A New Method for Evaluating Thermal Compatibility of Multi-Layer Dental Ceramic Composites

2007 ◽  
Vol 330-332 ◽  
pp. 1401-1404
Author(s):  
Jun Cui ◽  
Jun Ou ◽  
Yong Lie Chao ◽  
Q.P. Gao ◽  
Guang Fu Yin ◽  
...  
Keyword(s):  
Thermal Shock ◽  
Ceramic Materials ◽  
Ceramic Composites ◽  
New Method ◽  
Stepwise Multiple Regression ◽  
Thermal Shock Test ◽  
Dental Ceramics ◽  
Thermal Mismatch ◽  
Dental Ceramic ◽  
Thermal Compatibility

Dental ceramic materials do not always show linear expansion behavior. In general, thermal contraction behavior of dental porcelain can be described with the polynomial function: L/L= C+α1 T+α2 T2. In addition, a new method for taking into consideration of nonlinear contraction behavior of dental ceramics is proposed for calculating thermal mismatch value (α) between substrate and veneering materials. Discs of eight substrate/veneer combinations (n=10) were fabricated for thermal shock testing. In this study, a stepwise multiple regression analysis was performed to determine the relationship between thermal shock test results and thermal mismatch value (α) on these combinations. A high degree of correlation was found between αs-b and T. The new method proves to be a reliable one to predict thermal compatibility of multi-layer dental ceramic composites.

A New Method for Evaluating Thermal Compatibility of Multi-Layer Dental Ceramic Composites

2007 ◽  
pp. 1401-1404
Author(s):  
Jun Cui ◽  
Jun Ou ◽  
Yong Lie Chao ◽  
Q.P. Gao ◽  
Guang Fu Yin ◽  
...  
Keyword(s):  
Ceramic Composites ◽  
New Method ◽  
Dental Ceramic ◽  
Thermal Compatibility

Research on Dental Ceramic Grinding: A Review

2016 ◽  
Vol 693 ◽  
pp. 1106-1113
Author(s):  
Dan Na Zhao ◽  
Cheng Yong Wang ◽  
Xue Li Mao
Keyword(s):  
Cutting Tools ◽  
Surface Characteristics ◽  
Complex Surface ◽  
Ceramic Materials ◽  
Permanent Tooth ◽  
Grinding Force ◽  
Grinding Temperature ◽  
Dental Ceramics ◽  
Dental Ceramic ◽  
Ceramic Grinding

Dental ceramics has become dominant materials used in dental restorations. Dental ceramics have several advantages, such as stable performance, good bio-compatibility, little possibility to attach plaque, and similarity to the color of permanent tooth. However complex surface characteristics and hard and brittle properties of dental ceramic materials caused difficulties in the processing and subsequent grinding. The complicated craft and high failure rate of dental ceramics greatly limit its wide application in clinical. Thus, fully understanding the special cutting tools grinding performance and researching the material damage process caused by grinding temperature and grinding force are of great significance. Research on dental ceramic grinding was reviewed in this paper. The removal mechanism of dental ceramic materials and the influence of parameters settings on the grinding force, grinding temperature, and the surface quality have been studied. Besides the existing problems in dental ceramic grinding technology were pointed out.

scholarly journals Thermal Shock and Thermal Fatigue Study of Ceramic Materials on a Newly Developed Ascending Thermal Shock Test Equipment

2014 ◽  
pp. 5108-5114
Author(s):  
Prasanth Kumar Panda ◽  
T. S. Kannan ◽  
J. Dubois ◽  
Christian Olagnon ◽  
Gilbert Fantozzi
Keyword(s):  
Thermal Shock ◽  
Thermal Fatigue ◽  
Ceramic Materials ◽  
Test Equipment ◽  
Thermal Shock Test ◽  
Shock Test

Evaluation of Thermal Shock Resistance for Ceramic Materials by Young’s Modulus

2018 ◽  
Vol 766 ◽  
pp. 170-174
Author(s):  
Jun Arikawa ◽  
Takeshi Shiono
Keyword(s):  
Thermal Shock ◽  
Young’S Modulus ◽  
Temperature Difference ◽  
Thermal Shock Resistance ◽  
Fracture Stress ◽  
Young's Modulus ◽  
Ceramic Materials ◽  
Thermal Shock Test ◽  
Shock Test ◽  
Shock Resistance

When a sudden temperature difference is applied to a brittle material such as ceramics, some cracks will occur in the material and it may fracture in some case. The generated cracks as a fracture origin may cause the strength reduction, so the evaluation of thermal shock resistance is very important for ceramic materials. In the conventional evaluation of the thermal shock resistance (thermal shock fracture temperature, ΔTC), the fracture stress is measured after thermal shock test as a function of temperature difference. For this method, however, many specimens are required to estimate fracture stress by bending test and the variation of the stress is large. In the present study, we tried to specify the temperature of crack initiation by measuring Young's modulus and fracture stress before and after a thermal shock test with different temperature difference. Polycrystalline alumina with high purity was used for evaluation of thermal shock resistance. The Young's modulus of all specimens was measured by resonance method. The specimen at the prescribed temperature between 200°C and 600°C, it was quickly put into water to apply thermal shock. The Young's modulus of specimens after the test was measured and the change in Young's modulus before and after thermal shock test was evaluated. Further, the specimen after the evaluation was measured the fracture strength. As a result, it was found that Young's modulus is possible to estimate thermal shock resistance. Further it is also possible to evaluate thermal shock behaviors using only one specimen.

Degradation Behavior of TiN Coatings with Different Thicknesses after a Pulsed Laser Thermal Shock Test

2013 ◽  
Vol 51 (10) ◽  
pp. 729-734 ◽  
Author(s):  
Seol Jeon ◽  
Youngkue Choi ◽  
Hyun-Gyoo Shin ◽  
Hyun Park ◽  
Heesoo Lee ◽  
...  
Keyword(s):  
Thermal Shock ◽  
Pulsed Laser ◽  
Thermal Shock Test ◽  
Degradation Behavior ◽  
Shock Test ◽  
Tin Coatings

Dependence of the Deformation of 128×128 InSb Focal-plane Arrays on the Silicon Readout Integrated Circuit Thickness

2015 ◽  
Vol 9 (1) ◽  
pp. 170-174 ◽  
Author(s):  
Xiaoling Zhang ◽  
Qingduan Meng ◽  
Liwen Zhang
Keyword(s):  
Thermal Shock ◽  
Indium Antimonide ◽  
Integrated Circuit ◽  
Focal Plane ◽  
Three Dimensional ◽  
Fracture Probability ◽  
Focal Plane Arrays ◽  
Thermal Shock Test ◽  
Readout Integrated Circuit ◽  
Three Dimensional Modeling

The square checkerboard buckling deformation appearing in indium antimonide infrared focal-plane arrays (InSb IRFPAs) subjected to the thermal shock tests, results in the fracturing of the InSb chip, which restricts its final yield. In light of the proposed three-dimensional modeling, we proposed the method of thinning a silicon readout integrated circuit (ROIC) to level the uneven top surface of InSb IRFPAs. Simulation results show that when the silicon ROIC is thinned from 300 μm to 20 μm, the maximal displacement in the InSb IRFPAs linearly decreases from 7.115 μm to 0.670 μm in the upward direction, and also decreases linearly from 14.013 μm to 1.612 μm in the downward direction. Once the thickness of the silicon ROIC is less than 50 μm, the square checkerboard buckling deformation distribution presenting in the thicker InSb IRFPAs disappears, and the top surface of the InSb IRFPAs becomes flat. All these findings imply that the thickness of the silicon ROIC determines the degree of deformation in the InSb IRFPAs under a thermal shock test, that the method of thinning a silicon ROIC is suitable for decreasing the fracture probability of the InSb chip, and that this approach improves the reliability of InSb IRFPAs.

scholarly journals Phase Transition and Coefficients of Thermal Expansion in Al2−xInxW3O12 (0.2 ≤ x ≤ 1)

Materials ◽  
2021 ◽  
Vol 14 (14) ◽  
pp. 4021
Author(s):  
Andrés Esteban Cerón Cerón Cortés ◽  
Anja Dosen ◽  
Victoria L. Blair ◽  
Michel B. Johnson ◽  
Mary Anne White ◽  
...  
Keyword(s):  
Phase Transition ◽  
Thermal Expansion ◽  
Thermal Shock ◽  
Monoclinic Phase ◽  
Ceramic Materials ◽  
Precipitation Method ◽  
Scanning Calorimetry ◽  
Orthorhombic Crystal ◽  
Co Precipitation

Materials from theA2M3O12 family are known for their extensive chemical versatility while preserving the polyhedral-corner-shared orthorhombic crystal system, as well as for their consequent unusual thermal expansion, varying from negative and near-zero to slightly positive. The rarest are near-zero thermal expansion materials, which are of paramount importance in thermal shock resistance applications. Ceramic materials with chemistry Al2−xInxW3O12 (x = 0.2–1.0) were synthesized using a modified reverse-strike co-precipitation method and prepared into solid specimens using traditional ceramic sintering. The resulting materials were characterized by X-ray powder diffraction (ambient and in situ high temperatures), differential scanning calorimetry and dilatometry to delineate thermal expansion, phase transitions and crystal structures. It was found that the x = 0.2 composition had the lowest thermal expansion, 1.88 × 10−6 K−1, which was still higher than the end member Al2W3O12 for the chemical series. Furthermore, the AlInW3O12 was monoclinic phase at room temperature and transformed to the orthorhombic form at ca. 200 °C, in contrast with previous reports. Interestingly, the x = 0.2, x = 0.4 and x = 0.7 materials did not exhibit the expected orthorhombic-to-monoclinic phase transition as observed for the other compositions, and hence did not follow the expected Vegard-like relationship associated with the electronegativity rule. Overall, compositions within the Al2−xInxW3O12 family should not be considered candidates for high thermal shock applications that would require near-zero thermal expansion properties.

Analysis of the electrical characteristics and structure of Cu-Filled TSV with thermal shock test

2014 ◽  
Vol 10 (3) ◽  
pp. 649-653 ◽  
Author(s):  
Il Ho Jeong ◽  
Myong Hoon Roh ◽  
Flora Jung ◽  
Wan Ho Song ◽  
Michael Mayer ◽  
...  
Keyword(s):  
Thermal Shock ◽  
Thermal Shock Test ◽  
Electrical Characteristics ◽  
Shock Test
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