content ◽  
Free Solder ◽  
P Addition ◽  
Oxidation And Corrosion

The oxidation and corrosion behavior of Sn-9Zn-1Bi lead-free solder alloys with different P content were investigated by weighing the mass of the alloy, as well as the effects of P on the microstructure. The results indicate that the oxidation resistance and the corrosion resistance of Sn-9Zn-1Bi solder alloy can be enhanced significantly with the increase of P content. The microstructure observations show that P addition into Sn-9Zn-1Bi solder alloy can refine the microstructure and the numbers of dark rod-like Zn-rich phases are decreased with increasing of P addition.

Effect of Cu on the Electrochemical Corrosion Behavior of Sn-8Zn-3Bi Lead-Free Solder Alloy

2015 ◽  
Vol 1095 ◽  
pp. 95-98
Author(s):  
Li Ma ◽  
Qiang Hu ◽  
Yan Bin Sun
Keyword(s):  
Corrosion Resistance ◽  
Solder Alloy ◽  
Corrosion Behavior ◽  
Corrosion Potential ◽  
Electrochemical Corrosion ◽  
Lead Free ◽  
Lead Free Solder ◽  
Cu Content ◽  
Electrochemical Corrosion Behavior ◽  
Free Solder

The electrochemical corrosion behavior of the Sn-8Zn-3Bi-xCu lead-free solder in 3.5%NaCl solution was studied to reveal effect of Cu addition on the corrosion resistance of Sn-8Zn-3Bi solder alloy. The results showed that adding Cu element increased the corrosion potential of Sn-8Zn-3Bi-xCu solder alloysThe corrosion resistance of Sn-8Zn-3Bi-xCu solder alloys was improved correspondingly. The corrousion product of Sn-8Zn-3Bi-xCu alloy was mainly zinc oxide. More corrosion products were observed with the increse of Cu content.

Thermal aging impact on microstructure, creep and corrosion behavior of lead-free solder alloy (SAC387) use in electronics

2021 ◽  
Vol 122 ◽  
pp. 114180
Author(s):  
Mazullah ◽  
Muhammad Sadiq ◽  
Maaz Khan ◽  
Abdul Mateen ◽  
Muhammad Shahzad ◽  
...  
Keyword(s):  
Solder Alloy ◽  
Corrosion Behavior ◽  
Thermal Aging ◽  
Lead Free ◽  
Lead Free Solder ◽  
Lead Free Solder Alloy ◽  
Free Solder

A review: Effect of nanoparticles addition on the properties of Sn-Ag-Cu lead free solder alloy

2021 ◽  
Author(s):  
M. N. Ervina Efzan ◽  
M. M. Nur Haslinda ◽  
M. M. Al Bakri Abdullah
Keyword(s):  
Solder Alloy ◽  
Lead Free ◽  
Lead Free Solder ◽  
Lead Free Solder Alloy ◽  
Free Solder

Melting behavior and oxidation resistance of Ce–Sn alloy designed for lead-free solder manufacturing

2016 ◽  
Vol 125 (3) ◽  
pp. 1009-1015 ◽  
Author(s):  
Marian Drienovsky ◽  
Lydia Rizekova Trnkova ◽  
Milan Ozvold ◽  
Ivona Cernickova ◽  
Marian Palcut ◽  
...  
Keyword(s):  
Oxidation Resistance ◽  
Melting Behavior ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

scholarly journals Distribution and Microstructure Analysis of Ceramic Particles in the Lead-Free Solder Matrix

2020 ◽  
Author(s):  
Manoj Kumar Pal ◽  
Gréta Gergely ◽  
Dániel Koncz-Horváth ◽  
Zoltán Gácsi
Keyword(s):  
Silicon Carbide ◽  
Intermetallic Compounds ◽  
Solder Alloy ◽  
Solder Matrix ◽  
Microstructure Analysis ◽  
Lead Free ◽  
Lead Free Solder ◽  
Sac305 Solder ◽  
Small Change ◽  
Free Solder

Abstract The Sn-3.0Ag-0.5Cu solder alloy is a prominent candidate for the Pb-free solder, and SAC305 solder is generally employed in today’s electronic enterprise. In this study, the formation of intermetallic compounds (Cu6Sn5 and Ag3Sn) at the interface, average neighbour’s particle distance, and the morphological mosaic are examined by the addition of SiC and nickel-coated silicon carbide reinforcements within Sn-3.0Ag-0.5Cu solder. Results revealed that the addition of SiC and SiC(Ni) particles are associated with a small change to the average neighbor’s particle distance and a decrease of clustering rate to a certain limit of the Sn-3.0Ag-0.5Cu solder composites. Moreover, the development of the Cu6Sn5 and the structure of the Ag3Sn are improved with the addition of SiC and Ni coated SiC.

Temperature‐dependent fatigue modelling of a novel Ni, Bi and Sb containing Sn‐3.8Ag‐0.7Cu lead‐free solder alloy

2020 ◽  
Vol 43 (12) ◽  
pp. 2883-2891
Author(s):  
Q.B. Tao ◽  
L. Benabou ◽  
Van Nhat Le ◽  
Ngoc Anh Thi Nguyen ◽  
Hung Nguyen‐Xuan
Keyword(s):  
Solder Alloy ◽  
Lead Free ◽  
Lead Free Solder ◽  
Temperature Dependent ◽  
Lead Free Solder Alloy ◽  
Free Solder
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