Full Scan Structure Application in the Design of 16 Bit MCU

2014 ◽  
Vol 981 ◽  
pp. 78-81 ◽  
Author(s):  
Hong Bo Pan ◽  
Ming Xin Song ◽  
Xing Jin ◽  
Jing Hua Yin
Keyword(s):  
Design Project ◽  
Test Circuit ◽  
Memory Modules ◽  
Full Scan ◽  
Test Vectors

A design project of 16 bit RISC MCU with full scan structure by the tool of SYNOPSYSTM DFT COMPILER. The flip-flops can be linked into the chains; the memory modules in the MCU were tested by the technology of BIST; and the circuits were tested by the test vectors by ATPG. The chip test circuit include 8 chains, and cover rate can reach at 99.20%.

FLOSPAT: Fault Localization by Sensitized Path Transformation

1996 ◽  
Author(s):  
M.W. Heath ◽  
W. Maly
Keyword(s):  
Boolean Functions ◽  
Fault Localization ◽  
Fault Model ◽  
Sequential Circuits ◽  
Fault Identification ◽  
Identification Algorithm ◽  
Path Tracing ◽  
Full Scan ◽  
Diagnostic Resolution ◽  
Test Vectors

Abstract This paper describes a fault identification algorithm for combinational and full-scan sequential circuits called FLOSPAT - Fault Localization by Sensitized Path Transformation [1,2]. The goal of fault identification is to localize a fault to the fewest possible gates and to determine the Boolean functions realized by those gates. Instead of choosing a fault model, FLOSPAT uses fault-independent sensitized path tracing [3] to localize functional deviations. Sensitized path transformation is used to adaptively generate test vectors which improve the diagnostic resolution. The output of FLOSPAT is used for physical defect diagnosis by cross-referencing gate-level defect dictionaries generated by the contamination-defect-fault mapper CODEF [4,5,6].

How do memory modules differentially contribute to familiarity and recollection?

2019 ◽  
Vol 42 ◽  
Author(s):  
Olya Hakobyan ◽  
Sen Cheng
Keyword(s):  
Recognition Memory ◽  
Experimental Evidence ◽  
Subjective Experience ◽  
Target Article ◽  
Memory Modules ◽  
Familiarity And Recollection ◽  
Memory Contents

Abstract We fully support dissociating the subjective experience from the memory contents in recognition memory, as Bastin et al. posit in the target article. However, having two generic memory modules with qualitatively different functions is not mandatory and is in fact inconsistent with experimental evidence. We propose that quantitative differences in the properties of the memory modules can account for the apparent dissociation of recollection and familiarity along anatomical lines.

Addressing Defect Coverage through Generating Test Vectors for Transistor Defects

2009 ◽  
Vol E92-A (12) ◽  
pp. 3128-3135
Author(s):  
Yoshinobu HIGAMI ◽  
Kewal K. SALUJA ◽  
Hiroshi TAKAHASHI ◽  
Shin-ya KOBAYASHI ◽  
Yuzo TAKAMATSU
Keyword(s):  
Defect Coverage ◽  
Test Vectors

MODELING AN ABBREVIATED PRODUCT DESIGN CYCLE IN A FIRST-YEAR ENGINEERING DESIGN COURSE

2012 ◽  
Author(s):  
Patricia Kristine Sheridan ◽  
Jason A Foster ◽  
Geoffrey S Frost
Keyword(s):  
Product Design ◽  
Engineering Design ◽  
Conceptual Design ◽  
Design Project ◽  
University Of Toronto ◽  
Praxis Ii ◽  
Engineering Communication ◽  
Detail Design ◽  
Praxis I ◽  
Design Experience

All Engineering Science students at the University of Toronto take the cornerstone Praxis Sequence of engineering design courses. In the first course in the sequence, Praxis I, students practice three types of engineering design across three distinct design projects. Previously the final design project had the students first frame and then develop conceptual design solutions for a self-identified challenge. While this project succeeded in providing an appropriate foundational design experience, it failed to fully prepare students for the more complex design experience in Praxis II. The project also failed to ingrain the need for clear and concise engineering communication, and the students’ lack of understanding of detail design inhibited their ability to make practical and realistic design decisions. A revised Product Design project in Praxis I was designed with the primary aims of: (a) pushing students beyond the conceptual design phase of the design process, and (b) simulating a real-world work environment by: (i) increasing the interdependence between student teams and (ii) increasing the students’ perceived value of engineering communication.

DESIGN-BUILD: AN EFFECTIVE APPROACH FOR ARCHITECTURE STUDIO EDUCATION

2018 ◽  
Vol 12 (2) ◽  
pp. 146 ◽  
Author(s):  
Nabil Mohareb ◽  
Sara Maassarani
Keyword(s):  
Material Selection ◽  
Environmental Constraints ◽  
Design Project ◽  
Construction Methods ◽  
Physical Scale ◽  
Design Build ◽  
Simulation Results ◽  
Education Process ◽  
Real Target

Current architecture studios are missing an important phase in the education process, which is constructing the students’ conceptual ideas on a real physical scale. The design-build approach enables the students to test their ideas, theories, material selection, construction methods, environmental constraints, simulation results, level of space functionality and other important aspects when used by real target clients in an existing context. This paper aims to highlight the importance of using the design-build method through discussing a design project case study carried out by the Masters of Architecture design programme students at Beirut Arab University, who have built prototype units for refugees on a 1:1 scale.

Test Circuit Conditioning for Soft Defect Localization

2014 ◽  
Author(s):  
Kristopher D. Staller ◽  
Corey Goodrich
Keyword(s):  
Laser Beam ◽  
Failure Analysis ◽  
Signal Frequency ◽  
Dynamic Failure ◽  
The Third ◽  
Analysis Technique ◽  
Test Circuit ◽  
Defect Localization ◽  
Manual Input ◽  
Fast Dynamic

Abstract Soft Defect Localization (SDL) is a dynamic laser-based failure analysis technique that can detect circuit upsets (or cause a malfunctioning circuit to recover) by generation of localized heat or photons from a rastered laser beam. SDL is the third and seldom used method on the LSM tool. Most failure analysis LSM sessions use the endo-thermic mode (TIVA, XIVA, OBIRCH), followed by the photo-injection mode (LIVA) to isolate most of their failures. SDL is seldom used or attempted, unless there is a unique and obvious failure mode that can benefit from the application. Many failure analysts, with a creative approach to the analysis, can employ SDL. They will benefit by rapidly finding the location of the failure mechanism and forgoing weeks of nodal probing and isolation. This paper will cover circuit signal conditioning to allow for fast dynamic failure isolation using an LSM for laser stimulation. Discussions of several cases will demonstrate how the laser can be employed for triggering across a pass/fail boundary as defined by voltage levels, supply currents, signal frequency, or digital flags. A technique for manual input of the LSM trigger is also discussed.

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