Characterization of composite laminate with copper and AISI304 made by a diffusion bonding process

2020 ◽  
Author(s):  
T. Vigraman
Keyword(s):  
Diffusion Bonding ◽  
Composite Laminate ◽  
Bonding Process

scholarly journals Diffusion Bonding of Al–Fe Enhanced by Gallium

Processes ◽  
2020 ◽  
Vol 8 (7) ◽  
pp. 824
Author(s):  
Asmawi Ismail ◽  
Warda Bahanan ◽  
Patthi Bin Hussain ◽  
Asmalina Mohamed Saat ◽  
Nagoor Basha Shaik
Keyword(s):  
Mild Steel ◽  
Intermetallic Compounds ◽  
Diffusion Bonding ◽  
Xrd Analysis ◽  
Interface Layer ◽  
Bonding Process ◽  
Microstructural Development ◽  
Average Thickness ◽  
Interfacial Growth

In this research, diffusion bonding was carried out to produce transition joints between mild steel A36 (Fe A36) and aluminium Al 5083 (AA5083) with the presence of gallium (Ga) as an interlayer between the two faying surfaces. The microstructural development and interfacial growth of intermetallic compounds at the interface layer between Fe A36 and AA5083 after the diffusion bonding process were investigated. The joining was performed by clamping the two materials with a Ga interlayer and then heated in a furnace. The interlayer developed from this diffusion heating in air condition provides an average thickness of 30 μm. Characterization of intermetallic compounds was conducted using SEM-EDX and XRD. The results showed that SEM-EDX confirmed the occurrence of interdiffusion of elements from Fe A36 and AA5083 present at interlayer. XRD analysis reveals the formation of Fe3Al at the diffusion layer.

Microstructural Characterization of Ti6Al4V-SiCf Composite Produced by New Roll-Bonding Process

2010 ◽  
Vol 89-91 ◽  
pp. 715-720 ◽  
Author(s):  
Paolo Deodati ◽  
Riccardo Donnini ◽  
Saulius Kaciulis ◽  
Alessio Mezzi ◽  
Roberto Montanari ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Rate Control ◽  
Diffusion Bonding ◽  
Hot Isostatic Pressing ◽  
Microstructural Characterization ◽  
Bonding Process ◽  
Roll Bonding ◽  
New Process ◽  
Superior Mechanical Properties

Roll Diffusion Bonding (RDB) is a new process, developed at C.S.M., for producing Ti composites reinforced by long fibres. The prototypal “diffusion bonding” plant permits to co-roll at high temperature in superplastic rolling field (under temperature and strain rate control) foils of titanium alloy and fabrics made of SiC monofilaments. This study evidenced that the Ti6Al4V-SiCf composite produced by roll-bonding exhibits superior mechanical properties with respect the same material prepared by Hot Isostatic Pressing (HIP) owing to the smaller grain size and the higher dislocation density.

Analysis of Bonging Temperature and Interfacial Characterization of 3Y-TZP and SUS304 by Diffusion Bonding

2013 ◽  
Vol 750 ◽  
pp. 164-167
Author(s):  
Ming Zhao ◽  
Dong Ying Ju
Keyword(s):  
Residual Stress ◽  
Stainless Steel ◽  
Chemical Bonding ◽  
Diffusion Bonding ◽  
Electron Probe ◽  
Bonding Process ◽  
Electron Probe Micro Analyzer ◽  
Bonding Method ◽  
Xrd Method

This paper studies mainly the diffusion bonding of 3Y-TZP/SUS304 by using the chemical bonding method. In the bonding interface of 3Y-TZP and SUS304, the Ti-Cu powder/sheet was used as bonding materials. In bonding process, multi-alloy with Fe-Ti and Fe-Cu have been confirmed by Electron Probe Micro-Analyzer (EPMA) determination. Through the microstructure observed by AFM and SEM, bonding boundaries of 3Y-TZP/SUS304 by Ti-Cu powder/sheet had good formation. The distribution of the residual stress on near interface was measured by XRD method. By using of these results, the mechanism of the ceramic and stainless steel was discussed.

Characterization of Interfacial Adhesion of Cu-Cu Bonding Fabricated by Thermo-Compression Bonding Process

2010 ◽  
Vol 34 (7) ◽  
pp. 929-933
Author(s):  
Kwang-Seop Kim ◽  
Hee-Jung Lee ◽  
Hee-Yeoun Kim ◽  
Jae-Hyun Kim ◽  
Seung-Min Hyun ◽  
...  
Keyword(s):  
Interfacial Adhesion ◽  
Bonding Process ◽  
Cu Bonding

In Situ Characterization of NiTi/Ti6Al4V Joints During Reaction-Assisted Diffusion Bonding Using Ni/Ti Multilayers

2014 ◽  
Vol 23 (5) ◽  
pp. 1625-1629 ◽  
Author(s):  
A. J. Cavaleiro ◽  
A. S. Ramos ◽  
F. M. Braz Fernandes ◽  
N. Schell ◽  
M. T. Vieira
Keyword(s):  
Diffusion Bonding ◽  
In Situ Characterization

Reliability and Characterization of Micro-Packages in a Wafer Level Au-Si Eutectic Vacuum Bonding Process

2005 ◽  
Author(s):  
Jay S. Mitchell ◽  
Gholamhassan R. Lahiji ◽  
Khalil Najafi
Keyword(s):  
High Sensitivity ◽  
Pressure Change ◽  
Bonding Process ◽  
Wafer Level ◽  
Eutectic Solder ◽  
Packaging Process ◽  
Primary Mechanism ◽  
Airtight Seal ◽  
Over Time

A Au-Si eutectic vacuum packaging process was evaluated using high sensitivity poly-Si Pirani vacuum sensors. Encapsulation of devices was achieved by bonding a silicon cap wafer to a device wafer using a Au-Si eutectic solder at above 390°C in a vacuum bonder. The Au-Si eutectic solder encircled the devices, providing an airtight seal. The Pirani gauges were encapsulated and tested over a period of several months in order to determine base pressures and leak/outgassing rates of the micro-cavities. Packaged devices without getters showed initial pressures from 2 to 12 Torr with initial leak/outgassing rates of −0.073 to 80 Torr/year. Using getters, pressures as low as 5 mTorr have been achieved with leak/outgassing rates of <10 mTorr/year. Trends in pressure over time seem to indicate outgassing (desorption of atoms from inside of the microcavity) as the primary mechanism for pressure change over time.

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