Analysis of Bonging Temperature and Interfacial Characterization of 3Y-TZP and SUS304 by Diffusion Bonding

2013 ◽  
Vol 750 ◽  
pp. 164-167
Author(s):  
Ming Zhao ◽  
Dong Ying Ju
Keyword(s):  
Residual Stress ◽  
Stainless Steel ◽  
Chemical Bonding ◽  
Diffusion Bonding ◽  
Electron Probe ◽  
Bonding Process ◽  
Electron Probe Micro Analyzer ◽  
Bonding Method ◽  
Xrd Method

This paper studies mainly the diffusion bonding of 3Y-TZP/SUS304 by using the chemical bonding method. In the bonding interface of 3Y-TZP and SUS304, the Ti-Cu powder/sheet was used as bonding materials. In bonding process, multi-alloy with Fe-Ti and Fe-Cu have been confirmed by Electron Probe Micro-Analyzer (EPMA) determination. Through the microstructure observed by AFM and SEM, bonding boundaries of 3Y-TZP/SUS304 by Ti-Cu powder/sheet had good formation. The distribution of the residual stress on near interface was measured by XRD method. By using of these results, the mechanism of the ceramic and stainless steel was discussed.

Diffusion Bonding of 3Y-TZP and SUS440 by Using of Ti-Cu Powder/Sheet

2011 ◽  
Vol 314-316 ◽  
pp. 957-962
Author(s):  
Dong Ying Ju ◽  
Ming Zhao
Keyword(s):  
Residual Stress ◽  
Stainless Steel ◽  
Chemical Bonding ◽  
Diffusion Bonding ◽  
Bonding Process ◽  
Bonding Interface ◽  
Brass Powder ◽  
Bonding Method ◽  
Xrd Method

This paper is mainly a study the diffusion bonding of 3Y-TZP/SUS440 by using the chemical bonding method. In the bonding interface of 3Y-TZP and SUS440, the Ti-Cu (brass) powder/sheet was used as bonding materials. After bonding process, multi-alloy field with Fe-Ti and Fe-Cu have been confirmed by EPMA determination. Through the microstructure observed by AFM and SEM, bonding boundaries of 3Y-TZP/SUS440 by Ti-Cu powder/sheet had good formation. The distribution of the residual stress on near interface was measured by XRD method. By using of these results, the mechanism of the ceramic and stainless steel was discussed.

Investigation of Bonding Interface and Strength Properties in Diffusion Bonding of MgAZ31/Al6061

2013 ◽  
Vol 750 ◽  
pp. 160-163
Author(s):  
Ming Zhao ◽  
Dong Ying Ju
Keyword(s):  
Magnesium Alloy ◽  
Aluminum Alloys ◽  
Diffusion Bonding ◽  
Strength Properties ◽  
Bonding Process ◽  
Bonding Interface ◽  
Al 6061 ◽  
Bonding Method ◽  
Xrd Method

This paper is mainly a study the diffusion bonding of Mg-AZ31/Al-6061 by using the direct bonding method. After bonding process, multilayer field with Mg-Zn and Al-Zn have been confirmed by EPMA determination. Through the microstructure observed by SEM, bonding boundaries of Mg-AZ31/Al-6061 had good diffusion formation. The identification of the component on near interface was measured by XRD method. By using of these results, the mechanism of the magnesium alloy and aluminum alloys was discussed.

scholarly journals Thermal Stress-Based Diffusion Bonding Method: the Case of Oxygen Free Copper to 316L Stainless Steel

2015 ◽  
Vol 56 (10) ◽  
pp. 1683-1687 ◽  
Author(s):  
Takashi Harumoto ◽  
Osamu Ohashi ◽  
Hiroki Tsushima ◽  
Miho Narui ◽  
Kensaku Aihara ◽  
...  
Keyword(s):  
Stainless Steel ◽  
Thermal Stress ◽  
Diffusion Bonding ◽  
316L Stainless Steel ◽  
Bonding Method

Diffusion Bonding of Mg-AZ31B/Al-6061 and Characteristics with Pressure and with no Pressure

2013 ◽  
Vol 834-836 ◽  
pp. 812-815
Author(s):  
Ming Zhao ◽  
Dong Ying Ju
Keyword(s):  
Solid Solution ◽  
Diffusion Bonding ◽  
Bonding Process ◽  
Bonding Mechanism ◽  
Al 6061 ◽  
Process Characteristics ◽  
Interface Characteristics ◽  
Aluminum Solid Solution ◽  
Crystal Model ◽  
Bonding Method

The study is diffusion bonding of Mg-AZ31 and Al-6061 under pressure and no pressure by using the direct bonding method. After bonding process, characteristics phase in interface and bonding boundaries of Mg-AZ31/Al-6061 were characterized . The diffusion formation was observed by SEM. Aluminum solid solution and Mg17Al12 alloy phase was proved by analysis of XRD. In the process of measurement, crystalline structure of nearby interface characteristics phase was analyzed in detail by TEM. Based on the above analysis, the crystal model of the magnesium alloy and aluminum alloys was established under pressure, and the bonding mechanism was discussed. The results show that the bonding materials could be bonded under no pressure and the structure of bonding interface is more optimized than pressure.

scholarly journals Characterization of the interface to diffusion bonding of zircaloy-4 and stainless steel

2009 ◽  
Vol 2 (3) ◽  
pp. 1231-1239 ◽  
Author(s):  
M. Taouinet ◽  
S. Lebaili ◽  
N. Souami
Keyword(s):  
Stainless Steel ◽  
Diffusion Bonding

scholarly journals Diffusion Bonding of Al–Fe Enhanced by Gallium

Processes ◽  
2020 ◽  
Vol 8 (7) ◽  
pp. 824
Author(s):  
Asmawi Ismail ◽  
Warda Bahanan ◽  
Patthi Bin Hussain ◽  
Asmalina Mohamed Saat ◽  
Nagoor Basha Shaik
Keyword(s):  
Mild Steel ◽  
Intermetallic Compounds ◽  
Diffusion Bonding ◽  
Xrd Analysis ◽  
Interface Layer ◽  
Bonding Process ◽  
Microstructural Development ◽  
Average Thickness ◽  
Interfacial Growth

In this research, diffusion bonding was carried out to produce transition joints between mild steel A36 (Fe A36) and aluminium Al 5083 (AA5083) with the presence of gallium (Ga) as an interlayer between the two faying surfaces. The microstructural development and interfacial growth of intermetallic compounds at the interface layer between Fe A36 and AA5083 after the diffusion bonding process were investigated. The joining was performed by clamping the two materials with a Ga interlayer and then heated in a furnace. The interlayer developed from this diffusion heating in air condition provides an average thickness of 30 μm. Characterization of intermetallic compounds was conducted using SEM-EDX and XRD. The results showed that SEM-EDX confirmed the occurrence of interdiffusion of elements from Fe A36 and AA5083 present at interlayer. XRD analysis reveals the formation of Fe3Al at the diffusion layer.

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