Melting behavior and oxidation resistance of Ce–Sn alloy designed for lead-free solder manufacturing

2016 ◽  
Vol 125 (3) ◽  
pp. 1009-1015 ◽  
Author(s):  
Marian Drienovsky ◽  
Lydia Rizekova Trnkova ◽  
Milan Ozvold ◽  
Ivona Cernickova ◽  
Marian Palcut ◽  
...  
Keyword(s):  
Oxidation Resistance ◽  
Melting Behavior ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

scholarly journals Effect of Trace Ge on Wettability and High-Temperature Oxidation Resistance of Sn-0.7Cu Lead-Free Solder

2016 ◽  
Vol 57 (10) ◽  
pp. 1685-1690
Author(s):  
Qing-meng Wang ◽  
Gui-sheng Gan ◽  
Yunfei Du ◽  
Donghua Yang ◽  
Guoqi Meng ◽  
...  
Keyword(s):  
High Temperature ◽  
Oxidation Resistance ◽  
High Temperature Oxidation ◽  
Lead Free ◽  
Lead Free Solder ◽  
Temperature Oxidation ◽  
Free Solder

scholarly journals Modification in Bi-Ag Lead-Free Solder-Bearing Alloying Elements

2018 ◽  
Vol 14 (2) ◽  
pp. 5504-5519 ◽  
Author(s):  
Rizk Mostafa Shalaby ◽  
Musaeed Allzeleh ◽  
Mustafa Kamal
Keyword(s):  
Rare Earth ◽  
Electrical Resistance ◽  
Creep Resistance ◽  
Melting Behavior ◽  
Lead Free ◽  
Lead Free Solder ◽  
Soldering Temperature ◽  
Urgent Task ◽  
Free Solder ◽  
Lead Free Solders

The development of lead-free solder has an urgent task for material scientist due to health and environmental concerns over the lead content of traditional solders. The objective of this study is to examine Bi-Ag-rare earth (RE) element considered as one of the more attractive lead-free solders since it can easily replace Sn-Pb eutectic alloy with increasing soldering temperature while causes for high-temperature applications. In order to enhance the soldering properties of Bi-Ag alloys, a trace eare earth (RE) element of Ho added into Bi-Ag alloys. The results indicated that the addition of RE led to the refining of coarse Bi-Ag grains, in the microstructure. The tensile strength, Hv and creep resistance increased with a decrease in melting point and electrical resistance. This paper brief the influences of rare earth alloying element and rapid solidification on both of the microstructure, intermetallic compounds, creep resistance, melting behavior, electrical resistance and mechanical behavior.

Effect of surface oxide on the melting behavior of lead-free solder nanowires and nanorods

2012 ◽  
Vol 258 (19) ◽  
pp. 7507-7514 ◽  
Author(s):  
Fan Gao ◽  
Karunaharan Rajathurai ◽  
Qingzhou Cui ◽  
Guangwen Zhou ◽  
Irene NkengforAcha ◽  
...  
Keyword(s):  
Melting Behavior ◽  
Surface Oxide ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder ◽  
Effect Of Surface

Mechanical and Thermal Properties of Zn-xMg Solder Alloys

2016 ◽  
Vol 860 ◽  
pp. 173-178 ◽  
Author(s):  
Roisul Hasan Galib ◽  
Ahmed Sharif ◽  
M.A. Gafur ◽  
Md Rakibul Qadir ◽  
Md Ashif Anwar ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Thermal Properties ◽  
Melting Behavior ◽  
Lead Free ◽  
Mechanical And Thermal Properties ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Dta Analysis ◽  
Free Solder ◽  
Mg Content

Zn based Lead-free solder is considered to be a promising alternatives of tin-lead solder because of its competitive price and mechanical properties. In this research zinc-based lead-free solder alloys were developed by addition of magnesium. Bulk mechanical and thermal properties of Zn-Mg alloys were investigated. The solder alloys were prepared by casting. Chemical composition of these prepared alloys were confirmed by XRF analysis. The microstructures of the solders changed significantly on increasing Mg content. FESEM images showed an increase in eutectic phase. These microstructural changes improved the mechanical properties like tensile strength and hardness of the newly developed alloy. The melting behavior of the solder alloys was studied by DTA analysis. TMA analysis revealed information on the co-efficient of thermal expansion (CTE) of these alloys at high temperature.

Effects of P Addition on the Oxidation and Corrosion Behavior of Sn-9Zn-1Bi Solder Alloy

2013 ◽  
Vol 785-786 ◽  
pp. 63-66
Author(s):  
Hui Zhen Huang ◽  
Xiu Qin Wei ◽  
Lang Zhou
Keyword(s):  
Corrosion Resistance ◽  
Oxidation Resistance ◽  
Solder Alloy ◽  
Corrosion Behavior ◽  
Lead Free ◽  
Lead Free Solder ◽  
P Content ◽  
Free Solder ◽  
P Addition ◽  
Oxidation And Corrosion

The oxidation and corrosion behavior of Sn-9Zn-1Bi lead-free solder alloys with different P content were investigated by weighing the mass of the alloy, as well as the effects of P on the microstructure. The results indicate that the oxidation resistance and the corrosion resistance of Sn-9Zn-1Bi solder alloy can be enhanced significantly with the increase of P content. The microstructure observations show that P addition into Sn-9Zn-1Bi solder alloy can refine the microstructure and the numbers of dark rod-like Zn-rich phases are decreased with increasing of P addition.

Effect of aluminum content on structure, transport and mechanical properties of Sn-Zn eutectic lead free solder alloy rapidly solidified from melt.

2015 ◽  
Vol 10 (1) ◽  
pp. 2641-2648
Author(s):  
Rizk Mostafa Shalaby ◽  
Mohamed Munther ◽  
Abu-Bakr Al-Bidawi ◽  
Mustafa Kamal
Keyword(s):  
Mechanical Properties ◽  
Melting Point ◽  
Lead Free ◽  
Al Alloy ◽  
Lead Free Solder ◽  
Pronounced Increase ◽  
Mass Unit ◽  
Size Refinement ◽  
Free Solder ◽  
Lead Free Solders

The greatest advantage of Sn-Zn eutectic is its low melting point (198 oC) which is close to the melting point. of Sn-Pb eutectic solder (183 oC), as well as its low price per mass unit compared with Sn-Ag and Sn-Ag-Cu solders. In this paper, the effect of 0.0, 1.0, 2.0, 3.0, 4.0, and 5.0 wt. % Al as ternary additions on melting temperature, microstructure, microhardness and mechanical properties of the Sn-9Zn lead-free solders were investigated. It is shown that the alloying additions of Al at 4 wt. % to the Sn-Zn binary system lead to lower of the melting point to 195.72 ˚C.  From x-ray diffraction analysis, an aluminium phase, designated α-Al is detected for 4 and 5 wt. % Al compositions. The formation of an aluminium phase causes a pronounced increase in the electrical resistivity and microhardness. The ternary Sn-9Zn-2 wt.%Al exhibits micro hardness superior to Sn-9Zn binary alloy. The better Vickers hardness and melting points of the ternary alloy is attributed to solid solution effect, grain size refinement and precipitation of Al and Zn in the Sn matrix.  The Sn-9%Zn-4%Al alloy is a lead-free solder designed for possible drop-in replacement of Pb-Sn solders.  

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