Effect of Electrochemical Reaction Enviroment on the Surface Morphology and Photoluminescence of Porous Silicon

2013 ◽  
Vol 737 ◽  
pp. 60-66
Author(s):  
Ali Syari’ati ◽  
Veinardi Suendo

Porous silicon (p-Si) is a well-known silicon based material that can emit visible light at room temperature. The radiative recombination that originated from quantum confinement effect shows photoluminescence (PL) in red, while the defect on silicon oxide at the surface of p-Si shows in blue-green region. Porous silicon can be synthesized through two methods; wet-etching and electrochemical anodization using hydrofluoric acid as the main electrolyte. The electrochemical anodization is more favorable due to faster etching rate at the surface than the conventional wet-etching method. The objective of this research is to show that both of porous silicons can be synthesized using the same main electrolyte but by varying the reaction environment during anodization/etching process. Here, we shows the wet-etching method that enhanced by polarization concentration will produce porous silicon with silicon oxide defects by means blue-green emission, while direct electrochemical anodization will produce samples that emit red PL signal. The effect of introducing KOH into the electrolyte was also studied in the case of enhanced-wet-etching method. Surface morphology of porous silicon and their photoluminescence were observed by Scanning Electron Microscope and PL spectroscopy, respectively.

1988 ◽  
Vol 131 ◽  
Author(s):  
Vivian Ryan ◽  
Gerald Smolinsky

ABSTRACTThis paper describes an analysis of the physical properties of the sol using several complementary light scattering techniques. Polymerization and aggregation kinetics were followed through time-dependent changes in the size, shape, and density of the sol particles. The sot growth rate was controlled by choice of solvent and silicon concentration. Changes in viscosity and pH were small during the reaction period. Three different particle-growth regimes exist in which either the particle density increased, decreased, or remained the same. The addition of boron, hydrofluoric acid, or water accelerated the reaction. The sol experimental data correlate with the density and wet-etching rate of the cured films. After curing, high-density films were obtained from sols with three common characteristics: an average particle diameter >450 Å, a relatively high polydispersity, and a low particle density. These criteria were generally satisfied by solutions one to two days old.


1988 ◽  
Vol 131 ◽  
Author(s):  
Gerald Smolinsky ◽  
Vivian Ryan

ABSTRACTHigh quality SiO2 films are obtained by spin-coating wafers with a sol/gel of silicic acid in either a 2, 3, or 4-carbon linear-aliphatic alcohol. Some properties of the deposited film depend upon the solvent: such as density, tensile stress, and infrared spectrum. However, Rutherford-back-scattering analysis indicates the O:Si ratio (2.00±05) to be independent of the solvent. The infrared spectrum of the oxide exhibits Si-OSi absorption in the range 1070–1080 cm.−1 depending on the curing temperature and solvent system. (The weaker Si-OSi band is found at 804–810 cm.−1) In addition, low-temperature-cured (<500 °C) films show Si–OH absorption. Films hot-plate baked at 150–350 °C are stable but not fully cured. Films from propanol baked at 400 °C have a refractive index of 1.41–1.42 and a wet-etching rate in 30:1 BOE of ˜1250 Å/min. Films cured at 900 °C have a refractive index of 1.42–1.43, a wet-etching rate of ˜430 A/min, and are more dense by a factor of ˜1.25. Dry-etching with CHF3/O2 occurs at rates comparable to those of CVD oxides. Multiple applications lead to crack-free films as thick as 0.6–0.8 μ m. Deposition over aluminum-patterned topography results in a smoothing of the surface and suppression of hillock growth in the aluminum even after a 450 °C cure. SOX adheres to silicon, aluminum, and silicon dioxide. A boron-doped SOX is readily prepared.


1992 ◽  
Vol 283 ◽  
Author(s):  
Toshimichi Ito ◽  
Toshimichi Ohta ◽  
Kenji Motoi ◽  
Osamu Arakaki ◽  
Akio Hiraki

ABSTRACTPorous silicon oxidized by thermal, anodic and plasma processes has been investigated mainly using transmission microscopy, ion scattering techniques for compositional depth analysis (including H) and photoluminescence (PL) measurements. Suitable thermal oxidation of PS can increases in PL peak energy: the largest peak energy attained in the present study is 2.6eV (475nm). In the case of anodic oxidation, PL excitation spectra measured suggest the presence of some effect other than the quantum confinement effect at the initial oxidation stage while the latter may be effective at the subsequent anodic oxidation stage and in the thermal oxidation process. Electroluminescence was also observed from the oxidized porous silicon.


1998 ◽  
Vol 536 ◽  
Author(s):  
Limarix Peraza ◽  
Madeline Cruz ◽  
Angel Estrada ◽  
Carlos Navarro ◽  
Javier Avalos ◽  
...  

AbstractThe luminescent properties of porous silicon (PSi) films in the visible region were used to improve the photoresponse of PSi/Si-wafer and PSi/Si p-n junctions UV detector prototypes in the region below 500nm. A luminescent PSi overlayer was formed on top of the Si wafers and p-n junctions by electrochemical anodization. These overlayers have emission spectra peaking close to 690nm. In the case of the PSi/Si wafer, the PSi film was produced with a high optical transparency above 600nm and highly absorbent below this value. With such characteristics, the incident UV radiation is partially absorbed and converted into visible radiation that can be highly transmitted through the PSi film and efficiently absorbed by the wafer or the junction. The UV measurements show enhancement of the photoresponse at 366nm as compared with control prototypes without PSi. Details about the enhancement process are discussed.


2007 ◽  
Vol 121-123 ◽  
pp. 669-672 ◽  
Author(s):  
Ze Wen Liu ◽  
Tian Ruo Zhang ◽  
Li Tian Liu ◽  
Zhi Jian Li

A first result of realization of silicon nitride templates on 100mm silicon wafer as nanoinprint mold using simple wet etching method is reported in this paper. The process is based on traditional photolithograph and following buffer HF wet etching, which started from a p-type wafer with 400nm thermal silicon oxide, 200nm PECVD silicon nitride and 400nm PECVD silicon oxide sandwich layer. After patterning with lithography, the patterned resist is used as mask for the isotropic underlayer wet etching of silicon dioxide with buffer HF solution. Using the obtained nanosacle silicon dioxide lines as RIE dry etching mask, silicon nitride template of 100nm width with steep sidewalls is successfully realized.


2015 ◽  
Vol 2015 ◽  
pp. 1-10 ◽  
Author(s):  
Tero Jalkanen ◽  
Anni Määttänen ◽  
Ermei Mäkilä ◽  
Jaani Tuura ◽  
Martti Kaasalainen ◽  
...  

A roll-to-roll compatible fabrication process of porous silicon (pSi) based sensing elements for a real-time humidity monitoring is described. The sensing elements, consisting of printed interdigitated silver electrodes and a spray-coated pSi layer, were fabricated on a coated paper substrate by a two-step process. Capacitive and resistive responses of the sensing elements were examined under different concentrations of humidity. More than a three orders of magnitude reproducible decrease in resistance was measured when the relative humidity (RH) was increased from 0% to 90%. A relatively fast recovery without the need of any refreshing methods was observed with a change in RH. Humidity background signal and hysteresis arising from the paper substrate were dependent on the thickness of sensing pSi layer. Hysteresis in most optimal sensing element setup (a thick pSi layer) was still noticeable but not detrimental for the sensing. In addition to electrical characterization of sensing elements, thermal degradation and moisture adsorption properties of the paper substrate were examined in connection to the fabrication process of the silver electrodes and the moisture sensitivity of the paper. The results pave the way towards the development of low-cost humidity sensors which could be utilized, for example, in smart packaging applications or in smart cities to monitor the environment.


2007 ◽  
Vol 556-557 ◽  
pp. 733-736 ◽  
Author(s):  
S. Takenami ◽  
Tomoaki Hatayama ◽  
Hiroshi Yano ◽  
Yukiharu Uraoka ◽  
Takashi Fuyuki

Sloped sidewalls in 4H-SiC mesa structures on the (000-1) C face were formed by a Cl2-O2 thermal etching method. The etching rate of 4H-SiC (000-1) C face was 10 times faster than that of (0001) Si face, and the etching rate at 910oC was about 18μm/h. The etched surface was rather smooth, and the sidewall of the mesa was inclined to the off-axis substrate. Taking into account the off angle of about 8o toward [11-20] off direction, the angles of the sidewalls were 52-56o for the <1-100> and 55-57o for the <11-20> directions from the crystallographically accurate (000-1) C face. Epitaxial pn junction diodes with the sloped sidewalls structure were fabricated, which had good electrical properties.


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